JP2004530870A5 - - Google Patents
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- Publication number
- JP2004530870A5 JP2004530870A5 JP2002572429A JP2002572429A JP2004530870A5 JP 2004530870 A5 JP2004530870 A5 JP 2004530870A5 JP 2002572429 A JP2002572429 A JP 2002572429A JP 2002572429 A JP2002572429 A JP 2002572429A JP 2004530870 A5 JP2004530870 A5 JP 2004530870A5
- Authority
- JP
- Japan
- Prior art keywords
- ground
- probe
- grounding
- spring
- spring probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims 19
Claims (4)
- 接地スプリングプローブ(58)を信号プローブコネクタ(60)の接地シールド(64)に電気的に接続する接地装置であって、
信号プローブコネクタ(60)の接地シールド(64)と電気的に接触し、非線形穴(80、80’、80”、82、82’、82”)が内部を貫通する、導電性の接地要素(52、56)と、
該接地要素(52、56)の該非線形穴(80、80’、80”、82、82’、82”)に挿入される直線状の導電性の接地スプリングプローブ(58)であり、該接地要素(52、56)と電気的に接触し、該非線形穴(80、80’、80”、82、82’、82”)内で弾力的に変形されることにより、該接地スプリングプローブ(58)を該非線形穴(80、80’、80”、82、82’、82”)内に保持するために十分な、該接地要素(52、56)と該接地スプリングプローブ(58)との間のスプリング力をもたらす、接地スプリングプローブ(58)と、
を具備する接地装置。 - 複数の接地要素(52、56)をさらに具備し、該複数の接地要素(52、56)の各々が、関連する接地プローブ(58)を信号プローブコネクタ(60)の関連する接地シールド(64)と電気的に接続し、該接地要素(52、56)の各々が、その関連する接地プローブ(58)を弾力的に変形することにより、該接地要素(52、56)と該関連する接地プローブ(58)との間のスプリング力を維持する請求項1記載の接地装置。
- 第2接地スプリングプローブ(58)をさらに具備し、該第2接地スプリングプローブ(58)が、前記接地要素(52、56)によって弾力的に変形されることにより、該接地要素(52、56)と該第2接地スプリングプローブ(58)との間のスプリング力を維持する請求項1記載の接地装置。
- ハウジングにスプリングプローブ(58)を保持する方法であって、
該ハウジング内に、導電性の接地要素(52、56)を提供する工程と、
該接地要素(52、56)が、内部に延在する非線形穴(80、80’、80”、82、82’、82”)を有する工程と、
スプリングプローブ(58)を該非線形穴(80、80’、80”、82、82’、82”)に挿入し、該スプリングプローブ(58)が、該接地要素(52、56)の該非線形穴(80、80’、80”、82、82’、82”)によって弾力的に変形されることにより、該接地要素(52、56)と該スプリングプローブ(58)との間のスプリング力を維持するものである、工程と、
を含む方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/804,782 US6447328B1 (en) | 2001-03-13 | 2001-03-13 | Method and apparatus for retaining a spring probe |
PCT/US2001/047640 WO2002073220A2 (en) | 2001-03-13 | 2001-12-11 | Method and apparatus for retaining a spring probe |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004530870A JP2004530870A (ja) | 2004-10-07 |
JP2004530870A5 true JP2004530870A5 (ja) | 2005-12-22 |
JP4106273B2 JP4106273B2 (ja) | 2008-06-25 |
Family
ID=25189817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002572429A Expired - Fee Related JP4106273B2 (ja) | 2001-03-13 | 2001-12-11 | スプリングプローブを保持する方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6447328B1 (ja) |
EP (1) | EP1368666B1 (ja) |
JP (1) | JP4106273B2 (ja) |
KR (1) | KR100831787B1 (ja) |
CN (1) | CN1288449C (ja) |
AT (1) | ATE291234T1 (ja) |
DE (1) | DE60109499T2 (ja) |
WO (1) | WO2002073220A2 (ja) |
Families Citing this family (33)
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JP4053962B2 (ja) * | 2003-10-15 | 2008-02-27 | 株式会社東芝 | 半導体装置 |
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KR100600482B1 (ko) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | 반도체 패키지 측정용 프로브 |
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US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
US20100194419A1 (en) * | 2009-02-05 | 2010-08-05 | Chan Edward K | Multi-contact probe assembly |
US7850489B1 (en) | 2009-08-10 | 2010-12-14 | 3M Innovative Properties Company | Electrical connector system |
US7927144B2 (en) * | 2009-08-10 | 2011-04-19 | 3M Innovative Properties Company | Electrical connector with interlocking plates |
US7997933B2 (en) | 2009-08-10 | 2011-08-16 | 3M Innovative Properties Company | Electrical connector system |
US7909646B2 (en) * | 2009-08-10 | 2011-03-22 | 3M Innovative Properties Company | Electrical carrier assembly and system of electrical carrier assemblies |
US8905795B2 (en) | 2011-10-12 | 2014-12-09 | Apple Inc. | Spring-loaded contacts |
USRE46958E1 (en) | 2011-10-24 | 2018-07-17 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
CN106159502B (zh) | 2011-10-24 | 2018-11-30 | 安达概念股份有限公司 | 使用兼容的互连元件的控制阻抗电缆终端 |
USRE47459E1 (en) | 2011-10-24 | 2019-06-25 | Ardent Concepts, Inc. | Controlled-impedance cable termination using compliant interconnect elements |
US20130330983A1 (en) * | 2012-06-10 | 2013-12-12 | Apple Inc. | Spring-loaded contacts having sloped backside with retention guide |
KR101403048B1 (ko) * | 2012-06-26 | 2014-06-09 | 주식회사 오킨스전자 | 고주파 특성을 갖는 반도체 디바이스 테스트소켓 |
TWI555987B (zh) * | 2014-01-28 | 2016-11-01 | Spring sleeve type probe and its manufacturing method | |
CN104280678B (zh) * | 2014-10-30 | 2018-11-27 | 通富微电子股份有限公司 | 半导体测试治具 |
CN106645809A (zh) * | 2016-10-14 | 2017-05-10 | 厦门大学 | 一种双重包覆壳层隔绝针尖的制备方法 |
US10705118B2 (en) * | 2017-03-23 | 2020-07-07 | Ford Global Technologies, Llc | Power module testing apparatus |
CN108663553B (zh) * | 2017-03-29 | 2022-01-25 | 上海中船电气有限公司 | 一种接触式半导体材料测试头 |
JP7346026B2 (ja) | 2018-12-26 | 2023-09-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN218938344U (zh) * | 2020-04-22 | 2023-04-28 | 株式会社村田制作所 | 检查用连接器以及检查用单元 |
US11293976B1 (en) * | 2020-09-25 | 2022-04-05 | Essai, Inc. | Integrated circuit device test tooling with dual angle cavities |
US11942722B2 (en) | 2020-09-25 | 2024-03-26 | Apple Inc. | Magnetic circuit for magnetic connector |
US11437747B2 (en) | 2020-09-25 | 2022-09-06 | Apple Inc. | Spring-loaded contacts having capsule intermediate object |
KR102503437B1 (ko) * | 2021-04-26 | 2023-02-24 | 주식회사 에이플러스알에프 | 인쇄회로기판 테스트용 커넥터 |
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-
2001
- 2001-03-13 US US09/804,782 patent/US6447328B1/en not_active Expired - Fee Related
- 2001-12-11 CN CNB018230261A patent/CN1288449C/zh not_active Expired - Fee Related
- 2001-12-11 WO PCT/US2001/047640 patent/WO2002073220A2/en active IP Right Grant
- 2001-12-11 JP JP2002572429A patent/JP4106273B2/ja not_active Expired - Fee Related
- 2001-12-11 DE DE60109499T patent/DE60109499T2/de not_active Expired - Lifetime
- 2001-12-11 EP EP01990085A patent/EP1368666B1/en not_active Expired - Lifetime
- 2001-12-11 KR KR1020037011837A patent/KR100831787B1/ko not_active IP Right Cessation
- 2001-12-11 AT AT01990085T patent/ATE291234T1/de not_active IP Right Cessation
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