AU2001234722A1 - Concentrically leaded power semiconductor device package - Google Patents

Concentrically leaded power semiconductor device package

Info

Publication number
AU2001234722A1
AU2001234722A1 AU2001234722A AU3472201A AU2001234722A1 AU 2001234722 A1 AU2001234722 A1 AU 2001234722A1 AU 2001234722 A AU2001234722 A AU 2001234722A AU 3472201 A AU3472201 A AU 3472201A AU 2001234722 A1 AU2001234722 A1 AU 2001234722A1
Authority
AU
Australia
Prior art keywords
semiconductor device
power semiconductor
device package
concentrically
leaded power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234722A
Inventor
Ban Poh Loh
Wayne L. Snyder
Douglas P. Woolverton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds LLC filed Critical Lumileds LLC
Publication of AU2001234722A1 publication Critical patent/AU2001234722A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
AU2001234722A 2000-02-04 2001-01-31 Concentrically leaded power semiconductor device package Abandoned AU2001234722A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09498311 2000-02-04
US09/498,311 US6492725B1 (en) 2000-02-04 2000-02-04 Concentrically leaded power semiconductor device package
PCT/US2001/003270 WO2001057937A1 (en) 2000-02-04 2001-01-31 Concentrically leaded power semiconductor device package

Publications (1)

Publication Number Publication Date
AU2001234722A1 true AU2001234722A1 (en) 2001-08-14

Family

ID=23980514

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234722A Abandoned AU2001234722A1 (en) 2000-02-04 2001-01-31 Concentrically leaded power semiconductor device package

Country Status (7)

Country Link
US (2) US6492725B1 (en)
EP (1) EP1183740B1 (en)
JP (1) JP4833418B2 (en)
KR (1) KR100776060B1 (en)
AU (1) AU2001234722A1 (en)
DE (1) DE60140841D1 (en)
WO (1) WO2001057937A1 (en)

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US7292209B2 (en) * 2000-08-07 2007-11-06 Rastar Corporation System and method of driving an array of optical elements
JP2002223007A (en) * 2000-11-22 2002-08-09 Matsushita Electric Ind Co Ltd Light source unit and semiconductor light emitting illumination device using the same
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
JP4701565B2 (en) * 2001-09-05 2011-06-15 パナソニック株式会社 Light source unit mounting structure
JP2005513815A (en) * 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 Light emitting diode and light emitting diode lamp
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
US6573536B1 (en) * 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
KR101047246B1 (en) * 2002-07-25 2011-07-06 조나단 에스. 담 Method and apparatus for using curing LED
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
DE10251955A1 (en) * 2002-11-08 2004-05-19 Hella Kg Hueck & Co. High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
DE10346855A1 (en) * 2003-08-18 2005-03-17 Robert Bosch Gmbh Press-fit diode with silver-plated wire connection
CN1906773A (en) * 2004-01-29 2007-01-31 Acol技术公司 Light emitting diode with integral heat dissipation means
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
MXPA06014522A (en) * 2004-06-15 2007-03-23 Henkel Corp High power led electro-optic assembly.
JP2006080288A (en) * 2004-09-09 2006-03-23 Stanley Electric Co Ltd Led mount component and manufacturing method thereof
US20060146533A1 (en) * 2005-01-03 2006-07-06 Wen-Chieh Chen Illuminating device for projector
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
JP4606302B2 (en) * 2005-01-27 2011-01-05 京セラ株式会社 Light emitting device
US7598600B2 (en) * 2005-03-30 2009-10-06 Stats Chippac Ltd. Stackable power semiconductor package system
US7557432B2 (en) * 2005-03-30 2009-07-07 Stats Chippac Ltd. Thermally enhanced power semiconductor package system
JP4991173B2 (en) * 2005-04-27 2012-08-01 京セラ株式会社 Light-emitting element mounting substrate and light-emitting device using the same
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
TWI287882B (en) * 2005-07-06 2007-10-01 Jiahn-Chang Wu Light emitting device package with single coaxial lead
JPWO2007018098A1 (en) * 2005-08-05 2009-02-19 オリンパスメディカルシステムズ株式会社 Light emitting unit
TWI266428B (en) * 2005-08-30 2006-11-11 Quarton Inc Semiconductor chip package and application device thereof
DE102005045729A1 (en) * 2005-09-23 2007-03-29 Karl Storz Gmbh & Co. Kg Illumination system for endoscopic examinations
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
CN101030611B (en) * 2006-03-05 2010-05-12 浙江古越龙山电子科技发展有限公司 Large-power light-emitting diodes gluing process
CN100454536C (en) * 2006-04-11 2009-01-21 方础光电科技股份有限公司 Semiconductor chip encapsulation structure and its application device
DE102007037821A1 (en) * 2007-08-10 2009-02-12 Osram Gesellschaft mit beschränkter Haftung light module
US8492179B2 (en) * 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
GB2485745B (en) * 2009-09-27 2013-11-20 Dongguan Light Source Opto Tech Co Ltd LED device for three-dimensional illumination
DE102009049683B4 (en) * 2009-10-19 2016-06-09 Richard Wolf Gmbh Endoscopic instrument
DE102013201808A1 (en) * 2013-02-05 2014-08-07 Richard Wolf Gmbh LED lighting module
CN114341545A (en) 2019-07-08 2022-04-12 亮锐控股有限公司 Support for light emitting elements and lighting devices
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

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Also Published As

Publication number Publication date
KR100776060B1 (en) 2007-11-16
KR20020005640A (en) 2002-01-17
DE60140841D1 (en) 2010-02-04
EP1183740A1 (en) 2002-03-06
JP2001257301A (en) 2001-09-21
US20030006423A1 (en) 2003-01-09
WO2001057937A1 (en) 2001-08-09
EP1183740B1 (en) 2009-12-23
US6492725B1 (en) 2002-12-10
JP4833418B2 (en) 2011-12-07

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