JP5188000B2 - 高帯域幅プローブアセンブリ - Google Patents

高帯域幅プローブアセンブリ Download PDF

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Publication number
JP5188000B2
JP5188000B2 JP2002572428A JP2002572428A JP5188000B2 JP 5188000 B2 JP5188000 B2 JP 5188000B2 JP 2002572428 A JP2002572428 A JP 2002572428A JP 2002572428 A JP2002572428 A JP 2002572428A JP 5188000 B2 JP5188000 B2 JP 5188000B2
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JP
Japan
Prior art keywords
probe
ground
spring
housing
spring probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002572428A
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English (en)
Japanese (ja)
Other versions
JP2004523757A5 (enExample
JP2004523757A (ja
Inventor
スティーブン・フェルドマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2004523757A publication Critical patent/JP2004523757A/ja
Publication of JP2004523757A5 publication Critical patent/JP2004523757A5/ja
Application granted granted Critical
Publication of JP5188000B2 publication Critical patent/JP5188000B2/ja
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Vehicle Body Suspensions (AREA)
  • Eye Examination Apparatus (AREA)
  • Connecting Device With Holders (AREA)
JP2002572428A 2001-03-13 2001-07-10 高帯域幅プローブアセンブリ Expired - Fee Related JP5188000B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/804,762 US6551126B1 (en) 2001-03-13 2001-03-13 High bandwidth probe assembly
US09/804,762 2001-03-13
PCT/US2001/021776 WO2002073219A2 (en) 2001-03-13 2001-07-10 High bandwidth probe assembly

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011221783A Division JP2012013713A (ja) 2001-03-13 2011-10-06 高帯域幅プローブアセンブリ

Publications (3)

Publication Number Publication Date
JP2004523757A JP2004523757A (ja) 2004-08-05
JP2004523757A5 JP2004523757A5 (enExample) 2008-08-21
JP5188000B2 true JP5188000B2 (ja) 2013-04-24

Family

ID=25189761

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002572428A Expired - Fee Related JP5188000B2 (ja) 2001-03-13 2001-07-10 高帯域幅プローブアセンブリ
JP2011221783A Pending JP2012013713A (ja) 2001-03-13 2011-10-06 高帯域幅プローブアセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011221783A Pending JP2012013713A (ja) 2001-03-13 2011-10-06 高帯域幅プローブアセンブリ

Country Status (6)

Country Link
US (1) US6551126B1 (enExample)
EP (2) EP1368665B1 (enExample)
JP (2) JP5188000B2 (enExample)
AT (1) ATE358278T1 (enExample)
DE (1) DE60127589T2 (enExample)
WO (1) WO2002073219A2 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911811B2 (en) * 2002-03-18 2005-06-28 Agilent Technologies, Inc. Contact spring and socket combination for high bandwidth probe tips
US6902416B2 (en) * 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6824427B1 (en) * 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US6798227B1 (en) * 2003-06-24 2004-09-28 Agilent Technologies, Inc. Two axis self-centering probe block assembly with two axis float and self-alignment
KR100600482B1 (ko) * 2004-06-22 2006-07-13 삼성전자주식회사 반도체 패키지 측정용 프로브
USD558687S1 (en) * 2004-07-14 2008-01-01 Abb Inc. Test switch
US7180321B2 (en) * 2004-10-01 2007-02-20 Teradyne, Inc. Tester interface module
USD587213S1 (en) * 2005-08-04 2009-02-24 Abb Technology Ag Test switch
USD585388S1 (en) * 2005-08-04 2009-01-27 Abb Technology Ag Test switch
US20070063714A1 (en) * 2005-09-21 2007-03-22 Mctigue Michael T High bandwidth probe
US7651355B2 (en) * 2006-06-30 2010-01-26 3M Innovative Properties Company Floating panel mount connection system
USD583334S1 (en) * 2006-07-24 2008-12-23 Abb Technology Ag Test switch
US7977583B2 (en) * 2007-12-13 2011-07-12 Teradyne, Inc. Shielded cable interface module and method of fabrication
US7651374B2 (en) * 2008-06-10 2010-01-26 3M Innovative Properties Company System and method of surface mount electrical connection
US7744414B2 (en) * 2008-07-08 2010-06-29 3M Innovative Properties Company Carrier assembly and system configured to commonly ground a header
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7997933B2 (en) * 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
JP2011138655A (ja) * 2009-12-28 2011-07-14 Shonan Engineering Corp 多点接触装置および当該装置を備えた電池検査装置
US8187035B2 (en) * 2010-05-28 2012-05-29 Tyco Electronics Corporation Connector assembly
US10663486B2 (en) * 2017-02-06 2020-05-26 International Business Machines Corporation Portable electrical noise probe structure
KR101921291B1 (ko) * 2018-05-11 2019-02-13 (주) 마이크로프랜드 반도체소자 테스트소켓
KR102442364B1 (ko) * 2018-05-22 2022-09-14 오므론 가부시키가이샤 프로브 핀
US10938139B2 (en) * 2018-08-21 2021-03-02 Te Connectivity Corporation Electrical connector with retractable contacts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852700A (en) * 1969-04-18 1974-12-03 Breston M Grounding base for connector
JPS6180067A (ja) * 1984-09-21 1986-04-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・プロ−ブ装置
US4729752A (en) * 1985-07-26 1988-03-08 Amp Incorporated Transient suppression device
US4724180A (en) * 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
JPH0521020Y2 (enExample) * 1985-12-05 1993-05-31
JPH0178029U (enExample) 1987-11-13 1989-05-25
JPH04115167A (ja) * 1990-09-06 1992-04-16 Nec Corp 布線検査機用ピンヘッド
JPH06216205A (ja) * 1993-01-13 1994-08-05 Tokyo Electron Yamanashi Kk プローブカードインターフェース装置
JPH09304431A (ja) * 1996-05-13 1997-11-28 I C T:Kk プローブ針
US6066957A (en) 1997-09-11 2000-05-23 Delaware Capital Formation, Inc. Floating spring probe wireless test fixture
US6184460B1 (en) * 1998-02-27 2001-02-06 Berg Technology, Inc. Modular box shield for forming a coaxial header
US6037787A (en) 1998-03-24 2000-03-14 Teradyne, Inc. High performance probe interface for automatic test equipment
US6409550B1 (en) * 1999-11-15 2002-06-25 Mce/Weinschel Corporation Planar blind-mate connectors
US6447328B1 (en) * 2001-03-13 2002-09-10 3M Innovative Properties Company Method and apparatus for retaining a spring probe

Also Published As

Publication number Publication date
EP1368665B1 (en) 2007-03-28
JP2012013713A (ja) 2012-01-19
DE60127589D1 (de) 2007-05-10
ATE358278T1 (de) 2007-04-15
WO2002073219A3 (en) 2003-01-03
EP1368665A2 (en) 2003-12-10
EP1722241A2 (en) 2006-11-15
WO2002073219A2 (en) 2002-09-19
JP2004523757A (ja) 2004-08-05
DE60127589T2 (de) 2007-12-13
US6551126B1 (en) 2003-04-22
EP1722241A3 (en) 2007-07-25

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