DE60136897D1 - Leitende Metall-, Verbindungsmetall-Teilchen und deren Produktanwendungen - Google Patents
Leitende Metall-, Verbindungsmetall-Teilchen und deren ProduktanwendungenInfo
- Publication number
- DE60136897D1 DE60136897D1 DE60136897T DE60136897T DE60136897D1 DE 60136897 D1 DE60136897 D1 DE 60136897D1 DE 60136897 T DE60136897 T DE 60136897T DE 60136897 T DE60136897 T DE 60136897T DE 60136897 D1 DE60136897 D1 DE 60136897D1
- Authority
- DE
- Germany
- Prior art keywords
- metal particles
- conductive
- conductive metal
- mass
- product applications
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
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- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000300028 | 2000-09-29 |
Publications (1)
Publication Number | Publication Date |
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DE60136897D1 true DE60136897D1 (de) | 2009-01-22 |
Family
ID=18781760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60136897T Expired - Lifetime DE60136897D1 (de) | 2000-09-29 | 2001-09-26 | Leitende Metall-, Verbindungsmetall-Teilchen und deren Produktanwendungen |
Country Status (8)
Country | Link |
---|---|
US (2) | US6663799B2 (de) |
EP (1) | EP1193757B1 (de) |
KR (3) | KR20020025796A (de) |
CN (1) | CN1229817C (de) |
AT (1) | ATE417359T1 (de) |
DE (1) | DE60136897D1 (de) |
PT (1) | PT1193757E (de) |
TW (1) | TW536713B (de) |
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-
2001
- 2001-09-25 US US09/961,323 patent/US6663799B2/en not_active Expired - Lifetime
- 2001-09-26 AT AT01123036T patent/ATE417359T1/de not_active IP Right Cessation
- 2001-09-26 PT PT01123036T patent/PT1193757E/pt unknown
- 2001-09-26 DE DE60136897T patent/DE60136897D1/de not_active Expired - Lifetime
- 2001-09-26 EP EP01123036A patent/EP1193757B1/de not_active Expired - Lifetime
- 2001-09-28 KR KR1020010060409A patent/KR20020025796A/ko active Search and Examination
- 2001-09-28 TW TW090124186A patent/TW536713B/zh not_active IP Right Cessation
- 2001-09-29 CN CNB011381906A patent/CN1229817C/zh not_active Expired - Fee Related
-
2003
- 2003-09-15 US US10/661,523 patent/US6926751B2/en not_active Expired - Lifetime
-
2005
- 2005-08-31 KR KR1020050080526A patent/KR20050089956A/ko not_active Application Discontinuation
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- 2006-07-18 KR KR1020060066853A patent/KR100671910B1/ko active IP Right Review Request
Also Published As
Publication number | Publication date |
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US6663799B2 (en) | 2003-12-16 |
US6926751B2 (en) | 2005-08-09 |
TW536713B (en) | 2003-06-11 |
EP1193757A2 (de) | 2002-04-03 |
EP1193757A3 (de) | 2005-09-28 |
CN1229817C (zh) | 2005-11-30 |
KR20060088530A (ko) | 2006-08-04 |
PT1193757E (pt) | 2009-02-17 |
US20040079193A1 (en) | 2004-04-29 |
ATE417359T1 (de) | 2008-12-15 |
KR100671910B1 (ko) | 2007-01-22 |
EP1193757B1 (de) | 2008-12-10 |
CN1362712A (zh) | 2002-08-07 |
US20020061401A1 (en) | 2002-05-23 |
KR20020025796A (ko) | 2002-04-04 |
KR20050089956A (ko) | 2005-09-09 |
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