DE60138159D1 - Integrierte Schaltung mit Induktanz von hohem Gütefaktor und grosser Kompaktheit - Google Patents
Integrierte Schaltung mit Induktanz von hohem Gütefaktor und grosser KompaktheitInfo
- Publication number
- DE60138159D1 DE60138159D1 DE60138159T DE60138159T DE60138159D1 DE 60138159 D1 DE60138159 D1 DE 60138159D1 DE 60138159 T DE60138159 T DE 60138159T DE 60138159 T DE60138159 T DE 60138159T DE 60138159 D1 DE60138159 D1 DE 60138159D1
- Authority
- DE
- Germany
- Prior art keywords
- inductance
- integrated circuit
- high quality
- quality factor
- great compactness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0007864A FR2810451A1 (fr) | 2000-06-20 | 2000-06-20 | Circuit integre incluant un element inductif de facteur de qualite eleve et presentant une grande compacite |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60138159D1 true DE60138159D1 (de) | 2009-05-14 |
Family
ID=8851449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60138159T Expired - Lifetime DE60138159D1 (de) | 2000-06-20 | 2001-06-13 | Integrierte Schaltung mit Induktanz von hohem Gütefaktor und grosser Kompaktheit |
Country Status (8)
Country | Link |
---|---|
US (1) | US7002233B2 (de) |
EP (1) | EP1168442B1 (de) |
JP (1) | JP2002093916A (de) |
KR (1) | KR100875601B1 (de) |
CN (1) | CN100372120C (de) |
DE (1) | DE60138159D1 (de) |
FR (1) | FR2810451A1 (de) |
TW (1) | TW513811B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10221442B4 (de) * | 2002-05-15 | 2005-09-22 | Xignal Technologies Ag | Induktives Element einer integrierten Schaltung |
KR101005264B1 (ko) | 2003-07-26 | 2011-01-04 | 삼성전자주식회사 | 대칭형 인덕터 소자 |
JP4444683B2 (ja) * | 2004-02-10 | 2010-03-31 | 株式会社日立製作所 | コイル状アンテナを有する半導体チップ及びこれを用いた通信システム |
JP2008503890A (ja) * | 2004-06-23 | 2008-02-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | プレーナインダクタ |
JP4541800B2 (ja) * | 2004-08-20 | 2010-09-08 | ルネサスエレクトロニクス株式会社 | インダクタを備えた半導体装置 |
FR2878081B1 (fr) * | 2004-11-17 | 2009-03-06 | France Telecom | Procede de realisation d'antennes integrees sur puce ayant une efficacite de rayonnement ameliore. |
TW200802430A (en) * | 2006-01-09 | 2008-01-01 | Koninkl Philips Electronics Nv | Integrated circuit inductor with small floating metal structures |
US7750408B2 (en) * | 2007-03-29 | 2010-07-06 | International Business Machines Corporation | Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit |
JP2008263074A (ja) * | 2007-04-12 | 2008-10-30 | Renesas Technology Corp | 半導体装置 |
JP5551480B2 (ja) * | 2010-03-24 | 2014-07-16 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
US9759580B2 (en) * | 2015-08-27 | 2017-09-12 | Texas Instruments Incorporated | Position sensor |
US9954487B1 (en) | 2016-10-07 | 2018-04-24 | International Business Machines Corporation | Tuning LC tank circuits |
EP3327806B1 (de) * | 2016-11-24 | 2021-07-21 | Murata Integrated Passive Solutions | Integriertes elektronisches bauteil für breitbandige vorspannung |
US9899967B1 (en) * | 2017-02-01 | 2018-02-20 | Infineon Technologies Ag | Embedded harmonic termination on high power RF transistor |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021556A (ja) * | 1983-07-15 | 1985-02-02 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS61115302A (ja) * | 1984-11-12 | 1986-06-02 | Asahi Chem Ind Co Ltd | シ−トコイル |
JPH0272660A (ja) * | 1988-09-07 | 1990-03-12 | Kawasaki Steel Corp | 半導体装置 |
WO1994017558A1 (en) * | 1993-01-29 | 1994-08-04 | The Regents Of The University Of California | Monolithic passive component |
JPH0774311A (ja) * | 1993-09-06 | 1995-03-17 | Toshiba Corp | 半導体アナログ集積回路 |
JPH07335441A (ja) * | 1994-06-07 | 1995-12-22 | Sony Corp | コイル構造 |
JPH08181018A (ja) * | 1994-12-26 | 1996-07-12 | Murata Mfg Co Ltd | コイル装置 |
JPH08330517A (ja) * | 1995-05-31 | 1996-12-13 | Sanyo Electric Co Ltd | 集積回路装置および共振回路 |
SE510443C2 (sv) * | 1996-05-31 | 1999-05-25 | Ericsson Telefon Ab L M | Induktorer för integrerade kretsar |
US5793272A (en) * | 1996-08-23 | 1998-08-11 | International Business Machines Corporation | Integrated circuit toroidal inductor |
EP0836271B1 (de) * | 1996-10-10 | 2003-01-29 | Philips Electronics N.V. | Integrierter Oszillator und einen solchen Oszillator verwendendes Funktelefon |
US5872384A (en) * | 1997-01-17 | 1999-02-16 | Lucent Technologies Inc. | Component arrangement having magnetic field controlled transistor |
WO1998050956A1 (en) * | 1997-05-02 | 1998-11-12 | The Board Of Trustees Of The Leland Stanford Junior University | Patterned ground shields for integrated circuit inductors |
JPH10321802A (ja) * | 1997-05-22 | 1998-12-04 | Toshiba Corp | インダクタ素子 |
US6160303A (en) * | 1997-08-29 | 2000-12-12 | Texas Instruments Incorporated | Monolithic inductor with guard rings |
JP3661380B2 (ja) * | 1997-12-12 | 2005-06-15 | 富士電機デバイステクノロジー株式会社 | 平面型インダクタ |
KR19990055422A (ko) * | 1997-12-27 | 1999-07-15 | 정선종 | 실리콘 기판에서의 인덕터 장치 및 그 제조 방법 |
JP2000022085A (ja) * | 1998-06-29 | 2000-01-21 | Toshiba Corp | 半導体装置及びその製造方法 |
US6529720B1 (en) * | 1998-12-29 | 2003-03-04 | Koninklijke Philips Electronics N.V. | Integrated circuit of inductive elements |
US6566731B2 (en) * | 1999-02-26 | 2003-05-20 | Micron Technology, Inc. | Open pattern inductor |
US7038294B2 (en) * | 2001-03-29 | 2006-05-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Planar spiral inductor structure with patterned microelectronic structure integral thereto |
-
2000
- 2000-06-20 FR FR0007864A patent/FR2810451A1/fr active Pending
-
2001
- 2001-06-13 EP EP01202292A patent/EP1168442B1/de not_active Expired - Lifetime
- 2001-06-13 DE DE60138159T patent/DE60138159D1/de not_active Expired - Lifetime
- 2001-06-16 KR KR1020010034126A patent/KR100875601B1/ko not_active IP Right Cessation
- 2001-06-16 CN CNB011248343A patent/CN100372120C/zh not_active Expired - Lifetime
- 2001-06-18 US US09/883,438 patent/US7002233B2/en not_active Expired - Lifetime
- 2001-06-20 JP JP2001186874A patent/JP2002093916A/ja active Pending
- 2001-08-24 TW TW090120886A patent/TW513811B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20020000109A (ko) | 2002-01-04 |
US7002233B2 (en) | 2006-02-21 |
EP1168442B1 (de) | 2009-04-01 |
CN100372120C (zh) | 2008-02-27 |
EP1168442A2 (de) | 2002-01-02 |
EP1168442A3 (de) | 2002-05-02 |
TW513811B (en) | 2002-12-11 |
JP2002093916A (ja) | 2002-03-29 |
US20020063585A1 (en) | 2002-05-30 |
KR100875601B1 (ko) | 2008-12-23 |
CN1331493A (zh) | 2002-01-16 |
FR2810451A1 (fr) | 2001-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |