DE60127589T2 - Breitbandige testsondeneinheit - Google Patents
Breitbandige testsondeneinheit Download PDFInfo
- Publication number
- DE60127589T2 DE60127589T2 DE60127589T DE60127589T DE60127589T2 DE 60127589 T2 DE60127589 T2 DE 60127589T2 DE 60127589 T DE60127589 T DE 60127589T DE 60127589 T DE60127589 T DE 60127589T DE 60127589 T2 DE60127589 T2 DE 60127589T2
- Authority
- DE
- Germany
- Prior art keywords
- probe
- spring
- block set
- hole
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 title description 10
- 239000000523 sample Substances 0.000 claims abstract description 262
- 239000002689 soil Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 abstract description 5
- 239000002184 metal Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 4
- 239000004954 Polyphthalamide Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 210000002105 tongue Anatomy 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Vehicle Body Suspensions (AREA)
- Eye Examination Apparatus (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/804,762 US6551126B1 (en) | 2001-03-13 | 2001-03-13 | High bandwidth probe assembly |
| US804762 | 2001-03-13 | ||
| PCT/US2001/021776 WO2002073219A2 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60127589D1 DE60127589D1 (de) | 2007-05-10 |
| DE60127589T2 true DE60127589T2 (de) | 2007-12-13 |
Family
ID=25189761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60127589T Expired - Lifetime DE60127589T2 (de) | 2001-03-13 | 2001-07-10 | Breitbandige testsondeneinheit |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6551126B1 (enExample) |
| EP (2) | EP1368665B1 (enExample) |
| JP (2) | JP5188000B2 (enExample) |
| AT (1) | ATE358278T1 (enExample) |
| DE (1) | DE60127589T2 (enExample) |
| WO (1) | WO2002073219A2 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911811B2 (en) * | 2002-03-18 | 2005-06-28 | Agilent Technologies, Inc. | Contact spring and socket combination for high bandwidth probe tips |
| US6902416B2 (en) * | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
| US6824427B1 (en) * | 2003-05-13 | 2004-11-30 | 3M Innovative Properties Company | Coaxial probe interconnection system |
| US6798227B1 (en) * | 2003-06-24 | 2004-09-28 | Agilent Technologies, Inc. | Two axis self-centering probe block assembly with two axis float and self-alignment |
| KR100600482B1 (ko) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | 반도체 패키지 측정용 프로브 |
| USD558687S1 (en) * | 2004-07-14 | 2008-01-01 | Abb Inc. | Test switch |
| US7180321B2 (en) * | 2004-10-01 | 2007-02-20 | Teradyne, Inc. | Tester interface module |
| USD587213S1 (en) * | 2005-08-04 | 2009-02-24 | Abb Technology Ag | Test switch |
| USD585388S1 (en) * | 2005-08-04 | 2009-01-27 | Abb Technology Ag | Test switch |
| US20070063714A1 (en) * | 2005-09-21 | 2007-03-22 | Mctigue Michael T | High bandwidth probe |
| US7651355B2 (en) * | 2006-06-30 | 2010-01-26 | 3M Innovative Properties Company | Floating panel mount connection system |
| USD583334S1 (en) * | 2006-07-24 | 2008-12-23 | Abb Technology Ag | Test switch |
| US7977583B2 (en) * | 2007-12-13 | 2011-07-12 | Teradyne, Inc. | Shielded cable interface module and method of fabrication |
| US7651374B2 (en) * | 2008-06-10 | 2010-01-26 | 3M Innovative Properties Company | System and method of surface mount electrical connection |
| US7744414B2 (en) * | 2008-07-08 | 2010-06-29 | 3M Innovative Properties Company | Carrier assembly and system configured to commonly ground a header |
| US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
| US20100194419A1 (en) * | 2009-02-05 | 2010-08-05 | Chan Edward K | Multi-contact probe assembly |
| US7909646B2 (en) * | 2009-08-10 | 2011-03-22 | 3M Innovative Properties Company | Electrical carrier assembly and system of electrical carrier assemblies |
| US7850489B1 (en) | 2009-08-10 | 2010-12-14 | 3M Innovative Properties Company | Electrical connector system |
| US7997933B2 (en) * | 2009-08-10 | 2011-08-16 | 3M Innovative Properties Company | Electrical connector system |
| US7927144B2 (en) * | 2009-08-10 | 2011-04-19 | 3M Innovative Properties Company | Electrical connector with interlocking plates |
| JP2011138655A (ja) * | 2009-12-28 | 2011-07-14 | Shonan Engineering Corp | 多点接触装置および当該装置を備えた電池検査装置 |
| US8187035B2 (en) * | 2010-05-28 | 2012-05-29 | Tyco Electronics Corporation | Connector assembly |
| US10663486B2 (en) * | 2017-02-06 | 2020-05-26 | International Business Machines Corporation | Portable electrical noise probe structure |
| KR101921291B1 (ko) * | 2018-05-11 | 2019-02-13 | (주) 마이크로프랜드 | 반도체소자 테스트소켓 |
| KR102442364B1 (ko) * | 2018-05-22 | 2022-09-14 | 오므론 가부시키가이샤 | 프로브 핀 |
| US10938139B2 (en) * | 2018-08-21 | 2021-03-02 | Te Connectivity Corporation | Electrical connector with retractable contacts |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3852700A (en) * | 1969-04-18 | 1974-12-03 | Breston M | Grounding base for connector |
| JPS6180067A (ja) * | 1984-09-21 | 1986-04-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | テスト・プロ−ブ装置 |
| US4729752A (en) * | 1985-07-26 | 1988-03-08 | Amp Incorporated | Transient suppression device |
| US4724180A (en) * | 1985-08-05 | 1988-02-09 | Teradyne, Inc. | Electrically shielded connectors |
| JPH0521020Y2 (enExample) * | 1985-12-05 | 1993-05-31 | ||
| JPH0178029U (enExample) | 1987-11-13 | 1989-05-25 | ||
| JPH04115167A (ja) * | 1990-09-06 | 1992-04-16 | Nec Corp | 布線検査機用ピンヘッド |
| JPH06216205A (ja) * | 1993-01-13 | 1994-08-05 | Tokyo Electron Yamanashi Kk | プローブカードインターフェース装置 |
| JPH09304431A (ja) * | 1996-05-13 | 1997-11-28 | I C T:Kk | プローブ針 |
| US6066957A (en) | 1997-09-11 | 2000-05-23 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
| US6184460B1 (en) * | 1998-02-27 | 2001-02-06 | Berg Technology, Inc. | Modular box shield for forming a coaxial header |
| US6037787A (en) | 1998-03-24 | 2000-03-14 | Teradyne, Inc. | High performance probe interface for automatic test equipment |
| US6409550B1 (en) * | 1999-11-15 | 2002-06-25 | Mce/Weinschel Corporation | Planar blind-mate connectors |
| US6447328B1 (en) * | 2001-03-13 | 2002-09-10 | 3M Innovative Properties Company | Method and apparatus for retaining a spring probe |
-
2001
- 2001-03-13 US US09/804,762 patent/US6551126B1/en not_active Expired - Fee Related
- 2001-07-10 EP EP01953443A patent/EP1368665B1/en not_active Expired - Lifetime
- 2001-07-10 EP EP06119367A patent/EP1722241A3/en not_active Withdrawn
- 2001-07-10 AT AT01953443T patent/ATE358278T1/de not_active IP Right Cessation
- 2001-07-10 DE DE60127589T patent/DE60127589T2/de not_active Expired - Lifetime
- 2001-07-10 WO PCT/US2001/021776 patent/WO2002073219A2/en not_active Ceased
- 2001-07-10 JP JP2002572428A patent/JP5188000B2/ja not_active Expired - Fee Related
-
2011
- 2011-10-06 JP JP2011221783A patent/JP2012013713A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP1368665B1 (en) | 2007-03-28 |
| JP2012013713A (ja) | 2012-01-19 |
| DE60127589D1 (de) | 2007-05-10 |
| ATE358278T1 (de) | 2007-04-15 |
| WO2002073219A3 (en) | 2003-01-03 |
| JP5188000B2 (ja) | 2013-04-24 |
| EP1368665A2 (en) | 2003-12-10 |
| EP1722241A2 (en) | 2006-11-15 |
| WO2002073219A2 (en) | 2002-09-19 |
| JP2004523757A (ja) | 2004-08-05 |
| US6551126B1 (en) | 2003-04-22 |
| EP1722241A3 (en) | 2007-07-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |