DE60136940D1 - Elektrostatischer scheibenhalter mit porösen bereichen - Google Patents

Elektrostatischer scheibenhalter mit porösen bereichen

Info

Publication number
DE60136940D1
DE60136940D1 DE60136940T DE60136940T DE60136940D1 DE 60136940 D1 DE60136940 D1 DE 60136940D1 DE 60136940 T DE60136940 T DE 60136940T DE 60136940 T DE60136940 T DE 60136940T DE 60136940 D1 DE60136940 D1 DE 60136940D1
Authority
DE
Germany
Prior art keywords
porous region
disc holder
electrostatic chuck
porous areas
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60136940T
Other languages
German (de)
English (en)
Inventor
Ramesh Divakar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Application granted granted Critical
Publication of DE60136940D1 publication Critical patent/DE60136940D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
DE60136940T 2000-09-05 2001-08-01 Elektrostatischer scheibenhalter mit porösen bereichen Expired - Fee Related DE60136940D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/655,324 US6606234B1 (en) 2000-09-05 2000-09-05 Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow
PCT/US2001/024135 WO2002021590A2 (en) 2000-09-05 2001-08-01 Electrostatic chuck with porous regions

Publications (1)

Publication Number Publication Date
DE60136940D1 true DE60136940D1 (de) 2009-01-22

Family

ID=24628428

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60136940T Expired - Fee Related DE60136940D1 (de) 2000-09-05 2001-08-01 Elektrostatischer scheibenhalter mit porösen bereichen

Country Status (9)

Country Link
US (1) US6606234B1 (https=)
EP (1) EP1316110B1 (https=)
JP (1) JP4959905B2 (https=)
KR (1) KR100557695B1 (https=)
AT (1) ATE417358T1 (https=)
AU (1) AU2001277237A1 (https=)
DE (1) DE60136940D1 (https=)
TW (1) TW526521B (https=)
WO (1) WO2002021590A2 (https=)

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CN104748574A (zh) * 2013-12-27 2015-07-01 北京思能达节能电气股份有限公司 一种用于监测自焙电极焙烧状态的系统和方法

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US9202736B2 (en) * 2007-07-31 2015-12-01 Applied Materials, Inc. Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
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US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8608852B2 (en) 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies
US9728429B2 (en) 2010-07-27 2017-08-08 Lam Research Corporation Parasitic plasma prevention in plasma processing chambers
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JP5458050B2 (ja) 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5956379B2 (ja) * 2012-04-27 2016-07-27 日本碍子株式会社 半導体製造装置用部材
KR102032744B1 (ko) 2012-09-05 2019-11-11 삼성디스플레이 주식회사 기판 고정장치 및 이의 제조방법
US9976211B2 (en) 2014-04-25 2018-05-22 Applied Materials, Inc. Plasma erosion resistant thin film coating for high temperature application
CN107004626B (zh) * 2014-11-20 2019-02-05 住友大阪水泥股份有限公司 静电卡盘装置
EP3262677B1 (en) 2015-02-23 2025-11-26 II-VI Delaware, Inc. Film electrode for electrostatic chuck
JP6722518B2 (ja) * 2016-06-09 2020-07-15 新光電気工業株式会社 焼結体及びその製造方法と静電チャック
JP6854600B2 (ja) * 2016-07-15 2021-04-07 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置、および基板載置台
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US10975469B2 (en) * 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
JP2019029384A (ja) * 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
JP7052735B2 (ja) * 2017-09-29 2022-04-12 住友大阪セメント株式会社 静電チャック装置
KR102039802B1 (ko) * 2017-12-19 2019-11-26 한국세라믹기술원 정전척용 세라믹 본체
US10411380B1 (en) 2018-05-24 2019-09-10 Microsoft Technology Licensing, Llc Connectors with liquid metal and gas permeable plugs
US11456161B2 (en) * 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
CN111668148B (zh) * 2019-03-05 2024-09-03 Toto株式会社 静电吸盘及处理装置
CN112687602B (zh) * 2019-10-18 2024-11-08 中微半导体设备(上海)股份有限公司 一种静电吸盘及其制造方法、等离子体处理装置
JP7345379B2 (ja) * 2019-12-06 2023-09-15 株式会社ディスコ ゲッタリング性評価装置
KR102779855B1 (ko) * 2021-02-17 2025-03-10 어플라이드 머티어리얼스, 인코포레이티드 다공성 플러그 본딩
US11794296B2 (en) * 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
JP7577898B2 (ja) 2022-07-07 2024-11-05 日本特殊陶業株式会社 保持装置
US20240112889A1 (en) * 2022-09-30 2024-04-04 Applied Materials, Inc. Large diameter porous plug for argon delivery
US12600682B2 (en) 2022-11-11 2026-04-14 Applied Materials, Inc. Monolithic substrate support having porous features and methods of forming the same
CN120345057A (zh) * 2022-12-21 2025-07-18 东京毅力科创株式会社 基片处理装置和静电卡盘
KR102795089B1 (ko) * 2022-12-28 2025-04-15 세메스 주식회사 서셉터 및 그 제조방법
KR20250068704A (ko) 2023-04-19 2025-05-16 니혼도꾸슈도교 가부시키가이샤 유지 장치

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104748574A (zh) * 2013-12-27 2015-07-01 北京思能达节能电气股份有限公司 一种用于监测自焙电极焙烧状态的系统和方法

Also Published As

Publication number Publication date
JP4959905B2 (ja) 2012-06-27
KR20030031177A (ko) 2003-04-18
JP2004508728A (ja) 2004-03-18
US6606234B1 (en) 2003-08-12
WO2002021590A3 (en) 2002-08-01
EP1316110B1 (en) 2008-12-10
AU2001277237A1 (en) 2002-03-22
ATE417358T1 (de) 2008-12-15
KR100557695B1 (ko) 2006-03-07
EP1316110A2 (en) 2003-06-04
TW526521B (en) 2003-04-01
WO2002021590A2 (en) 2002-03-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee