ATE330341T1 - Pin-grid-array elektrischer steckverbinder - Google Patents

Pin-grid-array elektrischer steckverbinder

Info

Publication number
ATE330341T1
ATE330341T1 AT02025604T AT02025604T ATE330341T1 AT E330341 T1 ATE330341 T1 AT E330341T1 AT 02025604 T AT02025604 T AT 02025604T AT 02025604 T AT02025604 T AT 02025604T AT E330341 T1 ATE330341 T1 AT E330341T1
Authority
AT
Austria
Prior art keywords
stud member
electrical connector
grid array
planar surface
terminal pin
Prior art date
Application number
AT02025604T
Other languages
English (en)
Inventor
Wayne Zahlit
Yakov Belopolsky
Original Assignee
Framatome Connectors Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Framatome Connectors Int filed Critical Framatome Connectors Int
Application granted granted Critical
Publication of ATE330341T1 publication Critical patent/ATE330341T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
AT02025604T 2001-11-20 2002-11-18 Pin-grid-array elektrischer steckverbinder ATE330341T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/989,648 US6638082B2 (en) 2001-11-20 2001-11-20 Pin-grid-array electrical connector

Publications (1)

Publication Number Publication Date
ATE330341T1 true ATE330341T1 (de) 2006-07-15

Family

ID=25535322

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02025604T ATE330341T1 (de) 2001-11-20 2002-11-18 Pin-grid-array elektrischer steckverbinder

Country Status (9)

Country Link
US (1) US6638082B2 (de)
EP (1) EP1313173B8 (de)
JP (1) JP2003217720A (de)
KR (1) KR20030041796A (de)
CN (1) CN1274068C (de)
AT (1) ATE330341T1 (de)
CA (1) CA2411119A1 (de)
DE (1) DE60212299T2 (de)
TW (1) TWI249270B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506456B2 (ja) * 2004-12-24 2010-07-21 住友電装株式会社 回路基板への基板用端子の取付構造
CN2833920Y (zh) * 2005-09-06 2006-11-01 番禺得意精密电子工业有限公司 电连接器
US7097465B1 (en) * 2005-10-14 2006-08-29 Hon Hai Precision Ind. Co., Ltd. High density connector with enhanced structure
TWI295868B (en) * 2005-11-23 2008-04-11 Delta Electronics Inc Connector and base thereof
US7226298B1 (en) 2006-03-29 2007-06-05 Fci Americas Technology, Inc. Electrical connector with segmented housing
US7553170B2 (en) * 2006-12-19 2009-06-30 Fci Americas Technology, Inc. Surface mount connectors
DE102014011703A1 (de) * 2014-08-07 2016-02-11 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Elektronische Baueinheit, insbesondere kapazitiver Näherungssensor
DE202018104958U1 (de) 2018-08-30 2018-09-12 Harting Electric Gmbh & Co. Kg Steckverbinder mit Komponenten aus verbessertem Material
CN111715999A (zh) * 2020-05-28 2020-09-29 南昌欧菲显示科技有限公司 半导体器件焊接装置及半导体器件焊接方法
US20220287179A1 (en) * 2021-03-04 2022-09-08 Raytheon Company Interconnect and Method for Manufacturing the Same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885076A (en) 1973-05-09 1975-05-20 Bell Telephone Labor Inc Electron beam generated patterns of metal-containing polymers
JPS6263683A (ja) 1985-09-13 1987-03-20 Ube Ind Ltd 模様を有するメツキ層の形成法
DE8630057U1 (de) * 1986-11-10 1987-01-02 Mentor Ing. Dr. Paul Mozar, 4006 Erkrath, De
US4882633A (en) 1987-01-09 1989-11-21 Canon Kabushiki Kaisha Video signal reproducing apparatus with memory
US4882200A (en) 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
JPS6435879A (en) * 1987-07-31 1989-02-06 Texas Instruments Japan Socket
US4977668A (en) * 1989-01-05 1990-12-18 Mckenzie Technology, Inc. Method of making socket connector
US5073124A (en) * 1990-07-20 1991-12-17 Amp Incorporated Electrical interconnection system utilizing fluid pressure deformed tubular contact
US5227588A (en) 1991-03-25 1993-07-13 Hughes Aircraft Company Interconnection of opposite sides of a circuit board
GB2273830B (en) * 1992-12-24 1997-04-16 Whitaker Corp Electrical contact elements for interposer structures
EP0694996A1 (de) 1994-07-22 1996-01-31 Connector Systems Technology N.V. Partiell metallisierter, aus Kunststoff geformter Verbinder mit "hold-down" Befestigung
EP0693795B1 (de) 1994-07-22 1999-03-17 Berg Electronics Manufacturing B.V. Selektiv metallisierter Verbinder mit mindestens einem koaxialen oder biaxialen Kontakt
EP0693796A1 (de) 1994-07-22 1996-01-24 Connector Systems Technology N.V. Verbinder mit Metallstreifen als Kontakte, und Verbinderanordnung mit diesen
PT782765E (pt) 1994-09-23 2000-12-29 Imec Inter Uni Micro Electr Embalagem matricial com saliencias de polimero
US6249048B1 (en) 1997-03-21 2001-06-19 Siemens N.V. Polymer stud grid array
DE4438872C1 (de) 1994-11-03 1995-12-07 Harting Elektronik Gmbh Koaxialer Winkelverbinder zur Montage auf einer Leiterplatte
US5590029A (en) * 1995-01-12 1996-12-31 Dell Usa, L.P. Circuit board SMT device mounting apparatus
TW267265B (en) 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
ATE211586T1 (de) 1995-10-16 2002-01-15 Siemens Nv Polymeres höcker-matrix-gehäuse für mikrowellen- schaltungsanordnungen
EP0856199B1 (de) 1995-10-16 2001-08-22 Siemens N.V. Polymeres höcker-matrix-gehäuse
US6042389A (en) 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6241535B1 (en) 1996-10-10 2001-06-05 Berg Technology, Inc. Low profile connector
US6083047A (en) 1997-01-16 2000-07-04 Berg Technology, Inc. Modular electrical PCB assembly connector
US6183301B1 (en) 1997-01-16 2001-02-06 Berg Technology, Inc. Surface mount connector with integrated PCB assembly
TW421335U (en) * 1998-12-24 2001-02-01 Hon Hai Prec Ind Co Ltd Receptacle connector
US6443749B2 (en) * 2000-03-28 2002-09-03 Intel Corporation Fixed position ZIF (zero insertion force) socket system

Also Published As

Publication number Publication date
JP2003217720A (ja) 2003-07-31
TW200303100A (en) 2003-08-16
EP1313173B8 (de) 2006-07-19
CN1274068C (zh) 2006-09-06
CA2411119A1 (en) 2003-05-20
US20030096513A1 (en) 2003-05-22
EP1313173B1 (de) 2006-06-14
KR20030041796A (ko) 2003-05-27
TWI249270B (en) 2006-02-11
EP1313173A3 (de) 2004-03-10
CN1421963A (zh) 2003-06-04
DE60212299T2 (de) 2007-06-06
EP1313173A2 (de) 2003-05-21
US6638082B2 (en) 2003-10-28
DE60212299D1 (de) 2006-07-27

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties