JP4701565B2 - Mounting structure of the light source unit - Google Patents

Mounting structure of the light source unit Download PDF

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Publication number
JP4701565B2
JP4701565B2 JP2001268477A JP2001268477A JP4701565B2 JP 4701565 B2 JP4701565 B2 JP 4701565B2 JP 2001268477 A JP2001268477 A JP 2001268477A JP 2001268477 A JP2001268477 A JP 2001268477A JP 4701565 B2 JP4701565 B2 JP 4701565B2
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Prior art keywords
light source
source unit
mounting
sleeve
mounting structure
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JP2003078174A (en
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登美男 井上
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パナソニック株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16135Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、LEDを利用した半導体発光による照明装置に係り、特に放熱性をよくし大電流の印加を可能として高輝度の発光が得られるようにした光源ユニットの装着構造に関する。 The present invention relates to a lighting device according to the semiconductor light emitting utilizing LED, more particularly the mounting structure of the light source unit so as to light emission is obtained with high brightness as possible well by applying a large current heat dissipation.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
従来から発光ダイオード(LED)を利用したさまざまな半導体発光装置が開発されている。 Conventional light emitting diode (LED) various semiconductor light-emitting device utilizing have been developed. この半導体発光装置の中で最も典型的なものは砲弾型のランプ状としたものと表面実装用のチップ型としたものであり、図4にランプ状の半導体発光装置の従来例を示す。 The most typical ones among the semiconductor light emitting device is for the chip-type and one for surface mounting a bullet-shaped ramp shape, showing a conventional example of a lamp-shaped semiconductor light emitting device in FIG.
【0003】 [0003]
図4において、二股状のリードフレーム51の一方のリード51aの上端にマウント部51bを形成し、このマウント部51bの上にサブマウント素子52を介してフリップチップ型の半導体発光素子53が導通接続されている。 4, the mounting portion 51b formed on the upper end of one lead 51a of the bifurcated lead frame 51, a flip-chip type semiconductor light emitting element 53 is electrically connected via a submount 52 on the mount portion 51b It is. サブマウント素子52はたとえば静電気保護素子であり、下面にマウント部51bに導通させるための電極52aを形成し、上面の電極にはワイヤ54をリード51cとの間にボンディングしている。 Submount 52 is the electrostatic protection element, for example, to form the electrodes 52a for conducting the mount portion 51b on the lower surface, the electrodes of the top surface are bonded between the leads 51c wires 54. そして、ワイヤ54を含めてリードフレーム51の上端はエポキシの樹脂パッケージ55によって封止されている。 An upper end of the lead frame 51 including a wire 54 is sealed by the resin package 55 of epoxy.
【0004】 [0004]
リードフレーム51を介して半導体発光素子53に通電すると、半導体発光素子53の基板に積層した化合物半導体の活性層から発光する。 When applying current to the semiconductor light emitting element 53 via the lead frame 51, emitted from the compound semiconductor of the active layer laminated on the substrate of the semiconductor light emitting element 53. この通電の際には、半導体発光素子53が発熱する。 During this energization, the semiconductor light emitting element 53 generates heat.
【0005】 [0005]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
ところが、半導体発光素子53からの発熱は樹脂パッケージ55やリードフレーム51側に熱伝達されるが、樹脂パッケージ55の放熱性は低く、半導体発光素子53を搭載しているリード51aへの熱伝達量も少ない。 However, although heat generated from the semiconductor light emitting element 53 is thermally transferred to the resin package 55 and the lead frame 51 side, heat radiation of the resin package 55 is low, the amount of heat transfer to the lead 51a mounted with the semiconductor light emitting element 53 even less. 特に、半導体発光素子53がサファイアを基板としてGaN系化合物半導体を積層した青色発光のものでは、サファイアの基板の熱伝導率が低いので放熱性は格段に低い。 In particular, those semiconductor light emitting element 53 is blue light emission formed by laminating GaN based compound semiconductor sapphire as the substrate, heat radiation since the thermal conductivity of the sapphire substrate is low is much lower. また、サブマウント素子52にSiを用いることにより、これを経由した熱の流れはよくなるが、リードフレーム51が細いので結果的に放熱性は悪くなる。 Further, by using the Si submount element 52, it becomes better heat flow passing through it, resulting in heat dissipation since the lead frame 51 is thin becomes worse.
【0006】 [0006]
このように従来の半導体発光装置では、半導体発光素子53から発生する熱の放熱性が低いので、現状では20mA程度の電流しか印加できない。 In this way, the conventional semiconductor light emitting device, because of the low heat dissipation of the heat generated from the semiconductor light emitting element 53 can only apply 20mA current of about at present. これよりも大きな電流を印加すると半導体発光素子53の温度が上昇し、流す電流に比例して発光輝度が増加せず飽和してしまうし、特性が劣化して発光輝度が低下してしまう。 The application of a current larger than this temperature rise of the semiconductor light emitting element 53, to become saturated without increasing the light emission luminance in proportion to the current flowing characteristics is deteriorated emission luminance decreases. したがって、半導体発光素子53には小さな電流しか印加できず、その発光輝度にも限界がある。 Accordingly, it can only apply a small current to the semiconductor light emitting element 53, there is a limit to the emission intensity. このため、たとえば植物栽培用の光源や照明用の光源として利用しようとする場合では、多数の半導体発光装置を備える必要があり、光源装置が複雑になるとともにコストも高くなるという問題がある。 Thus, for example, in the case to be used as a light source of the light source and lighting for plant cultivation, it is necessary to provide a large number of semiconductor light-emitting device, the light source device has a problem that the higher the cost with complicated. また、半導体発光素子の発熱をリードフレームに移動できたとしても、リードフレームから電源側に放熱する必要がある。 Also, the heat generated by the semiconductor light-emitting device as could be moved to the lead frame, it is necessary to heat radiation from the lead frame to the power supply side.
【0007】 [0007]
そこで、本発明は、半導体発光素子の放熱を促し大電流印加による高輝度化が可能な光源ユニットの装着構造を提供することを目的とする。 Accordingly, an object of the present invention is to provide a mounting structure of high luminance capable source unit by a large current applied encourage heat dissipation of the semiconductor light emitting element.
【0008】 [0008]
【課題を解決するための手段】 In order to solve the problems]
本発明は、内側に放熱ブロックを、外側にスリーブを熱伝達可能に設けた光源ユニットの装着構造であって、嵌入する放熱ブロックを半径方向内側に付勢して固定する付勢部材を有しているので、放熱ブロックの軸方向位置によって付勢力が変わらないので、放熱ブロックを壁部に安定して保持し、熱の流れがスムーズになる。 The present invention is a heat sink block on the inside, a sleeve on the outside a mounting structure of a light source unit provided in a heat-transferable, has a biasing member for fixing the heat sink block to fit to bias radially inward since it has, so does not change the biasing force by the axial position of the heat sink block, a heat sink block stably held to the wall, the heat flow becomes smooth.
【0009】 [0009]
この発明によれば、半導体発光素子の放熱を促し大電流印加による高輝度化が可能な光源ユニットの装着構造が得られる。 According to the invention, mounting structure of high luminance capable source unit by a large current applied encourage heat dissipation of the semiconductor light-emitting device can be obtained.
【0010】 [0010]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
請求項1記載の発明は、内側に第1の電極になる放熱ブロックを設け、前記放熱ブロックの先部外側に絶縁膜を挟んで第2の電極になるスリーブを熱伝達可能に設け、取り付けられた半導体発光素子に通電可能な光源ユニットの装着構造であって、金属製の壁部に絶縁体を介して設けられ、前記スリーブが嵌入可能な取付孔が形成された取付板と、前記壁部に形成され前記取付孔に連通する取付凹部と、前記取付凹部の周壁に設けられ、嵌入する前記放熱ブロックを半径方向内側に付勢して固定する付勢部材と、前記取付孔の周壁に設けられ、嵌入する前記スリーブを固定する固定部とを有することを特徴とする光源ユニットの装着構造なので、付勢部材が放熱ブロックを側方から押圧することになり、付勢部材の軸方向位置によらず均一な First aspect of the present invention, the heat sink block comprising a first electrode on the inside is provided, providing a sleeve made in the second electrode across the tip portion outside the insulating layer of the heat sink block to be heat transfer, attached and a mounting structure of a semiconductor light-emitting element energizable light source unit, the wall portion of the metal is provided via an insulator, and a mounting plate which the sleeve attachment hole fitted is formed, the wall portion a mounting recess communicating with said mounting hole formed in, provided on the peripheral wall of the mounting recess, and a biasing member for fixing to urge the heat sink block radially inwardly to fit, provided on the peripheral wall of the mounting hole It is, since the mounting structure of the light source unit and having a fixing portion for fixing the sleeve to fit, will be urging member presses the heat sink block from the side, in the axial position of the urging member Yorazu uniform で放熱ブロックを保持することができる。 In can hold the heat sink block.
【0011】 [0011]
請求項2記載の発明は、前記スリーブの外周には雄ねじが形成され、前記固定部は前記雄ねじに螺合する雌ねじであることを特徴とする請求項1記載の光源ユニットの装着構造なので、光源ユニットの抜け落ちを防止して、確実に固定することができる。 According to a second aspect of the invention, the outer periphery of the sleeve external thread is formed, since the fixed portion is a mounting structure of a light source unit according to claim 1, characterized in that the internal thread to be screwed to the external thread, the light source to prevent falling off of the unit, it can be reliably fixed.
【0012】 [0012]
請求項3記載の発明は、前記付勢部材は、屈曲した中間部が先側に突出する板ばねであって、複数設けられていることを特徴とする請求項1又は2記載の光源ユニットの装着構造であり、光源ユニットを先側から嵌入させようとすると、放熱ブロックの先端が板ばねに当接、摺動しながら徐々に大きな力を受けるので、取付時に必要な力の変化を小さくして容易に取り付けることができる。 According to a third aspect of the invention, the biasing member includes an intermediate portion that is bent is a plate spring projecting the front side, of the light source unit according to claim 1 or 2 further characterized in that provided with a plurality a mounting structure, if an attempt is fitted to the light source unit from the front side, the tip of the heat sink block is subjected to gradual large force contact, while sliding on the leaf spring, to reduce the change in the force required during installation It can be easily attached Te.
【0013】 [0013]
請求項4記載の発明は、前記固定部は嵌入する前記スリーブを半径方向内側に付勢して固定する先部付勢部材であることを特徴とする請求項1記載の光源ユニットの装着構造であり、光源ユニットの軸方向の2カ所を半径方向に固定して容易に着脱することができる。 Fourth aspect of the present invention, in mounting structure of the light source unit of claim 1, wherein the fixing portion is a tip portion urging member for fixing to urge the sleeve radially inwardly to fit There, it can be easily attached and detached by fixing the two locations in the axial direction of the light source unit in the radial direction.
【0014】 [0014]
(第1実施形態) (First Embodiment)
図1は本発明の第1の実施の形態に係る光源ユニットの装着構造の縦断面図である。 Figure 1 is a longitudinal sectional view of a mounting structure of a light source unit according to a first embodiment of the present invention. まず、光源ユニット11について説明する。 First, a description is given of a light source unit 11.
【0015】 [0015]
光源ユニット11は、GaN系化合物半導体をサファイア基板に積層した青色発光の4台の半導体発光素子1の表面をたとえば(Y,Gd) 3 (Al,Ga) 512 :Ce等の蛍光物質を含む樹脂パッケージで封止した光源を備えたものである。 The light source unit 11, the four surfaces of the semiconductor light emitting element 1 of the blue light-emitting obtained by laminating GaN based compound semiconductor on a sapphire substrate, for example (Y, Gd) 3 (Al , Ga) 5 O 12: a fluorescent substance such as Ce those having a sealed source in the resin package including. このように青色発光の半導体発光素子1を蛍光物質を含む樹脂パッケージで封止することにより、半導体発光素子1からの光が波長変換されて白色発光として取り出される。 By thus encapsulating the semiconductor light-emitting device 1 of the blue light-emitting resin package including a fluorescent substance, the light from the semiconductor light emitting element 1 is taken out as a white light emission is wavelength-converted.
【0016】 [0016]
4台の半導体発光素子1は静電気保護用のツェナーダイオードなどを利用したサブマウント素子2にそれぞれ導通搭載されている。 Four semiconductor light emitting element 1 is conductively mounted respectively on the sub-mount element 2 using such zener diode for ESD protection. このサブマウント素子2は熱伝導のよいSiから成り、図示のように放熱ブロック3の上端にAgペーストを介して導通搭載されている。 The submount element 2 consists good Si thermal conductivity, is conductively mounted to the upper end of the heat sink block 3 as shown through the Ag paste. この放熱ブロック3はAlやAgやCuまたはこれらの金属を少なくとも1つ含む合金等のように熱伝導率の高い金属を素材としたもので、下端部を除く外周には絶縁膜4を介して円筒状の金属のスリーブ5を放熱ブロック3に対して熱伝達可能に外挿している。 The heat sink block 3 is obtained by a material having high thermal conductivity metal as alloys containing at least one of Al, Ag and Cu or these metals, the outer periphery except for the lower end portion through the insulating film 4 and extrapolation to enable heat transfer relative to the sleeve 5 of the cylindrical metal heat sink block 3. このスリーブ5は外周に雄ねじ5aを形成したもので、各サブマウント素子2との間をワイヤ2aによってボンディングしている。 The sleeve 5 is made by forming a male screw 5a on the outer circumference, and between the submount 2 are bonded by a wire 2a. なお、放熱ブロック3は半導体発光素子1のp側電極と導通する第1の電極になり、スリーブ5は半導体発光素子1のn側電極と導通する第2の電極になる。 Incidentally, the heat sink block 3 becomes a first electrode which conducts the p-side electrode of the semiconductor light emitting element 1, the sleeve 5 becomes a second electrode conducted to the n-side electrode of the semiconductor light emitting element 1.
【0017】 [0017]
また、放熱ブロック3及びスリーブ5の上端には、半導体発光素子1及びワイヤ2aを含んで封止するエポキシの樹脂パッケージ6が一体化されている。 Further, the upper end of the heat sink block 3 and the sleeve 5, the resin package 6 of epoxy for sealing includes a semiconductor light emitting element 1 and the wires 2a are integrated.
【0018】 [0018]
次に光源ユニットの装着構造Aについて説明する。 It will now be described mounting structure A of the light source unit.
【0019】 [0019]
光源ユニット11は金属製の壁部12に取り付けられる。 The light source unit 11 is attached to the wall portion 12 of the metal. 壁部12は導電性を有し、少なくとも一部(例えば上部)に平面を備え、平面には放熱ブロック3より外径が大きい取付凹部16が形成されている。 Wall 12 is electrically conductive, provided the plane on at least a portion (e.g. the top), the mounting recess 16 having a larger outer diameter is formed from the heat sink block 3 are flat.
【0020】 [0020]
壁部12の上部には、取付凹部16に重合する孔部を備えた絶縁体13が設けられ、絶縁体13の上部には、取付凹部16に連通する取付孔14を備え、導電性を有する取付板15が設けられている。 The top of the wall portion 12, the insulator 13 having a hole which polymerize mounting recess 16 is provided in the upper part of the insulator 13 includes a mounting hole 14 communicating with the mounting recess 16, a conductive mounting plate 15 is provided. 取付孔14の周壁には、スリーブ5の雄ねじ5aに螺合する固定部の一例である雌ねじ17が形成されている。 The peripheral wall of the mounting hole 14 an internal thread 17 are formed, which is an example of a fixing part screwed to the external thread 5a sleeve 5.
【0021】 [0021]
取付凹部16の周壁の対向する2箇所以上には、付勢部材の一例である板ばね18が設けられている。 More than two positions facing the peripheral wall of the mounting recess 16, the leaf spring 18 is provided as an example of the urging member. それぞれの板ばね18は、屈曲した中間部が先側に突出する逆V字状又は逆U字状に形成され、嵌入する放熱ブロック3を半径方向内側に付勢して固定することができる。 Each of the plate spring 18, an intermediate portion which is bent is formed in the reverse V-shaped or inverted U-shape protruding on the front side, it is possible to fix the heat sink block 3 that fits in biased radially inwardly.
【0022】 [0022]
光源ユニット11を壁部12に取り付ける時には、まず、放熱ブロック3を取付孔14に挿通させ、取付凹部16に少し嵌入させる。 When mounting the light source unit 11 in the wall 12, first, the heat sink block 3 is inserted into the mounting hole 14, it is slightly fitted in the mounting recess 16. 次いで、スリーブ5の雄ねじ5aを取付孔14の雌ねじ17に螺合させる。 Then, screwing the male screw 5a of the sleeve 5 into the internal thread 17 of the mounting hole 14. このとき、放熱ブロック3は、回転しながら取付凹部16の底部に向かって徐々に移動し、当接する板ばね18から半径方向内側に向かって付勢される。 At this time, the heat sink block 3 gradually moves towards the bottom of the mounting recess 16 while rotating, is urged from contact with the plate spring 18 radially inwardly. このようにして取付を行うことによって、壁部12は、板ばね18を介して放熱ブロック3に通電可能に接続し、取付板15は、スリーブ5に通電可能に接続される。 By performing attached this way, the wall portion 12 via the leaf spring 18 and conductively connected to the heat sink block 3, the mounting plate 15 is conductively connected to the sleeve 5.
【0023】 [0023]
板ばね18は放熱ブロック3を半径方向内側に付勢するので、放熱ブロック3が所定位置より取付凹部16の底側に移動しすぎても、塑性変形することがなく、付勢力を一定にして通電状態を安定的に保持すると共に板ばねの寿命を長くすることができる。 Since the plate spring 18 biases the heat sink block 3 radially inward, also the heat dissipation block 3 too moved to the bottom side of the mounting recess 16 from the predetermined position, without plastic deformation, and a biasing force constant the energized state can increase the life of the leaf spring holds stably. また、放熱ブロック3を取付凹部16の底部に当接させることができるので、放熱ブロック3から壁部12への放熱を効率よく行うことができる。 Further, the heat sink block 3 can be made to abut against the bottom of the mounting recess 16, it is possible to perform efficiently the heat radiation of the wall portion 12 from the heat sink block 3.
【0024】 [0024]
(第2実施形態) (Second Embodiment)
図2は本発明の第2の実施の形態に係る光源ユニットの装着構造の縦断面図である。 Figure 2 is a longitudinal sectional view of a mounting structure of a light source unit according to a second embodiment of the present invention. 装着構造Bは、前述した装着構造Aで用いたねじ結合の代わりに付勢手段による結合方式を用いたもので、その他の同一部材については同一番号を付して説明は省略する。 Mounting structure B, those with coupling scheme by the biasing means, instead of the screw connection used in mounting structure A described above, the description of those same numbers for other same members will be omitted.
【0025】 [0025]
光源ユニット19は、スリーブ5の雄ねじ5aを省略した円筒形のスリーブ20を有している。 The light source unit 19 includes a cylindrical sleeve 20 which is omitted male screw 5a of the sleeve 5. また、取付板21の取付孔22には雌ねじ17が形成されておらず、スリーブ20の外径より大きな周壁には、板ばね18と同形状の先部付勢部材の一例である板ばね23が設けられている。 Also, no internal thread 17 is formed in the mounting hole 22 of the mounting plate 21, the larger wall than the outer diameter of the sleeve 20, the plate spring 23 is an example of a front portion biasing member between the plate spring 18 same shape It is provided.
【0026】 [0026]
光源ユニット19を壁部12に取り付ける時には、まず、放熱ブロック3を取付孔22に挿通させ、取付凹部16に少し嵌入させる。 When mounting the light source unit 19 in the wall 12, first, the heat sink block 3 is inserted into the mounting hole 22, is slightly fitted in the mounting recess 16. このとき、放熱ブロック3は、板ばね18に当接し、スリーブ20は板ばね23に当接する。 At this time, the heat sink block 3 is in contact with the leaf spring 18, the sleeve 20 abuts the leaf spring 23. 次に、光源ユニット19を取付凹部16の底部に向けて押圧すると、放熱ブロック3及びスリーブ20は、当接する板ばね18,23から半径方向内側に向かって付勢される。 Next, when pressed toward the light source unit 19 on the bottom of the mounting recess 16, the heat sink block 3 and the sleeve 20 is biased from contact with the plate spring 18 and 23 radially inward.
【0027】 [0027]
このようにして取付を行うことによって、壁部12は、板ばね18を介して放熱ブロック3に通電可能に接続し、取付板21は、板ばね23を介してスリーブ20に通電可能に接続される。 By performing attached this way, the wall portion 12 via the leaf spring 18 and conductively connected to the heat sink block 3, the mounting plate 21 is conductively connected to the sleeve 20 through the leaf spring 23 that. 光源ユニット19を回転させずに軸方向に移動することができるので、放熱ブロック及びスリーブの外形を断面円形に限らず任意の形状に形成することができ、例えば、正方形や六角形に形成することができ、また、外周に突起部等を設けて取付の向きを規制することもできる。 Since the light source unit 19 can be moved without being rotated in the axial direction, the outer shape of the heat sink block and the sleeve can be formed into any shape not limited to the circular cross section, for example, be a square or a hexagon It can be, also possible to regulate the mounting direction is provided a protrusion or the like on the outer periphery. また、取付凹部16及び取付孔22の周壁には、放熱ブロック3及びスリーブ5の半径方向への位置ずれを防止する板状突起を設けることも可能である。 Further, the peripheral wall of the mounting recess 16 and the mounting hole 22, it is also possible to provide a plate-shaped projection to prevent displacement in the radial direction of the heat sink block 3 and the sleeve 5. さらに絶縁体24を硬質の板状部材で形成し、取付凹部16及び取付孔22に連通する貫通孔の大きさを、放熱ブロック3を位置決めしながら嵌入可能な大きさに形成することも可能である。 Further an insulator 24 formed of a plate-shaped member of a rigid, the size of the through hole communicating with the mounting recess 16 and the mounting hole 22, forming the fitting can size while positioning the heat sink block 3 is also possible is there.
【0028】 [0028]
(第3実施形態) (Third Embodiment)
図3は本発明の第3の実施の形態に係る光源ユニットの装着構造の縦断面図である。 Figure 3 is a longitudinal sectional view of a mounting structure of a light source unit according to a third embodiment of the present invention. 装着構造Cは、前述した装着構造Bの放熱ブロックと壁部の固定に用いた付勢手段の代わりにねじ結合を用いたもので、その他の同一部材については同一番号を付して説明は省略する。 Mounting structure C is intended with threaded connection instead of the biasing means used for fixation of the heat sink block and the wall portion of the mounting structure B described above, the description of those same numbers for other identical members omitted to.
【0029】 [0029]
光源ユニット29の放熱ブロック25の基部には雄ねじ26が形成され、壁部27には雄ねじ26に螺合する雌ねじ28が形成されている。 The base of the heat sink block 25 of the light source unit 29 external thread 26 is formed, the wall portion 27 are formed female screw 28 screwed to the external thread 26.
【0030】 [0030]
かかる構成によって、放熱ブロック25と壁部27の接触面積が広くなり、放熱がさらに大きくなる。 With this construction, the contact area of ​​the heat sink block 25 and the wall portion 27 is widened, the heat dissipation is further increased.
【0031】 [0031]
【発明の効果】 【Effect of the invention】
本発明では、取付凹部の周壁に設けられ、嵌入する前記放熱ブロックを半径方向内側に付勢して固定する付勢部材を有しているので、付勢部材が放熱ブロックを側方から押圧することになり、付勢部材の軸方向位置によらず均一な力で放熱ブロックを保持することができ、また、付勢部材の大きな変形を防止して装置寿命を長くすることができる。 In the present invention, is formed in the peripheral wall of the mounting recess, since it has a biasing member for fixing to urge the heat sink block radially inwardly to fit, the biasing member presses the heat sink block from the side will be, at uniform force irrespective of the axial position of the urging member can hold the heat sink block, also, it is possible to lengthen the device life by preventing large deformation of the biasing member.
【0032】 [0032]
前記取付凹部の底部に放熱ブロックを当接させることにより、放熱効率を向上させることができる。 By abutting the heat sink block in the bottom of the mounting recess, thereby improving the heat radiation efficiency.
【0033】 [0033]
また、スリーブの外周に雄ねじを形成し、固定部を雌ねじにすることにより、光源ユニットの抜け落ちを防止し確実に固定することができる。 Further, to form a male thread on the outer periphery of the sleeve, by a fixed portion into the female screw, to prevent falling off of the light source unit can be reliably fixed.
【0034】 [0034]
前記付勢部材を板ばねで構成することにより構造を簡単にし、取付時に必要な力の変化を小さくして容易に取り付けることができる。 To simplify the structure by configuring the biasing member in a plate spring, it can be easily attached to reduce the change in force required during installation.
【0035】 [0035]
前記固定部を先部付勢部材にして、光源ユニットの軸方向の2カ所を半径方向に固定することにより、着脱を容易にすることができる。 And the fixing portion biasing member front portion, the two locations in the axial direction of the light source unit by fixing in the radial direction, it is possible to facilitate the detachment.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の第1実施の形態における光源ユニットの装着構造の縦断面図【図2】本発明の第2実施の形態における光源ユニットの装着構造の縦断面図【図3】本発明の第3実施の形態における光源ユニットの装着構造の縦断面図【図4】従来の半導体発光装置の縦断面図【符号の説明】 Longitudinal sectional view of the mounting structure of the light source unit in the second embodiment of the first longitudinal section view of the mounting structure of the light source unit in the embodiment [2] The present invention of the present invention; FIG 3 shows the present invention longitudinal sectional view of a third longitudinal cross-sectional view of the mounting structure of the light source unit in the embodiment of Figure 4 the conventional semiconductor light emitting device of the REFERENCE nUMERALS]
1 半導体発光素子2 サブマウント素子2a ワイヤ3 放熱ブロック4 絶縁膜5 スリーブ5a 雄ねじ6 樹脂パッケージ11 光源ユニット12 壁部13 絶縁体14 取付孔15 取付板16 取付凹部17 雌ねじ(固定部) 1 semiconductor light-emitting element 2 submount 2a wires 3 heat sink block 4 insulating film 5 sleeves 5a male screw 6 resin package 11 light source unit 12 wall 13 insulator 14 mounting holes 15 mounting plate 16 mounting recess 17 internally threaded (fixing portion)
18 板ばね(先部付勢部材) 18 the leaf spring (with front-part urging member)
19 光源ユニット20 スリーブ21 取付板22 取付孔23 板ばね(先部付勢部材) 19 light source unit 20 sleeve 21 mounting plate 22 mounting holes 23 a leaf spring (with front-part urging member)
24 絶縁体25 放熱ブロック26 雄ねじ27 壁部28 雌ねじ29 光源ユニットA 装着構造B 装着構造C 装着構造 24 insulator 25 heat sink block 26 male screw 27 wall 28 internal thread 29 light source unit A mounting structure B mounting structure C mounting structure

Claims (4)

  1. 内側に第1の電極になる放熱ブロックを設け、前記放熱ブロックの先部外側に絶縁膜を挟んで第2の電極になるスリーブを熱伝達可能に設け、取り付けられた半導体発光素子に通電可能な光源ユニットの装着構造であって、 The heat sink block comprising a first electrode provided on the inner side, provided with a sleeve according to a second electrode sandwiching the tip portion outside the insulating layer of the heat sink block to be heat transfer, which can be energized mounted semiconductor light-emitting element a mounting structure of the light source unit,
    金属製の壁部に絶縁体を介して設けられ、前記スリーブが嵌入可能な取付孔が形成された取付板と、 The wall portion of the metal is provided via an insulator, and a mounting plate, wherein the sleeve is fitted attachment hole is formed,
    前記壁部に形成され前記取付孔に連通する取付凹部と、 A mounting recess communicating with said mounting hole formed in the wall portion,
    前記取付凹部の周壁に設けられ、嵌入する前記放熱ブロックを半径方向内側に付勢して固定する付勢部材と、 Provided on the peripheral wall of the mounting recess, and a biasing member for fixing to urge the heat sink block radially inwardly to fit,
    前記取付孔の周壁に設けられ、嵌入する前記スリーブを固定する固定部とを有することを特徴とする光源ユニットの装着構造。 Provided on the peripheral wall of the mounting hole, the mounting structure of the light source unit and having a fixing portion for fixing the sleeve to be fitted.
  2. 前記スリーブの外周には雄ねじが形成され、前記固定部は前記雄ねじに螺合する雌ねじであることを特徴とする請求項1記載の光源ユニットの装着構造。 Wherein the outer periphery of the sleeve external thread is formed, the fixing unit mounting structure of the light source unit according to claim 1, characterized in that the internal thread to be screwed to the external thread.
  3. 前記付勢部材は、屈曲した中間部が先側に突出する板ばねであって、複数設けられていることを特徴とする請求項1又は2記載の光源ユニットの装着構造。 Wherein the biasing member is bent intermediate portion is a plate spring projecting the front side, the mounting structure of the light source unit according to claim 1 or 2, wherein the provided with a plurality.
  4. 前記固定部は嵌入する前記スリーブを半径方向内側に付勢して固定する先部付勢部材であることを特徴とする請求項1記載の光源ユニットの装着構造。 Mounting structure of the light source unit of claim 1, wherein said fixed portion, characterized in that the attached front portion urging member for fixing to urge the sleeve radially inwardly to fit.
JP2001268477A 2001-09-05 2001-09-05 Mounting structure of the light source unit Expired - Fee Related JP4701565B2 (en)

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JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module
WO2005091390A1 (en) * 2004-03-18 2005-09-29 Showa Denko K.K. Group iii nitride semiconductor light-emitting device and producing method thereof
JP2006032804A (en) * 2004-07-20 2006-02-02 Koha Co Ltd Light emitting device and its manufacturing method
KR20090086989A (en) 2006-10-10 2009-08-14 네오벌브 테크놀러지스 인크 A semiconductor light-emitting module
CN102943966B (en) * 2007-12-13 2015-02-11 皇家飞利浦电子股份有限公司 Light emitting diode disposed on heat dissipating device

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JPS61137376A (en) * 1984-12-07 1986-06-25 Philips Nv Light emitting element matrix and manufacture thereof
WO2001057937A1 (en) * 2000-02-04 2001-08-09 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package

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GB1295306A (en) * 1969-04-23 1972-11-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137376A (en) * 1984-12-07 1986-06-25 Philips Nv Light emitting element matrix and manufacture thereof
WO2001057937A1 (en) * 2000-02-04 2001-08-09 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package

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