JP4106273B2 - スプリングプローブを保持する方法および装置 - Google Patents
スプリングプローブを保持する方法および装置 Download PDFInfo
- Publication number
- JP4106273B2 JP4106273B2 JP2002572429A JP2002572429A JP4106273B2 JP 4106273 B2 JP4106273 B2 JP 4106273B2 JP 2002572429 A JP2002572429 A JP 2002572429A JP 2002572429 A JP2002572429 A JP 2002572429A JP 4106273 B2 JP4106273 B2 JP 4106273B2
- Authority
- JP
- Japan
- Prior art keywords
- ground
- probe
- spring
- spring probe
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Socks And Pantyhose (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Description
図7Aに、スプリングプローブブロックアセンブリ150の代替実施形態を示す。スプリングプローブブロックアセンブリ150は、絶縁性ハウジング152と、信号プローブ接点161および接地プローブ接点158と、プローブコネクタリテーナ156とを含む。最初に説明した実施形態と同様に、ハウジング152は成形誘電体材料であり、その誘電体材料は、接地要素と関連する信号線とを包囲して他のすべての信号線および接地対から隔離し、さらに、アセンブリにおけるすべての接地を、他の隣接するプローブブロックアセンブリと自動試験装置シャシ接地とから絶縁する。上述したように、ハウジング152の両端における有芯空洞は、接地要素の組立てられたセットの全体的な外面に適合し、空洞は、スプリングプローブが取付けられた場合の、組立てられたプローブコネクタおよび接地クランプの、軸方向かつ横方向の移動を制約するように、大きさが決められている。
Claims (4)
- 接地スプリングプローブ(58)を信号プローブコネクタ(60)の接地シールド(64)に電気的に接続する接地装置において、該接地装置が、
信号プローブコネクタ(60)の接地シールド(64)と電気的に接触する導電性の接地要素(56)であり、該接地要素(56)の前面から延在する第1穴(80、80‘、80“)と、該接地要素(56)の背面から延在し、該第1穴(80、80’、80”)とずれてつながる第2穴(82、82’、82”)とを有する接地要素(56)と、
該接地要素(56)の第1穴(80、80’、80”)と第2穴(82、82’、82”に挿入される直線状の導電性の接地スプリングプローブ(58)であり、該接地要素(56)と電気的に接触し、該第1穴(80、80’、80”)と第2穴(82、82’、82”)内で弾力的に変形されることにより、該接地スプリングプローブ(58)を該第1穴(80、80’、80”)と第2穴(82、82’、82”)内に保持するために十分な、該接地要素(56)と該接地スプリングプローブ(58)との間のスプリング力をもたらす、接地スプリングプローブ(58)と、
を具備する接地装置。 - 複数の接地要素(56)をさらに具備し、該複数の接地要素(56)の各々が、関連する接地プローブ(58)を信号プローブコネクタ(60)の関連する接地シールド(64)と電気的に接続し、該接地要素(56)の各々が、その関連する接地プローブ(58)を弾力的に変形することにより、該接地要素(56)と該関連する接地プローブ(58)との間のスプリング力を維持する請求項1記載の接地装置。
- 第2接地スプリングプローブ(58)をさらに具備し、該第2接地スプリングプローブ(58)が、前記接地要素(56)によって弾力的に変形されることにより、該接地要素(56)と該第2接地スプリングプローブ(58)との間のスプリング力を維持する請求項1記載の接地装置。
- ハウジングにスプリングプローブ(58)を保持する方法であって、
該ハウジング内に、導電性の接地要素(56)を提供する工程と、
該接地要素(56)が、該接地要素(56)の前面から延在する第1穴(80、80‘、80“)と、当該接地要素(56)の背面から延在し、前記第1穴(80、80’、80”)とずれてつながる第2穴(82、82’、82”)とを有する工程と、
スプリングプローブ(58)を該第1穴(80、80’、80”)と第2穴(82、82’、82”)に挿入し、該スプリングプローブ(58)が、該接地要素(56)の該第1穴(80、80’、80”)と第2穴(82、82’、82”)によって弾力的に変形されることにより、該接地要素(56)と該スプリングプローブ(58)との間のスプリング力を維持するものである、工程と、
を含む方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/804,782 US6447328B1 (en) | 2001-03-13 | 2001-03-13 | Method and apparatus for retaining a spring probe |
PCT/US2001/047640 WO2002073220A2 (en) | 2001-03-13 | 2001-12-11 | Method and apparatus for retaining a spring probe |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004530870A JP2004530870A (ja) | 2004-10-07 |
JP2004530870A5 JP2004530870A5 (ja) | 2005-12-22 |
JP4106273B2 true JP4106273B2 (ja) | 2008-06-25 |
Family
ID=25189817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002572429A Expired - Fee Related JP4106273B2 (ja) | 2001-03-13 | 2001-12-11 | スプリングプローブを保持する方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6447328B1 (ja) |
EP (1) | EP1368666B1 (ja) |
JP (1) | JP4106273B2 (ja) |
KR (1) | KR100831787B1 (ja) |
CN (1) | CN1288449C (ja) |
AT (1) | ATE291234T1 (ja) |
DE (1) | DE60109499T2 (ja) |
WO (1) | WO2002073220A2 (ja) |
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US6696850B1 (en) * | 2002-10-02 | 2004-02-24 | Interconnect Devices, Inc. | Contact probe with off-centered back-drilled aperture |
US6824427B1 (en) * | 2003-05-13 | 2004-11-30 | 3M Innovative Properties Company | Coaxial probe interconnection system |
US7015708B2 (en) * | 2003-07-11 | 2006-03-21 | Gore Enterprise Holdings, Inc. | Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts |
JP4053962B2 (ja) * | 2003-10-15 | 2008-02-27 | 株式会社東芝 | 半導体装置 |
WO2006007440A1 (en) * | 2004-06-16 | 2006-01-19 | Rika Denshi America, Inc. | Electrical test probes, methods of making, and methods of using |
KR100600482B1 (ko) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | 반도체 패키지 측정용 프로브 |
JP4757531B2 (ja) | 2005-04-28 | 2011-08-24 | 日本発條株式会社 | 導電性接触子ホルダおよび導電性接触子ユニット |
US7298153B2 (en) * | 2005-05-25 | 2007-11-20 | Interconnect Devices, Inc. | Eccentric offset Kelvin probe |
US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
US20100194419A1 (en) * | 2009-02-05 | 2010-08-05 | Chan Edward K | Multi-contact probe assembly |
US7997933B2 (en) | 2009-08-10 | 2011-08-16 | 3M Innovative Properties Company | Electrical connector system |
US7850489B1 (en) | 2009-08-10 | 2010-12-14 | 3M Innovative Properties Company | Electrical connector system |
US7927144B2 (en) * | 2009-08-10 | 2011-04-19 | 3M Innovative Properties Company | Electrical connector with interlocking plates |
US7909646B2 (en) * | 2009-08-10 | 2011-03-22 | 3M Innovative Properties Company | Electrical carrier assembly and system of electrical carrier assemblies |
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USRE46958E1 (en) | 2011-10-24 | 2018-07-17 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
EP3413407B1 (en) | 2011-10-24 | 2023-06-07 | Ardent Concepts Inc. | Controlled-impedance cable termination using compliant interconnect elements |
USRE47459E1 (en) | 2011-10-24 | 2019-06-25 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
US20130330983A1 (en) * | 2012-06-10 | 2013-12-12 | Apple Inc. | Spring-loaded contacts having sloped backside with retention guide |
KR101403048B1 (ko) * | 2012-06-26 | 2014-06-09 | 주식회사 오킨스전자 | 고주파 특성을 갖는 반도체 디바이스 테스트소켓 |
TWI555987B (zh) * | 2014-01-28 | 2016-11-01 | Spring sleeve type probe and its manufacturing method | |
CN104280678B (zh) * | 2014-10-30 | 2018-11-27 | 通富微电子股份有限公司 | 半导体测试治具 |
CN106645809A (zh) * | 2016-10-14 | 2017-05-10 | 厦门大学 | 一种双重包覆壳层隔绝针尖的制备方法 |
US10705118B2 (en) * | 2017-03-23 | 2020-07-07 | Ford Global Technologies, Llc | Power module testing apparatus |
CN108663553B (zh) * | 2017-03-29 | 2022-01-25 | 上海中船电气有限公司 | 一种接触式半导体材料测试头 |
JP7346026B2 (ja) * | 2018-12-26 | 2023-09-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP7327659B2 (ja) * | 2020-04-22 | 2023-08-16 | 株式会社村田製作所 | 検査用コネクタ及び検査用ユニット |
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2001
- 2001-03-13 US US09/804,782 patent/US6447328B1/en not_active Expired - Fee Related
- 2001-12-11 WO PCT/US2001/047640 patent/WO2002073220A2/en active IP Right Grant
- 2001-12-11 JP JP2002572429A patent/JP4106273B2/ja not_active Expired - Fee Related
- 2001-12-11 DE DE60109499T patent/DE60109499T2/de not_active Expired - Lifetime
- 2001-12-11 EP EP01990085A patent/EP1368666B1/en not_active Expired - Lifetime
- 2001-12-11 KR KR1020037011837A patent/KR100831787B1/ko not_active IP Right Cessation
- 2001-12-11 CN CNB018230261A patent/CN1288449C/zh not_active Expired - Fee Related
- 2001-12-11 AT AT01990085T patent/ATE291234T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6447328B1 (en) | 2002-09-10 |
WO2002073220A3 (en) | 2003-04-03 |
ATE291234T1 (de) | 2005-04-15 |
CN1555489A (zh) | 2004-12-15 |
EP1368666A2 (en) | 2003-12-10 |
DE60109499D1 (de) | 2005-04-21 |
KR20030081513A (ko) | 2003-10-17 |
WO2002073220A2 (en) | 2002-09-19 |
JP2004530870A (ja) | 2004-10-07 |
EP1368666B1 (en) | 2005-03-16 |
KR100831787B1 (ko) | 2008-05-28 |
CN1288449C (zh) | 2006-12-06 |
US20020132514A1 (en) | 2002-09-19 |
DE60109499T2 (de) | 2006-04-13 |
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