DE60036496D1 - Verfahren zur Herstellung von integrierten Schaltungselementen mit Spule - Google Patents

Verfahren zur Herstellung von integrierten Schaltungselementen mit Spule

Info

Publication number
DE60036496D1
DE60036496D1 DE60036496T DE60036496T DE60036496D1 DE 60036496 D1 DE60036496 D1 DE 60036496D1 DE 60036496 T DE60036496 T DE 60036496T DE 60036496 T DE60036496 T DE 60036496T DE 60036496 D1 DE60036496 D1 DE 60036496D1
Authority
DE
Germany
Prior art keywords
coil
integrated circuit
circuit elements
making integrated
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60036496T
Other languages
English (en)
Other versions
DE60036496T2 (de
Inventor
Satoshi Kawamura
Shin Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Application granted granted Critical
Publication of DE60036496D1 publication Critical patent/DE60036496D1/de
Publication of DE60036496T2 publication Critical patent/DE60036496T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60036496T 1999-02-24 2000-02-23 Verfahren zum Herstellen eines IC-Elements mit Spule Expired - Lifetime DE60036496T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4654599 1999-02-24
JP4654599 1999-02-24
JP5975399 1999-03-08
JP5975399 1999-03-08

Publications (2)

Publication Number Publication Date
DE60036496D1 true DE60036496D1 (de) 2007-10-31
DE60036496T2 DE60036496T2 (de) 2008-06-19

Family

ID=26386635

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60014377T Expired - Lifetime DE60014377T2 (de) 1999-02-24 2000-02-23 Integrierte schaltung und ihre herstellung, und auf einem informationsträger montierte integrierte schaltung
DE60036496T Expired - Lifetime DE60036496T2 (de) 1999-02-24 2000-02-23 Verfahren zum Herstellen eines IC-Elements mit Spule

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60014377T Expired - Lifetime DE60014377T2 (de) 1999-02-24 2000-02-23 Integrierte schaltung und ihre herstellung, und auf einem informationsträger montierte integrierte schaltung

Country Status (7)

Country Link
US (1) US7129145B2 (de)
EP (2) EP1193759B1 (de)
KR (1) KR100694561B1 (de)
CN (2) CN102254865A (de)
AU (1) AU2690400A (de)
DE (2) DE60014377T2 (de)
WO (1) WO2000051181A1 (de)

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CN1697187B (zh) 2003-12-19 2011-05-04 株式会社半导体能源研究所 半导体集成电路、半导体器件和半导体集成电路的制造方法
US7271076B2 (en) 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
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US7632721B2 (en) 2004-02-06 2009-12-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US7452786B2 (en) 2004-06-29 2008-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
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US7566633B2 (en) 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7465674B2 (en) 2005-05-31 2008-12-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US7838993B2 (en) * 2005-05-31 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7485511B2 (en) 2005-06-01 2009-02-03 Semiconductor Energy Laboratory Co., Ltd. Integrated circuit device and method for manufacturing integrated circuit device
DE102005029489A1 (de) * 2005-06-24 2006-12-28 Man Roland Druckmaschinen Ag Direkte Integration von RFID-Elementen in Faltschachteln
JP4541237B2 (ja) * 2005-06-29 2010-09-08 リンテック株式会社 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置
DE102005050484B4 (de) * 2005-10-21 2010-01-28 Atmel Automotive Gmbh Monolithisch integrierbare Schaltungsanordnung
CN1917285A (zh) * 2006-09-06 2007-02-21 上海集成电路研发中心有限公司 一种集成电路中的片上天线结构及其制造方法
US7750852B2 (en) 2007-04-13 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
DE102007019811B4 (de) * 2007-04-26 2014-11-27 Infineon Technologies Ag Schaltung, auf einem Chip aufgebrachte Filterschaltung und System
US8698697B2 (en) * 2007-06-12 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2011071457A (ja) * 2008-12-22 2011-04-07 Tdk Corp 電子部品及び電子部品の製造方法
CN102668241B (zh) * 2010-03-24 2015-01-28 株式会社村田制作所 Rfid系统
CN102586725A (zh) * 2011-01-11 2012-07-18 纽西兰商青岛长弓电子公司 应用溅镀制造天线的方法
CN102569032B (zh) * 2012-01-16 2014-05-28 中国科学院上海微系统与信息技术研究所 多层金属化薄膜叠加制作电感元件的方法
US10909440B2 (en) * 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
TWI560937B (en) * 2013-11-22 2016-12-01 Wistron Neweb Corp Near field communication antenna
KR101640909B1 (ko) * 2014-09-16 2016-07-20 주식회사 모다이노칩 회로 보호 소자 및 그 제조 방법
FR3030908B1 (fr) * 2014-12-18 2016-12-09 Stmicroelectronics Rousset Antenne pour dispositif electronique
US11024454B2 (en) * 2015-10-16 2021-06-01 Qualcomm Incorporated High performance inductors
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JP7218668B2 (ja) * 2019-05-28 2023-02-07 Tdk株式会社 アンテナ装置及びこれを備えるｉｃカード
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Also Published As

Publication number Publication date
WO2000051181A1 (en) 2000-08-31
CN102254865A (zh) 2011-11-23
EP1455302B1 (de) 2007-09-19
DE60036496T2 (de) 2008-06-19
KR100694561B1 (ko) 2007-03-13
CN1520612A (zh) 2004-08-11
US20050051872A1 (en) 2005-03-10
KR20020005596A (ko) 2002-01-17
EP1193759A1 (de) 2002-04-03
EP1193759A4 (de) 2003-04-23
EP1455302A1 (de) 2004-09-08
EP1193759B1 (de) 2004-09-29
US7129145B2 (en) 2006-10-31
AU2690400A (en) 2000-09-14
DE60014377D1 (de) 2004-11-04
DE60014377T2 (de) 2006-03-02

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Legal Events

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8364 No opposition during term of opposition