DE60037488D1 - Wässrige Dispersion für Elektroabscheidung, Film mit hoher Dielektrizitätskonstante und elektronische Bauteile - Google Patents
Wässrige Dispersion für Elektroabscheidung, Film mit hoher Dielektrizitätskonstante und elektronische BauteileInfo
- Publication number
- DE60037488D1 DE60037488D1 DE60037488T DE60037488T DE60037488D1 DE 60037488 D1 DE60037488 D1 DE 60037488D1 DE 60037488 T DE60037488 T DE 60037488T DE 60037488 T DE60037488 T DE 60037488T DE 60037488 D1 DE60037488 D1 DE 60037488D1
- Authority
- DE
- Germany
- Prior art keywords
- electrodeposition
- dielectric constant
- electronic components
- aqueous dispersion
- high dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31765—Inorganic-containing or next to inorganic-containing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28590499 | 1999-10-06 | ||
JP28590499A JP4265048B2 (ja) | 1999-10-06 | 1999-10-06 | 電着用水性分散液、高誘電率フィルムおよび電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60037488D1 true DE60037488D1 (de) | 2008-01-31 |
DE60037488T2 DE60037488T2 (de) | 2008-12-04 |
Family
ID=17697533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2000637488 Expired - Lifetime DE60037488T2 (de) | 1999-10-06 | 2000-10-05 | Wässrige Dispersion für Elektroabscheidung, Film mit hoher Dielektrizitätskonstante und elektronische Bauteile |
Country Status (6)
Country | Link |
---|---|
US (2) | US6586513B1 (de) |
EP (1) | EP1091371B1 (de) |
JP (1) | JP4265048B2 (de) |
KR (1) | KR100821044B1 (de) |
DE (1) | DE60037488T2 (de) |
TW (1) | TW540075B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5015391B2 (ja) * | 2000-08-25 | 2012-08-29 | 株式会社サクラクレパス | 電着塗装用水性金属酸化物分散体組成物 |
CN1226752C (zh) * | 2001-01-29 | 2005-11-09 | 捷时雅株式会社 | 介电体用复合颗粒、超微颗粒复合树脂颗粒、介电体形成用组合物及其用途 |
JP5250923B2 (ja) * | 2001-07-13 | 2013-07-31 | Jsr株式会社 | 超微粒子複合樹脂粒子、誘電体形成用組成物および電子部品 |
JP2002293610A (ja) * | 2001-03-30 | 2002-10-09 | Jsr Corp | 誘電体用複合粒子、誘電体形成用組成物および電子部品 |
JP2003011270A (ja) * | 2001-07-02 | 2003-01-15 | Jsr Corp | 導電性箔付き誘電体層およびこれを用いたコンデンサ、ならびにその形成方法 |
WO2003038948A1 (en) * | 2001-10-26 | 2003-05-08 | Unitech, Llc. | Coating applied antenna and method of making same |
JP4080799B2 (ja) * | 2002-06-28 | 2008-04-23 | 三井金属鉱業株式会社 | 金属材表面への誘電体フィラー含有ポリイミド被膜の形成方法並びにプリント配線板用のキャパシタ層形成用の銅張積層板の製造方法及びその製造方法で得られた銅張積層板 |
DE60302853T2 (de) | 2002-10-10 | 2006-08-24 | Shin-Etsu Chemical Co., Ltd. | Farbloses und transparentes Polyimidsilikonharz mit wärmehärtenden funktionellen Gruppen |
JP2004162033A (ja) * | 2002-10-21 | 2004-06-10 | Jsr Corp | 電着用水性分散液、電磁波ノイズ吸収フィルムおよびインダクタ電子部品 |
US7270765B2 (en) * | 2004-06-14 | 2007-09-18 | Asahi Glass Company, Limited | Composition for forming dielectric layer, MIM capacitor and process for its production |
JP4913469B2 (ja) * | 2005-06-29 | 2012-04-11 | アイシン高丘株式会社 | 燃料電池スタック及びターミナルプレートの製造方法 |
US20080075863A1 (en) * | 2006-08-16 | 2008-03-27 | Lexmark International, Inc. | Tunable dielectric compositions and methods |
JP2006328548A (ja) * | 2006-08-22 | 2006-12-07 | Jsr Corp | 表面処理液及び表面処理部材 |
