EP1722241A2 - High bandwidth probe assembly - Google Patents
High bandwidth probe assembly Download PDFInfo
- Publication number
- EP1722241A2 EP1722241A2 EP06119367A EP06119367A EP1722241A2 EP 1722241 A2 EP1722241 A2 EP 1722241A2 EP 06119367 A EP06119367 A EP 06119367A EP 06119367 A EP06119367 A EP 06119367A EP 1722241 A2 EP1722241 A2 EP 1722241A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- ground
- probe
- spring probe
- housing
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Definitions
- the present invention relates to spring probe block assemblies of the type used in Automatic Test Equipment (ATE), and specifically to spring probe block assemblies for use in high bandwidth applications.
- ATE Automatic Test Equipment
- Spring probe blocks are used to provide temporary spring contact interfaces between integrated circuits or other electronic equipment and the automated test equipment test head to run necessary tests of integrated circuits or other electronic equipment.
- Spring probe block assemblies of the type used in automatic test equipment are widely available and use generally similar designs.
- Spring probe block housings are typically machined from metal bar stock in a costly sequence of processes that assure precise location and diameter of the bores that accept press fitted coaxial probes and ground receptacles. The solid metal fabrication also serves to commonly ground all of the circuit elements, which until recently was considered desirable from a signal integrity perspective.
- Some spring probe block housings have also been made of a molded polymer instead of a machined metal.
- coaxial probe connectors are individually terminated to coaxial cables at one end and to spring probes at the other.
- one spring probe is provided for each signal line, and one or more spring probes are provided to serve as a reference (ground) for each signal line.
- coaxial shield tubes and ground spring probes associated with each signal line can be electrically isolated from their neighbors by the dielectric material of the polymer housing. This isolation of each channel (consisting of a signal line plus its associated ground return loop) is necessary to achieve higher bandwidths.
- the ability to work at high bandwidths is important because the next generation of automated test equipment will be used not only to test faster integrated circuits, but also to test integrated circuits more quickly.
- spring probe block assemblies are not suitable for use in high bandwidth applications because their designs suffer from one or more infirmities.
- many of the prior art spring probe block assemblies (specifically those made using a metal housing) provide a common ground for all of the ground probes.
- common grounding is not suitable for high bandwidth applications. Rather, for high bandwidth applications it is desired to have the signal probe and its associated ground probes electrically isolated from other coaxial signal and ground probes.
- FIG. 1A shows a prior art spring probe block assembly 10 that utilizes a polymer housing 12.
- the ground probes 14 and the signal probe 16 are inserted through holes 18 in the front of the polymer housing 12, with the ground probes 14 being received by box contacts 20.
- Box contacts 20 are soldered to the coaxial connector 22, which terminates coaxial cable 23 and receives the signal probe 16.
- the excessive length of the ground loop limits the bandwidth because of increased inductance.
- the ground loop 30 runs from the tip of signal probe 16, through ground probe 14 into box contact 20, along beams 32 of box contact 20, through the weld 34 and then along the conductive shield 36 of the coaxial connector 22.
- the length of the ground loop is worsened by the thickness of the polymer housing 12 through which the signal and ground probes 16, 14 must pass.
- tubular receptacles for receiving and retaining the ground spring probes are used.
- a tubular metal receptacle 44 is press fit into the bore 42, and then the ground spring probe 46 is inserted into the receptacle 44 where it is held in place by a press fit.
- the receptacle 44 is used to add compliance to the system and avoid damage to the ground spring probe 46, because the ground spring probe 46 itself has very little compliance.
- probe receptacles 44 adds the undesirable requirements of additional assembly steps and additional parts to be inventoried.
- the ground spring probe is manufactured with what is referred to as a "banana bend".
- the banana bend allows the ground spring probe to be inserted into an oversized bore and retained within the bore by a frictional fit.
- manufacturing a spring probe with a banana bend is difficult and costly, and requires that different types of spring probes be used for the signal and ground lines.
- the added manufacturing difficulty and cost, as well as the increased inventory is undesirable. In both of the above described situations, replacing a damaged ground spring probe if very difficult without damaging the remainder of the assembly.
- a spring probe block assembly that can provide a cost effective approach for providing electrically stable, low inductance paths between coaxial connectors and their ground probes.
- a spring probe block assembly would eliminate the need for ground probe receptacles (and their associated cost, assembly labor, and longer impedance path).
- the spring probe block assembly would not require the used of a ground spring probe having a banana bend when no ground probe receptacle is used.
- the spring probe block assembly would also facilitate the replacement of spring probes and coaxial connectors within the block assembly without requiring extensive rework or even scrapping of the entire spring probe block assembly.
- the spring probe block assembly would preferably be resistant to high cable pullout forces that could inadvertently dislodge the coaxial connectors during motion of the automated test equipment.
- the present invention provides a spring probe block assembly for use in high bandwidth applications.
- the spring probe block assembly described herein electrically isolates the signal probe and its associated ground probes from other coaxial signal and ground probes, and provides a low inductance return path for the signal.
- the spring probe block assembly also eliminates the need for ground receptacles or spring probes which utilize a banana bend.
- the spring probe block assembly comprises an insulative housing having a cavity in a front face of the housing.
- a conductive retainer is positioned in the cavity adjacent the front face of the housing.
- the conductive retainer has passages for receiving the probe connector and the ground probes.
- the conductive retainer electrically connects the ground probe and the conductive shell of the signal probe connector to provide a low inductance ground return path for the associated signal.
- the housing of the spring probe block assembly is formed of a dielectric insulative material which has either anti-static or static dissipative properties.
- the ground probes are retained within the conductive retainer by a normal force which is generated when the ground probe is inserted into the retainer.
- the normal force is generated as the ground probe is deflected by a ramped sidewall within the housing. As the ground probe is deflected by the ramped sidewall, the ground probe is frictionally retained in the assembly.
- the insertion of the ground probe into the retainer causes a clamping force to be generated on the probe connector body, thereby retaining the probe connector, retainer, ad ground probes in a fixed relationship.
- An additional aspect of the invention is a grounding element for electrically connecting a ground probe with a cable shield of a signal probe connector, wherein the ground probe is elastically deformed by the grounding element to maintain a spring force between the grounding element and the ground probe.
- the elastic deformation of the grounding element may be created, for example, by providing a bore having a non-linear axis into which the ground probe is inserted. As the ground probe is inserted into the bore having a non-linear axis, elastic deformation of the ground probe causes a spring force to be created and thereby retain the ground probe in position.
- Yet another aspect of the invention is a method for retaining a spring probe in a housing.
- the method comprises forming a bore having a non-linear axis in the housing, and then inserting a linear spring probe into the bore.
- the spring probe is elastically deformed and maintains a spring force between the housing and the spring probe, thereby maintaining the spring probe in its position.
- the present invention provides a cost effective approach for creating electrically stable, low inductance paths between coaxial connectors and their ground probes when used in spring probe block assemblies.
- the spring probe block assembly described herein allows easy replacement of components of the spring probe block assembly, without requiring extensive rework or scrapping of parts. Further, the design is resistant to inadvertent dislodging of the coaxial connectors when they are subject to high cable pullout forces during use.
- Fig. 3A provides a perspective view of one preferred embodiment of the spring probe block assembly described herein.
- spring probe block assembly 50 includes a housing 52 which is formed, such as by injection molding, from a suitable insulative polymer material, such as glass fiber reinforced polyphtalamide (PPA). In some intended applications of the probe block assembly, it may be preferred to use polymer materials that have anti-static properties, such as carbon fiber reinforced polyphtalamide.
- the housing 52 includes in its front face 53 cavities 54 which are shaped to receive ground plates 56 in a slip or press fit manner. The ground plates 56 are designed to receive and retain both ground spring probes 58 and probe connector 60. As can be seen more clearly in Figs.
- the probe connector 60 includes signal spring probe 61 which is surrounded by dielectric insulation 62 and then a conductive shield 64.
- the signal probe 61 is thus isolated from ground.
- the conductive shield 64 of the probe connector 60 is in intimate contact with the ground plate 56.
- Ground spring probes 58 are slidably received within openings 66 in the ground plate 56 and make contact with the ground plate 56 in a manner further described below.
- the dielectric material housing 52 surrounds and isolates the ground elements (ground plate 56 and ground spring probes 58) and their associated signal line from every other ground and signal line pairing. All grounds in the assembly are also insulated from other probe block assemblies which may be adjacent, as well as from the automated test equipment chassis ground.
- Fig. 4A shows a greatly enlarged cross-sectional view of the spring probe block assembly 50 with a single coaxial probe connector 60 and its associated signal and ground probes 61, 58, respectively.
- Figs. 4B and 4C illustrate exploded and assembled views, respectively, of ground plate 56, ground spring probes 58 and probe connector 60.
- the cavity 54 extends into the housing 52 and conforms to the general envelope of an assembled set of grounding elements, with the cavity 54 dimensioned in such a manner as to constrain the axial and lateral movement of the assembled probe connector 60, ground plate 56 and spring probes 58, 61.
- the ground plates 56 each have an opening 68 sized to receive conductive shield 64 of probe connector 60 and retain it by press-fit, where the interference between the probe connector 60 and the opening 58 in ground plate 56 preferably results in elastic deformation of the ground plate 56. Permitting elastic deformation of the ground plate 56 is preferred because probe connector 60 has very little compliance, and making the ground plate 56 compliant effectively doubles the number of compliant members from one to two. This permits the use of less stringent tolerances in the components, and therefore increases the manufacturability of the probe block assembly 50.
- ground plates 56 are seated in housing 52 such that the front faces 69 of the ground plates 56 are flush with the front face 53 of housing 52.
- front faces 69 of ground plates 56 may protrude slightly forward of front face 53 of housing 52, The seating depth of ground plates 56 may be controlled by the position of shoulders 71 in the cavity 54.
- the ground plates 56 are preferably symmetrical so they may be inserted into the cavities 54 in the housing 52 without requiring a specific orientation.
- the ground plates 56 preferably have a thickness sufficient to prevent significant bending of the ground spring probe bodies 74 in the area of the spring probe plunger travel when the ground spring probe body 74 is deformed by contact with the ramped side wall 72 of the housing 52.
- the ground plates 56 are provided with open channels 80 which bisect the ground spring probe thru-holes 66 to enhance flow of plating process fluids through the holes 66 during the manufacturing process.
- the ground spring probe thru-holes 66 are preferably spaced to compensate for the angular displacement of the ground spring probe tips 59 when the ground spring probe bodies are displaced by bending against the ramped side wall 72 of the housing 52 when they are inserted into the assembly. Further, the ground spring probe tips 59 are preferably disposed at an angle with respect to the axis of the signal probe connector 60 at an angle of 3 degrees or less to minimize the internal contact resistance within ground spring probe 58 and to avoid increasing wear during prolonged cycling of the assembly.
- the ground plates 56 have at least one thru-hole 66 sized to allow the slip-fit passage of a ground spring probe 58.
- the ground spring probes 58 seat against an end wall 70 of the cavity 54 in the housing 52.
- the cavity 54 in housing 52 includes a ramped side wall 72 which progressively interferes with the ground spring probe body 74 during its insertion so that the interference between the ground spring probe body 74 and the ramped side wall 72 elastically deforms the ground spring probe body 74, as seen in Fig. 4A.
- the interference between the ground spring probe body 74 and the ramped side wall 72 maintains a normal force between the ground spring probe body 74 and the ground plate 56 at two points 76.
- An optional third point of contact 76' may be obtained by increasing the slope of the ramped side wall 72 to force the end of the ground spring probe body 74 against the signal probe connector body shield 64.
- Ground spring probe body 74 may be deflected and retained within ground plate 56 by means other than contact with ramped side wall 72 as described above.
- ground plate 56 may be provided with bore geometry for maintaining a normal force against the ground spring probe 58 without the use of ramped side wall 72 in housing 52.
- ground plate 56 may have a first bore 80 extending from front face 200, and a second bore 82 extending from back face 201, where first and second bores 80, 82 are slightly offset from each other.
- ground spring probe body 74 As ground spring probe body 74 is inserted from front face 200 into first bore 80 and then into second bore 82, ground spring probe body 74 is deflected, causing ground spring probe body to exert a normal force against ground plate 56 and thereby be held in place by a frictional fit.
- ground plate 56 may alternately have first bore 80' extending from front face 200, and a second bore 82' extending from back face 201, where second bore 82' is positioned at an angle relative to first bore 80.
- ground spring probe body 74 when ground spring probe body 74 is inserted from front face 200 into first bore 80' and then into second bore 82', ground spring probe body 74 is deflected, a normal force results, and ground spring probe body 74 is held by a frictional fit.
- ground plate 56 may optionally be formed from a front portion 86 and a back portion 88, where a first bore 80" extends through front portion 86 from front face 200, and a second bore 82" extends through back portion 80 from back face 201.
- front and back portions 86,88, respectively of the ground plate are aligned such that first and second bores 80",82" are slightly offset from each other.
- ground spring probe body 74 is inserted from front face 200 into first bore 80" and then into second bore 82"
- ground spring probe body 74 is deflected, a normal force is generated, and ground spring probe body 74 is held by a frictional fit.
- Figs. 5A-5C may also be used in probe assemblies that have metal housings and that do not use ground plates or retainers as described above.
- the spring probe retention methods illustrated in Figs. 5A-5C may be used in metal housings to secure ground probes in the housing without the use of receptacles or the need for pre-formed "banana-bends" n the ground probes.
- Those skilled in the art will recognize that eliminating the need for receptacles or pre-formed banana-bends simplifies manufacturability and reduces the cost of the probe assemblies, and is therefore highly desirable.
- the housing 52 may be provided with access holes 90 which communicate with the ground probe body seats 70 to allow a tool (not shown) access to the back of the ground spring probe bodies 74. Such tool access would facilitate ground spring probe removal, such as when a spring plunger breaks during use.
- Optional access holes 90 would be sealed when used in applications requiring vacuum sealing of the device. Vacuum sealing may be accomplished by providing a removable plug for filling access holes 90.
- sealing capabilities may also be provided within the bore 104 of cavities 54, such as shown in Figs. 6A and 6B.
- the sealing capabilities are preferably provided by a single molded insert 100 of pliable polymer that includes a collar portion 102 designed to fit within the bore 104 of the cavity at the back face of housing 52. As seen in Fig. 6A, when the probe connector 60 is inserted into the housing 52, the probe connector 60 would press the collar 102 of compliant insert 100 against the walls of bore 104 and thereby provide a reliable seal.
- the distance from the front face 53 of the housing 52 to the ground spring probe contact point 76 in the housing 52 is minimized and is close to zero. That is, the ground spring probe body 74 contacts the ground plate 56 as close to the front face 53 of the housing as is possible, thereby resulting in a very low inductance ground path.
- a low inductance ground path is highly desired, and in fact required, for many high bandwidth applications.
- the prior art spring probe block assemblies utilize much longer electrical paths, and therefore have higher self inductance, rendering them unsuitable for high speed testing capabilities.
- the above described spring probe block assembly also has the advantage of being easy to assemble, rework and repair. Because the polymer housing described herein utilizes compliant members to hold the spring probe bodies in place and in electrical contact with each other, it is easy to assemble the spring probe block assembly or to replace those parts that may be worn out or broken. Thus, the spring probe block assembly described herein not only eliminates parts which must be discarded when damaged during the assembly process, it also allows relatively inexpensive parts to be replaced, rather than requiring the entire assembly to be discarded.
- the present invention allows effective sealing by locating sealing rings as described above in each housing cavity around each probe connector 60.
- the sealing compression is maintained by the spatial relationships among the components. Sealing around the ground probes 58 is not required, because the housing 52 allows the vacuum seal to be placed behind the position of the ground probes 58.
- the spring probe block assembly 150 includes an insulative housing 152, signal probe contacts 161 and ground probe contacts 158, and probe connector retainers 156.
- the housing 152 is a molded dielectric material, where the dielectric material surrounds and isolates the ground elements and associated signal line from every other signal line and ground pairing, and further insulates all grounds in the assembly from other adjacent probe block assemblies and the automated test equipment chassis ground.
- the cored cavities in both ends of the housing 152 conform to the general envelope of an assembled set of ground elements, with the cavities dimensioned to constrain axial and lateral movement of the assembled probe connectors and ground clamps when the spring probes are installed therein.
- probe retainer 156 comprises a pair of stamped electrical ground clamps 180 which engage each other to form a clamping device to receive the signal probe connector 160 and ground probes 158.
- the ground clamps 180 have centrally located loops 182 in axial alignment and a pair of spring arms 184 extending from each of two ends.
- the ground clamp subassembly is preferably symmetrical, such that it may be inserted into the cavity of the housing 152 without a specific orientation, thereby increasing the ease of assembly.
- the loops 182 of the ground clamps 180 are sized to receive a signal spring probe connector 160 which is slidably engaged with a low insertion force (less than 7 lbs.).
- ground spring probes 158 When ground spring probes 158 are inserted between the spring arms 184, the arms 184 are outwardly displaced and generate a normal force against the signal spring probe connector body 60, thereby retaining the assembled elements in place.
- one of the loops 182 of the ground clamps 180 is located behind the press ring 183 of the signal probe connector 160, thereby improving the pullout resistance of the device.
- the spring arms 184 of the ground clamps 180 are outwardly angled in a scissors-like manner such that when ground probe 158 is inserted therebetween a clamping force urges the ground probe 158 against an axial groove 190 of the housing 152, thereby establishing the proper alignment of the ground probe 158 within the housing 152.
- the included angle ⁇ defined by the spring arms 184 is preferably greater than 22 degrees.
- the side walls of the cavity in the housing preferably support the spring arms 184 of the ground clamps 180 in a preloaded condition, such that the preload on the spring arms 184 increases the open area between the spring arms 184, thereby facilitating the insertion of the ground probe 158.
- Such preload also would increase the entry angle between the spring arm lead-in chamfers 192, thereby decreasing the required insertion force.
- the spring arms 184' of the ground clamps 180' are curved back toward each other so as to substantially surround the ground probe 158 when ground probe 158 is inserted into the ground clamps 180'.
- a clamping force tightens the ground clamps 180' about the body of signal probe connector 160.
- the individual ground clamps 180' may be formed with optional connecting webs which allow the simple folding of the ground clamps 180'to obtain the final orientation of the elements.
- the optional connecting web securing the ground clamps together may be frangible, if desired, or may be malleable.
- retainers 200 are preferably provided which secure to the back face 184 of the housing 152 in a snap-fitting arrangement, as seen in Figs. 9A and 9B.
- the retainers 200 preferably have latching arms 202 to engage reciprocal latching features 204 of the housing 152.
- the retainers 200 would preferably be formed as two pieces that have mating tongues 204 and grooves 206 that interlock the two retainer pieces 200 together.
- the housing 152 would preferably have an offset cavity in the back end of the housing with respect to the pattern of cavities that accept the probe connectors, thereby allowing the use of identical retainer parts. This would reduce the cost of manufacture and increase the ease of assembly of the device.
- the housing 152 would include passageways 208 that open to the latching arms 202 of the retainers 200, such that the retainers 200 may be disengaged from the outside of the housing 152 for rework on the device.
- the housing 52,152 of the assembly will preferably be provided with mounting holes 210 so that the spring probe block assemblies 50,150 may be mounted in an automated test equipment head.
- the retainer elements ground plates 56 and ground clamps 180,180'
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Abstract
Description
- The present invention relates to spring probe block assemblies of the type used in Automatic Test Equipment (ATE), and specifically to spring probe block assemblies for use in high bandwidth applications.
- Spring probe blocks are used to provide temporary spring contact interfaces between integrated circuits or other electronic equipment and the automated test equipment test head to run necessary tests of integrated circuits or other electronic equipment. Spring probe block assemblies of the type used in automatic test equipment are widely available and use generally similar designs. Spring probe block housings are typically machined from metal bar stock in a costly sequence of processes that assure precise location and diameter of the bores that accept press fitted coaxial probes and ground receptacles. The solid metal fabrication also serves to commonly ground all of the circuit elements, which until recently was considered desirable from a signal integrity perspective. Some spring probe block housings have also been made of a molded polymer instead of a machined metal.
- With both the metal and polymer probe block housings, coaxial probe connectors are individually terminated to coaxial cables at one end and to spring probes at the other. Typically, one spring probe is provided for each signal line, and one or more spring probes are provided to serve as a reference (ground) for each signal line. In the case of polymer spring probe housings, coaxial shield tubes and ground spring probes associated with each signal line can be electrically isolated from their neighbors by the dielectric material of the polymer housing. This isolation of each channel (consisting of a signal line plus its associated ground return loop) is necessary to achieve higher bandwidths.
- The ability to work at high bandwidths is important because the next generation of automated test equipment will be used not only to test faster integrated circuits, but also to test integrated circuits more quickly.
- Many currently available spring probe block assemblies are not suitable for use in high bandwidth applications because their designs suffer from one or more infirmities. In particular, many of the prior art spring probe block assemblies (specifically those made using a metal housing) provide a common ground for all of the ground probes. As discussed above, common grounding is not suitable for high bandwidth applications. Rather, for high bandwidth applications it is desired to have the signal probe and its associated ground probes electrically isolated from other coaxial signal and ground probes.
- Many of the prior art designs (those using both metal and polymer housings) are also unsuitable for use in high bandwidth applications because of the presence of excessively large ground return loops. Fig. 1A shows a prior art spring
probe block assembly 10 that utilizes apolymer housing 12. Theground probes 14 and thesignal probe 16 are inserted throughholes 18 in the front of thepolymer housing 12, with theground probes 14 being received bybox contacts 20.Box contacts 20 are soldered to thecoaxial connector 22, which terminatescoaxial cable 23 and receives thesignal probe 16. - As is illustrated in Fig. 1B, the excessive length of the ground loop (illustrated by dashed line 30) limits the bandwidth because of increased inductance. The
ground loop 30 runs from the tip ofsignal probe 16, throughground probe 14 intobox contact 20, alongbeams 32 ofbox contact 20, through the weld 34 and then along theconductive shield 36 of thecoaxial connector 22. The length of the ground loop is worsened by the thickness of thepolymer housing 12 through which the signal andground probes - It is well known that at high speeds, the inductance of a given return current path is far more significant than its resistance. In fact, high-speed return currents follow the path of least inductance, not the path of least resistance. Further, it is well know that the lowest inductance return path lies directly under a signal conductor. This means that minimizing the total ground loop area between the outgoing and returning current paths will lead to the lowest possible inductance. Thus, in Fig. 1B, an ideal ground loop is illustrated by dashed
line 38. (See High Speed Digital Design: A Handbook of Black Magic by Howard Johnson and Martin Graham). - In addition to the above infirmities, many available designs of spring probe block assemblies require additional components or manufacturing steps to retain the ground spring probe in the assembly, In some instances, tubular receptacles for receiving and retaining the ground spring probes are used. For example, as shown in Fig. 2, in a metal spring
probe block housing 40, after abore 42 is machined into the housing 40 atubular metal receptacle 44 is press fit into thebore 42, and then theground spring probe 46 is inserted into thereceptacle 44 where it is held in place by a press fit. Thereceptacle 44 is used to add compliance to the system and avoid damage to theground spring probe 46, because theground spring probe 46 itself has very little compliance. The use ofprobe receptacles 44 adds the undesirable requirements of additional assembly steps and additional parts to be inventoried. In other instances where a tubular receptacle is not used, the ground spring probe is manufactured with what is referred to as a "banana bend". The banana bend allows the ground spring probe to be inserted into an oversized bore and retained within the bore by a frictional fit. However, manufacturing a spring probe with a banana bend is difficult and costly, and requires that different types of spring probes be used for the signal and ground lines. Clearly, the added manufacturing difficulty and cost, as well as the increased inventory is undesirable. In both of the above described situations, replacing a damaged ground spring probe if very difficult without damaging the remainder of the assembly. - Clearly, what is needed is a spring probe block assembly that can provide a cost effective approach for providing electrically stable, low inductance paths between coaxial connectors and their ground probes. Preferably, such a spring probe block assembly would eliminate the need for ground probe receptacles (and their associated cost, assembly labor, and longer impedance path). In addition, the spring probe block assembly would not require the used of a ground spring probe having a banana bend when no ground probe receptacle is used. Preferably, the spring probe block assembly would also facilitate the replacement of spring probes and coaxial connectors within the block assembly without requiring extensive rework or even scrapping of the entire spring probe block assembly. In addition, the spring probe block assembly would preferably be resistant to high cable pullout forces that could inadvertently dislodge the coaxial connectors during motion of the automated test equipment.
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- FIG. 1A is a cross-sectional view of a prior art spring probe block assembly;
- FIG. 1B is a greatly enlarged perspective view of the probe connector and ground probe assembly of the spring probe block assembly of Fig. 1A;
- FIG. 2 is a perspective view of another prior art spring probe block assembly;
- FIG. 3A is a perspective view of one embodiment of the inventive spring probe block assembly described herein;
- FIG. 3B is an elevational view of the front face of the spring probe block assembly of Fig. 3A;
- FIG. 3C is a greatly enlarged view of a portion of the front face of the spring probe block assembly of Fig. 3A;
- FIG. 4A is a cross-sectional view taken along line 4-4 of Fig. 3B;
- FIGS. 4B and 4C are explodes and assembled views, respectively, of the ground plate, probe connector and ground probes shown in Fig. 4A;
- FIGS. 5A-5C are cross-sectional illustrations of alternate spring probe retention configurations;
- FIG. 6A is a cross-sectional view of a spring probe block assembly having optional vacuum sealing;
- FIG. 6B is a perspective view of a molded insert for providing optional vacuum sealing;
- FIG. 7A is an elevational view of the front face of an alternate embodiment of the inventive spring probe block assembly described herein;
- FIG, 7B is a greatly enlarged view of the conductive retainer element of Fig. 7A;
- FIGS. 8A and 8B are perspective views of an alternate embodiment of the conductive retainer element of the spring probe block assembly described herein;
- FIG. 8C is a greatly enlarged view of the conductive retainer element of Figs. 8A and 8B;
- FIGS. 9A and 9B are perspective views showing retainers used in the embodiments of FIG. 7A, 8A and 8B.
- The present invention provides a spring probe block assembly for use in high bandwidth applications. The spring probe block assembly described herein electrically isolates the signal probe and its associated ground probes from other coaxial signal and ground probes, and provides a low inductance return path for the signal. The spring probe block assembly also eliminates the need for ground receptacles or spring probes which utilize a banana bend.
- In a preferred embodiment, the spring probe block assembly comprises an insulative housing having a cavity in a front face of the housing. A conductive retainer is positioned in the cavity adjacent the front face of the housing. The conductive retainer has passages for receiving the probe connector and the ground probes. The conductive retainer electrically connects the ground probe and the conductive shell of the signal probe connector to provide a low inductance ground return path for the associated signal. Preferably, the housing of the spring probe block assembly is formed of a dielectric insulative material which has either anti-static or static dissipative properties.
- In one embodiment, the ground probes are retained within the conductive retainer by a normal force which is generated when the ground probe is inserted into the retainer. The normal force is generated as the ground probe is deflected by a ramped sidewall within the housing. As the ground probe is deflected by the ramped sidewall, the ground probe is frictionally retained in the assembly. In another embodiment, the insertion of the ground probe into the retainer causes a clamping force to be generated on the probe connector body, thereby retaining the probe connector, retainer, ad ground probes in a fixed relationship.
- An additional aspect of the invention is a grounding element for electrically connecting a ground probe with a cable shield of a signal probe connector, wherein the ground probe is elastically deformed by the grounding element to maintain a spring force between the grounding element and the ground probe. The elastic deformation of the grounding element may be created, for example, by providing a bore having a non-linear axis into which the ground probe is inserted. As the ground probe is inserted into the bore having a non-linear axis, elastic deformation of the ground probe causes a spring force to be created and thereby retain the ground probe in position.
- Yet another aspect of the invention is a method for retaining a spring probe in a housing. The method comprises forming a bore having a non-linear axis in the housing, and then inserting a linear spring probe into the bore. By inserting the linear spring probe into the non-linear bore, the spring probe is elastically deformed and maintains a spring force between the housing and the spring probe, thereby maintaining the spring probe in its position.
- The present invention provides a cost effective approach for creating electrically stable, low inductance paths between coaxial connectors and their ground probes when used in spring probe block assemblies. The spring probe block assembly described herein allows easy replacement of components of the spring probe block assembly, without requiring extensive rework or scrapping of parts. Further, the design is resistant to inadvertent dislodging of the coaxial connectors when they are subject to high cable pullout forces during use.
- Fig. 3A provides a perspective view of one preferred embodiment of the spring probe block assembly described herein. As seen in Fig. 3A, spring
probe block assembly 50 includes ahousing 52 which is formed, such as by injection molding, from a suitable insulative polymer material, such as glass fiber reinforced polyphtalamide (PPA). In some intended applications of the probe block assembly, it may be preferred to use polymer materials that have anti-static properties, such as carbon fiber reinforced polyphtalamide. Thehousing 52 includes in itsfront face 53cavities 54 which are shaped to receiveground plates 56 in a slip or press fit manner. Theground plates 56 are designed to receive and retain both ground spring probes 58 andprobe connector 60. As can be seen more clearly in Figs. 3B and 3C, theprobe connector 60 includessignal spring probe 61 which is surrounded bydielectric insulation 62 and then aconductive shield 64. Thesignal probe 61 is thus isolated from ground. Theconductive shield 64 of theprobe connector 60 is in intimate contact with theground plate 56. Ground spring probes 58 are slidably received withinopenings 66 in theground plate 56 and make contact with theground plate 56 in a manner further described below. As can be seen, thedielectric material housing 52 surrounds and isolates the ground elements (ground plate 56 and ground spring probes 58) and their associated signal line from every other ground and signal line pairing. All grounds in the assembly are also insulated from other probe block assemblies which may be adjacent, as well as from the automated test equipment chassis ground. - Fig. 4A shows a greatly enlarged cross-sectional view of the spring
probe block assembly 50 with a singlecoaxial probe connector 60 and its associated signal and ground probes 61, 58, respectively. For additional clarity, Figs. 4B and 4C illustrate exploded and assembled views, respectively, ofground plate 56, ground spring probes 58 andprobe connector 60. As can be seen in Fig. 4A, thecavity 54 extends into thehousing 52 and conforms to the general envelope of an assembled set of grounding elements, with thecavity 54 dimensioned in such a manner as to constrain the axial and lateral movement of the assembledprobe connector 60,ground plate 56 and spring probes 58, 61. In particular, theground plates 56 each have an opening 68 sized to receiveconductive shield 64 ofprobe connector 60 and retain it by press-fit, where the interference between theprobe connector 60 and theopening 58 inground plate 56 preferably results in elastic deformation of theground plate 56. Permitting elastic deformation of theground plate 56 is preferred becauseprobe connector 60 has very little compliance, and making theground plate 56 compliant effectively doubles the number of compliant members from one to two. This permits the use of less stringent tolerances in the components, and therefore increases the manufacturability of theprobe block assembly 50. - As discussed above, in high bandwidth applications it is desired to provide a low inductance ground return path in the probe assembly. Thus, it is preferred to position the
ground plates 56 as far forward as possible in thehousing 52 such that the ground return path is shortened and maintained in close proximity to the signal path. Therefore, in a preferred embodiment, theground plates 56 are seated inhousing 52 such that the front faces 69 of theground plates 56 are flush with thefront face 53 ofhousing 52. Alternately, front faces 69 ofground plates 56 may protrude slightly forward offront face 53 ofhousing 52, The seating depth ofground plates 56 may be controlled by the position ofshoulders 71 in thecavity 54. - The
ground plates 56 are preferably symmetrical so they may be inserted into thecavities 54 in thehousing 52 without requiring a specific orientation. In addition, theground plates 56 preferably have a thickness sufficient to prevent significant bending of the groundspring probe bodies 74 in the area of the spring probe plunger travel when the groundspring probe body 74 is deformed by contact with the rampedside wall 72 of thehousing 52. In a preferred design, theground plates 56 are provided withopen channels 80 which bisect the ground spring probe thru-holes 66 to enhance flow of plating process fluids through theholes 66 during the manufacturing process. The ground spring probe thru-holes 66 are preferably spaced to compensate for the angular displacement of the groundspring probe tips 59 when the ground spring probe bodies are displaced by bending against the rampedside wall 72 of thehousing 52 when they are inserted into the assembly. Further, the groundspring probe tips 59 are preferably disposed at an angle with respect to the axis of thesignal probe connector 60 at an angle of 3 degrees or less to minimize the internal contact resistance withinground spring probe 58 and to avoid increasing wear during prolonged cycling of the assembly. - As noted above, the
ground plates 56 have at least one thru-hole 66 sized to allow the slip-fit passage of aground spring probe 58. The ground spring probes 58 seat against anend wall 70 of thecavity 54 in thehousing 52. Preferably, thecavity 54 inhousing 52 includes a rampedside wall 72 which progressively interferes with the groundspring probe body 74 during its insertion so that the interference between the groundspring probe body 74 and the rampedside wall 72 elastically deforms the groundspring probe body 74, as seen in Fig. 4A. The interference between the groundspring probe body 74 and the rampedside wall 72 maintains a normal force between the groundspring probe body 74 and theground plate 56 at twopoints 76. An optional third point of contact 76' may be obtained by increasing the slope of the rampedside wall 72 to force the end of the groundspring probe body 74 against the signal probeconnector body shield 64. - Ground
spring probe body 74 may be deflected and retained withinground plate 56 by means other than contact with rampedside wall 72 as described above. Specifically,ground plate 56 may be provided with bore geometry for maintaining a normal force against theground spring probe 58 without the use of rampedside wall 72 inhousing 52. As illustrated in Fig. 5A,ground plate 56 may have afirst bore 80 extending fromfront face 200, and asecond bore 82 extending from back face 201, where first andsecond bores spring probe body 74 is inserted fromfront face 200 intofirst bore 80 and then intosecond bore 82, groundspring probe body 74 is deflected, causing ground spring probe body to exert a normal force againstground plate 56 and thereby be held in place by a frictional fit. As illustrated in Fig. 5B,ground plate 56 may alternately have first bore 80' extending fromfront face 200, and a second bore 82' extending from back face 201, where second bore 82' is positioned at an angle relative tofirst bore 80. As described above, when groundspring probe body 74 is inserted fromfront face 200 into first bore 80' and then into second bore 82', groundspring probe body 74 is deflected, a normal force results, and groundspring probe body 74 is held by a frictional fit. As illustrated in Fig. 5C,ground plate 56 may optionally be formed from afront portion 86 and aback portion 88, where afirst bore 80" extends throughfront portion 86 fromfront face 200, and asecond bore 82" extends throughback portion 80 from back face 201. When assembled in thehousing 52, front andback portions second bores 80",82" are slightly offset from each other. Again, as groundspring probe body 74 is inserted fromfront face 200 intofirst bore 80" and then intosecond bore 82", groundspring probe body 74 is deflected, a normal force is generated, and groundspring probe body 74 is held by a frictional fit. - It will be recognized that the designs illustrated in Figs. 5A-5C may also be used in probe assemblies that have metal housings and that do not use ground plates or retainers as described above. Specifically, the spring probe retention methods illustrated in Figs. 5A-5C may be used in metal housings to secure ground probes in the housing without the use of receptacles or the need for pre-formed "banana-bends" n the ground probes. Those skilled in the art will recognize that eliminating the need for receptacles or pre-formed banana-bends simplifies manufacturability and reduces the cost of the probe assemblies, and is therefore highly desirable.
- Additional features may be provided to the spring probe block assembly. For example, the
housing 52 may be provided with access holes 90 which communicate with the ground probe body seats 70 to allow a tool (not shown) access to the back of the groundspring probe bodies 74. Such tool access would facilitate ground spring probe removal, such as when a spring plunger breaks during use. Optional access holes 90 would be sealed when used in applications requiring vacuum sealing of the device. Vacuum sealing may be accomplished by providing a removable plug for filling access holes 90. - If vacuum sealing of a device is desired, optional sealing capabilities may also be provided within the
bore 104 ofcavities 54, such as shown in Figs. 6A and 6B. The sealing capabilities are preferably provided by a single moldedinsert 100 of pliable polymer that includes acollar portion 102 designed to fit within thebore 104 of the cavity at the back face ofhousing 52. As seen in Fig. 6A, when theprobe connector 60 is inserted into thehousing 52, theprobe connector 60 would press thecollar 102 ofcompliant insert 100 against the walls ofbore 104 and thereby provide a reliable seal. In addition to the single moldedinsert 100 shown in Figs. 6A and 6B, it would also be possible to provide individual collars or o-rings within each of thebores 104 of thecavity 52 to provide sealing. However, the use of individual o-rings would greatly increase the assembly time of the device, as well as be more easily displaced during insertion of theprobe connector 60. - In the spring
probe block assembly 50 described herein, the distance from thefront face 53 of thehousing 52 to the ground springprobe contact point 76 in thehousing 52 is minimized and is close to zero. That is, the groundspring probe body 74 contacts theground plate 56 as close to thefront face 53 of the housing as is possible, thereby resulting in a very low inductance ground path. As discussed above, a low inductance ground path is highly desired, and in fact required, for many high bandwidth applications. The prior art spring probe block assemblies utilize much longer electrical paths, and therefore have higher self inductance, rendering them unsuitable for high speed testing capabilities. - The above described spring probe block assembly also has the advantage of being easy to assemble, rework and repair. Because the polymer housing described herein utilizes compliant members to hold the spring probe bodies in place and in electrical contact with each other, it is easy to assemble the spring probe block assembly or to replace those parts that may be worn out or broken. Thus, the spring probe block assembly described herein not only eliminates parts which must be discarded when damaged during the assembly process, it also allows relatively inexpensive parts to be replaced, rather than requiring the entire assembly to be discarded.
- In applications where it is required that the spring probe block assembly must be sealed against a vacuum, the present invention allows effective sealing by locating sealing rings as described above in each housing cavity around each
probe connector 60. The sealing compression is maintained by the spatial relationships among the components. Sealing around the ground probes 58 is not required, because thehousing 52 allows the vacuum seal to be placed behind the position of the ground probes 58. - An alternate embodiment of a spring
probe block assembly 150 is shown in Fig. 7A. The springprobe block assembly 150 includes aninsulative housing 152,signal probe contacts 161 andground probe contacts 158, andprobe connector retainers 156. As in the first described embodiment, thehousing 152 is a molded dielectric material, where the dielectric material surrounds and isolates the ground elements and associated signal line from every other signal line and ground pairing, and further insulates all grounds in the assembly from other adjacent probe block assemblies and the automated test equipment chassis ground. As described above, the cored cavities in both ends of thehousing 152 conform to the general envelope of an assembled set of ground elements, with the cavities dimensioned to constrain axial and lateral movement of the assembled probe connectors and ground clamps when the spring probes are installed therein. - As seen in Fig. 7A and 7B,
probe retainer 156 comprises a pair of stamped electrical ground clamps 180 which engage each other to form a clamping device to receive thesignal probe connector 160 and ground probes 158. The ground clamps 180 have centrally locatedloops 182 in axial alignment and a pair ofspring arms 184 extending from each of two ends. The ground clamp subassembly is preferably symmetrical, such that it may be inserted into the cavity of thehousing 152 without a specific orientation, thereby increasing the ease of assembly. Theloops 182 of the ground clamps 180 are sized to receive a signalspring probe connector 160 which is slidably engaged with a low insertion force (less than 7 lbs.). When ground spring probes 158 are inserted between thespring arms 184, thearms 184 are outwardly displaced and generate a normal force against the signal springprobe connector body 60, thereby retaining the assembled elements in place. Preferably, one of theloops 182 of the ground clamps 180 is located behind thepress ring 183 of thesignal probe connector 160, thereby improving the pullout resistance of the device. - In the embodiment of Figs. 7A and 7B, the
spring arms 184 of the ground clamps 180 are outwardly angled in a scissors-like manner such that whenground probe 158 is inserted therebetween a clamping force urges theground probe 158 against anaxial groove 190 of thehousing 152, thereby establishing the proper alignment of theground probe 158 within thehousing 152. The included angle φ defined by thespring arms 184 is preferably greater than 22 degrees. In addition, the side walls of the cavity in the housing preferably support thespring arms 184 of the ground clamps 180 in a preloaded condition, such that the preload on thespring arms 184 increases the open area between thespring arms 184, thereby facilitating the insertion of theground probe 158. Such preload also would increase the entry angle between the spring arm lead-inchamfers 192, thereby decreasing the required insertion force. - In an alternate embodiment shown in Figs. 8A and 8B, the spring arms 184' of the ground clamps 180' are curved back toward each other so as to substantially surround the
ground probe 158 whenground probe 158 is inserted into the ground clamps 180'. When aground probe 158 is inserted into the ground probe-receiving portion of the ground clamps 180', a clamping force tightens the ground clamps 180' about the body ofsignal probe connector 160. If desired, the individual ground clamps 180' may be formed with optional connecting webs which allow the simple folding of the ground clamps 180'to obtain the final orientation of the elements. The optional connecting web securing the ground clamps together may be frangible, if desired, or may be malleable. - To increase the cable pullout force,
retainers 200 are preferably provided which secure to theback face 184 of thehousing 152 in a snap-fitting arrangement, as seen in Figs. 9A and 9B. Theretainers 200 preferably have latchingarms 202 to engage reciprocal latching features 204 of thehousing 152. For ease of assembly, theretainers 200 would preferably be formed as two pieces that havemating tongues 204 andgrooves 206 that interlock the tworetainer pieces 200 together. Further, thehousing 152 would preferably have an offset cavity in the back end of the housing with respect to the pattern of cavities that accept the probe connectors, thereby allowing the use of identical retainer parts. This would reduce the cost of manufacture and increase the ease of assembly of the device. Preferably, thehousing 152 would includepassageways 208 that open to the latchingarms 202 of theretainers 200, such that theretainers 200 may be disengaged from the outside of thehousing 152 for rework on the device. - For the embodiments of the spring probe block assemblies 50,150 described herein, those skilled in the art will recognize additions and modifications that may be made without departing from the spirit and scope of the invention. For example, the housing 52,152 of the assembly will preferably be provided with mounting holes 210 so that the spring probe block assemblies 50,150 may be mounted in an automated test equipment head. It is anticipated that the retainer elements (
ground plates 56 and ground clamps 180,180') may have shapes that differ from those illustrated herein, or may, for example, be used in metal probe assembly housings, yet still embody the function and spirit of the invention.
Claims (7)
- A spring probe block assembly comprising:- a housing having means for receiving a longitudinal spring probe;- a longitudinal spring probe positioned within the means for receiving;- wherein the means for receiving includes a deflecting portion which elastically deflects the spring probe and retain the spring probe within the means for receiving by a frictional fit.
- The spring probe block assembly of claim 1, wherein the means for receiving a longitudinal spring probe is a bore in the housing.
- The spring probe block assembly of claim 2, wherein the housing is formed of conductive material..
- The spring probe block assembly of claim 2, wherein the bore includes a first bore extending from a front face of the housing along a first axis, and a second bore intersecting the first bore along a second axis parallel with and offset from the first axis.
- The spring probe block assembly of claim 2, wherein the bore includes a first bore extending from a front face of the housing along a first axis, and a second bore intersecting the first bore along a second axis not parallel with the first axis.
- The spring probe block assembly of claim 2, wherein the housing comprises:- a front portion having a first bore extending through the front portion;- a back portion having a second bore extending through the back portion;- wherein the front portion and the back portion are assembled such that the first and second bores intersect and are not axially aligned.
- A spring probe block assembly comprising:- a housing configured to receive a straight spring probe;- a straight spring probe positioned within the housing;- wherein the spring probe is elastically deflected by the housing to create a normal force between the spring probe and the housing and thereby retain the spring probe with the housing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/804,762 US6551126B1 (en) | 2001-03-13 | 2001-03-13 | High bandwidth probe assembly |
EP01953443A EP1368665B1 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01953443A Division EP1368665B1 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1722241A2 true EP1722241A2 (en) | 2006-11-15 |
EP1722241A3 EP1722241A3 (en) | 2007-07-25 |
Family
ID=25189761
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06119367A Withdrawn EP1722241A3 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
EP01953443A Expired - Lifetime EP1368665B1 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01953443A Expired - Lifetime EP1368665B1 (en) | 2001-03-13 | 2001-07-10 | High bandwidth probe assembly |
Country Status (6)
Country | Link |
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US (1) | US6551126B1 (en) |
EP (2) | EP1722241A3 (en) |
JP (2) | JP5188000B2 (en) |
AT (1) | ATE358278T1 (en) |
DE (1) | DE60127589T2 (en) |
WO (1) | WO2002073219A2 (en) |
Families Citing this family (23)
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US6911811B2 (en) * | 2002-03-18 | 2005-06-28 | Agilent Technologies, Inc. | Contact spring and socket combination for high bandwidth probe tips |
US6902416B2 (en) * | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
US6824427B1 (en) * | 2003-05-13 | 2004-11-30 | 3M Innovative Properties Company | Coaxial probe interconnection system |
US6798227B1 (en) * | 2003-06-24 | 2004-09-28 | Agilent Technologies, Inc. | Two axis self-centering probe block assembly with two axis float and self-alignment |
KR100600482B1 (en) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | test probe for semiconductor package |
US7180321B2 (en) * | 2004-10-01 | 2007-02-20 | Teradyne, Inc. | Tester interface module |
US20070063714A1 (en) * | 2005-09-21 | 2007-03-22 | Mctigue Michael T | High bandwidth probe |
US7651355B2 (en) * | 2006-06-30 | 2010-01-26 | 3M Innovative Properties Company | Floating panel mount connection system |
US7977583B2 (en) * | 2007-12-13 | 2011-07-12 | Teradyne, Inc. | Shielded cable interface module and method of fabrication |
US7651374B2 (en) * | 2008-06-10 | 2010-01-26 | 3M Innovative Properties Company | System and method of surface mount electrical connection |
US7744414B2 (en) * | 2008-07-08 | 2010-06-29 | 3M Innovative Properties Company | Carrier assembly and system configured to commonly ground a header |
US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
US20100194419A1 (en) * | 2009-02-05 | 2010-08-05 | Chan Edward K | Multi-contact probe assembly |
US7927144B2 (en) * | 2009-08-10 | 2011-04-19 | 3M Innovative Properties Company | Electrical connector with interlocking plates |
US7850489B1 (en) | 2009-08-10 | 2010-12-14 | 3M Innovative Properties Company | Electrical connector system |
US7997933B2 (en) * | 2009-08-10 | 2011-08-16 | 3M Innovative Properties Company | Electrical connector system |
US7909646B2 (en) * | 2009-08-10 | 2011-03-22 | 3M Innovative Properties Company | Electrical carrier assembly and system of electrical carrier assemblies |
JP2011138655A (en) * | 2009-12-28 | 2011-07-14 | Shonan Engineering Corp | Multi-point contact device and battery inspection device therewith |
US8187035B2 (en) * | 2010-05-28 | 2012-05-29 | Tyco Electronics Corporation | Connector assembly |
US10663486B2 (en) * | 2017-02-06 | 2020-05-26 | International Business Machines Corporation | Portable electrical noise probe structure |
KR101921291B1 (en) | 2018-05-11 | 2019-02-13 | (주) 마이크로프랜드 | Semiconductor Device Test Socket |
JP7226441B2 (en) * | 2018-05-22 | 2023-02-21 | オムロン株式会社 | Probe pin |
US10938139B2 (en) * | 2018-08-21 | 2021-03-02 | Te Connectivity Corporation | Electrical connector with retractable contacts |
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JPH0521020Y2 (en) * | 1985-12-05 | 1993-05-31 | ||
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JPH04115167A (en) * | 1990-09-06 | 1992-04-16 | Nec Corp | Pin head for wiring inspection machine |
JPH06216205A (en) * | 1993-01-13 | 1994-08-05 | Tokyo Electron Yamanashi Kk | Probe card interface device |
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2001
- 2001-03-13 US US09/804,762 patent/US6551126B1/en not_active Expired - Fee Related
- 2001-07-10 EP EP06119367A patent/EP1722241A3/en not_active Withdrawn
- 2001-07-10 AT AT01953443T patent/ATE358278T1/en not_active IP Right Cessation
- 2001-07-10 JP JP2002572428A patent/JP5188000B2/en not_active Expired - Fee Related
- 2001-07-10 WO PCT/US2001/021776 patent/WO2002073219A2/en active IP Right Grant
- 2001-07-10 DE DE60127589T patent/DE60127589T2/en not_active Expired - Lifetime
- 2001-07-10 EP EP01953443A patent/EP1368665B1/en not_active Expired - Lifetime
-
2011
- 2011-10-06 JP JP2011221783A patent/JP2012013713A/en active Pending
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US6066957A (en) * | 1997-09-11 | 2000-05-23 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
Also Published As
Publication number | Publication date |
---|---|
EP1722241A3 (en) | 2007-07-25 |
DE60127589T2 (en) | 2007-12-13 |
US6551126B1 (en) | 2003-04-22 |
JP2012013713A (en) | 2012-01-19 |
JP2004523757A (en) | 2004-08-05 |
DE60127589D1 (en) | 2007-05-10 |
EP1368665B1 (en) | 2007-03-28 |
EP1368665A2 (en) | 2003-12-10 |
ATE358278T1 (en) | 2007-04-15 |
WO2002073219A3 (en) | 2003-01-03 |
WO2002073219A2 (en) | 2002-09-19 |
JP5188000B2 (en) | 2013-04-24 |
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