AU2001277237A1 - Electrostatic chuck with porous regions - Google Patents

Electrostatic chuck with porous regions

Info

Publication number
AU2001277237A1
AU2001277237A1 AU2001277237A AU7723701A AU2001277237A1 AU 2001277237 A1 AU2001277237 A1 AU 2001277237A1 AU 2001277237 A AU2001277237 A AU 2001277237A AU 7723701 A AU7723701 A AU 7723701A AU 2001277237 A1 AU2001277237 A1 AU 2001277237A1
Authority
AU
Australia
Prior art keywords
electrostatic chuck
porous region
chuck
chuck body
porous regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001277237A
Other languages
English (en)
Inventor
Ramesh Divakar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of AU2001277237A1 publication Critical patent/AU2001277237A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
AU2001277237A 2000-09-05 2001-08-01 Electrostatic chuck with porous regions Abandoned AU2001277237A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/655,324 US6606234B1 (en) 2000-09-05 2000-09-05 Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow
US09/655,324 2000-09-05
PCT/US2001/024135 WO2002021590A2 (en) 2000-09-05 2001-08-01 Electrostatic chuck with porous regions

Publications (1)

Publication Number Publication Date
AU2001277237A1 true AU2001277237A1 (en) 2002-03-22

Family

ID=24628428

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001277237A Abandoned AU2001277237A1 (en) 2000-09-05 2001-08-01 Electrostatic chuck with porous regions

Country Status (9)

Country Link
US (1) US6606234B1 (https=)
EP (1) EP1316110B1 (https=)
JP (1) JP4959905B2 (https=)
KR (1) KR100557695B1 (https=)
AT (1) ATE417358T1 (https=)
AU (1) AU2001277237A1 (https=)
DE (1) DE60136940D1 (https=)
TW (1) TW526521B (https=)
WO (1) WO2002021590A2 (https=)

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US9218997B2 (en) * 2008-11-06 2015-12-22 Applied Materials, Inc. Electrostatic chuck having reduced arcing
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US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8608852B2 (en) 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies
US9728429B2 (en) 2010-07-27 2017-08-08 Lam Research Corporation Parasitic plasma prevention in plasma processing chambers
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JP5458050B2 (ja) 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5956379B2 (ja) * 2012-04-27 2016-07-27 日本碍子株式会社 半導体製造装置用部材
KR102032744B1 (ko) 2012-09-05 2019-11-11 삼성디스플레이 주식회사 기판 고정장치 및 이의 제조방법
CN104748574A (zh) * 2013-12-27 2015-07-01 北京思能达节能电气股份有限公司 一种用于监测自焙电极焙烧状态的系统和方法
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JP6854600B2 (ja) * 2016-07-15 2021-04-07 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置、および基板載置台
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US10975469B2 (en) * 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
JP2019029384A (ja) * 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
JP7052735B2 (ja) * 2017-09-29 2022-04-12 住友大阪セメント株式会社 静電チャック装置
KR102039802B1 (ko) * 2017-12-19 2019-11-26 한국세라믹기술원 정전척용 세라믹 본체
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US11456161B2 (en) * 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
CN111668148B (zh) * 2019-03-05 2024-09-03 Toto株式会社 静电吸盘及处理装置
CN112687602B (zh) * 2019-10-18 2024-11-08 中微半导体设备(上海)股份有限公司 一种静电吸盘及其制造方法、等离子体处理装置
JP7345379B2 (ja) * 2019-12-06 2023-09-15 株式会社ディスコ ゲッタリング性評価装置
KR102779855B1 (ko) * 2021-02-17 2025-03-10 어플라이드 머티어리얼스, 인코포레이티드 다공성 플러그 본딩
US11794296B2 (en) * 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
JP7577898B2 (ja) 2022-07-07 2024-11-05 日本特殊陶業株式会社 保持装置
US20240112889A1 (en) * 2022-09-30 2024-04-04 Applied Materials, Inc. Large diameter porous plug for argon delivery
US12600682B2 (en) 2022-11-11 2026-04-14 Applied Materials, Inc. Monolithic substrate support having porous features and methods of forming the same
CN120345057A (zh) * 2022-12-21 2025-07-18 东京毅力科创株式会社 基片处理装置和静电卡盘
KR102795089B1 (ko) * 2022-12-28 2025-04-15 세메스 주식회사 서셉터 및 그 제조방법
KR20250068704A (ko) 2023-04-19 2025-05-16 니혼도꾸슈도교 가부시키가이샤 유지 장치

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Also Published As

Publication number Publication date
JP4959905B2 (ja) 2012-06-27
KR20030031177A (ko) 2003-04-18
DE60136940D1 (de) 2009-01-22
JP2004508728A (ja) 2004-03-18
US6606234B1 (en) 2003-08-12
WO2002021590A3 (en) 2002-08-01
EP1316110B1 (en) 2008-12-10
ATE417358T1 (de) 2008-12-15
KR100557695B1 (ko) 2006-03-07
EP1316110A2 (en) 2003-06-04
TW526521B (en) 2003-04-01
WO2002021590A2 (en) 2002-03-14

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