US8623941B2 (en) | 2010-11-10 | 2014-01-07 | Ut-Battelle, Llc | Method of forming nanodielectrics |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2386634A (en) * | 1940-03-20 | 1945-10-09 | Sprague Electric Co | Flexible electrical insulating layer |
US2619443A (en) * | 1948-04-08 | 1952-11-25 | Sprague Electric Co | Method of making electrical condensers |
US3579769A (en) * | 1968-02-19 | 1971-05-25 | Akira Matsushita | Capacitors and production thereof |
US3752750A (en) * | 1969-05-30 | 1973-08-14 | Akira Matsushita | Method for electrodeposition |
US3855169A (en) * | 1972-06-23 | 1974-12-17 | Gen Electric | Electrocoating compositions and method for making same |
JPS5710663A (en) | 1980-06-20 | 1982-01-20 | Toyobo Co Ltd | Aqueous printing ink |
JPS5770153A (en) | 1980-10-17 | 1982-04-30 | Toyobo Co Ltd | Aqueous polyester resin |
JPS58174421A (ja) | 1982-04-07 | 1983-10-13 | Toyobo Co Ltd | 水溶性ポリエステルの製造法 |
JPH0689276B2 (ja) * | 1985-03-13 | 1994-11-09 | セイコー電子工業株式会社 | カラーフィルター用高誘電性高分子電着組成物 |
US5382928A (en) * | 1993-01-22 | 1995-01-17 | The Whitaker Corporation | RF filter having composite dielectric layer and method of manufacture |
JP3175477B2 (ja) | 1994-03-30 | 2001-06-11 | ジェイエスアール株式会社 | 水性フッ素樹脂組成物 |
JPH0912742A (ja) | 1995-06-30 | 1997-01-14 | Hitachi Chem Co Ltd | 高誘電率フィルム |
JP3089195B2 (ja) * | 1995-10-12 | 2000-09-18 | 大日本塗料株式会社 | 電着用ポリイミド組成物 |
JPH09208865A (ja) | 1996-02-02 | 1997-08-12 | Daicel Chem Ind Ltd | カチオン電着塗料組成物 |
KR100221035B1 (ko) * | 1996-03-01 | 1999-09-15 | 후지이 히로시 | 음극 전착도료 |
JPH09235495A (ja) | 1996-03-01 | 1997-09-09 | Nippon Paint Co Ltd | 低鉛含有カチオン電着塗料 |
JPH1060280A (ja) | 1996-08-14 | 1998-03-03 | Japan Synthetic Rubber Co Ltd | 水系分散体 |
JP3644206B2 (ja) | 1997-08-05 | 2005-04-27 | Jsr株式会社 | ポリイミド系水性分散体およびその製造方法 |
JP3635883B2 (ja) | 1997-08-08 | 2005-04-06 | Jsr株式会社 | 水性分散体およびその製造方法 |
KR100572646B1 (ko) * | 1998-07-17 | 2006-04-24 | 제이에스알 가부시끼가이샤 | 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액 |
WO2003065384A1 (fr) * | 2002-01-28 | 2003-08-07 | Jsr Corporation | Composition pour former une matiere dielectrique photosensible, et film de transfert, matiere dielectrique et elements electroniques utilisant celle-ci |
-
1999
- 1999-10-06 JP JP28590499A patent/JP4265048B2/ja not_active Expired - Fee Related
-
2000
- 2000-10-04 US US09/678,613 patent/US6586513B1/en not_active Expired - Fee Related
- 2000-10-05 KR KR1020000058400A patent/KR100821044B1/ko not_active IP Right Cessation
- 2000-10-05 DE DE2000637488 patent/DE60037488T2/de not_active Expired - Lifetime
- 2000-10-05 EP EP20000121771 patent/EP1091371B1/de not_active Expired - Lifetime
- 2000-10-05 TW TW89120804A patent/TW540075B/zh not_active IP Right Cessation
-
2003
- 2003-03-31 US US10/401,555 patent/US7342063B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100821044B1 (ko) | 2008-04-08 |
TW540075B (en) | 2003-07-01 |
JP4265048B2 (ja) | 2009-05-20 |
US6586513B1 (en) | 2003-07-01 |
DE60037488T2 (de) | 2008-12-04 |
EP1091371A2 (de) | 2001-04-11 |
US20030207135A1 (en) | 2003-11-06 |
KR20010039999A (ko) | 2001-05-15 |
JP2001106977A (ja) | 2001-04-17 |
EP1091371B1 (de) | 2007-12-19 |
US7342063B2 (en) | 2008-03-11 |
EP1091371A3 (de) | 2004-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |