DE60031943D1 - Verfahren zur herstellung von elektronischen bauteilen - Google Patents

Verfahren zur herstellung von elektronischen bauteilen

Info

Publication number
DE60031943D1
DE60031943D1 DE60031943T DE60031943T DE60031943D1 DE 60031943 D1 DE60031943 D1 DE 60031943D1 DE 60031943 T DE60031943 T DE 60031943T DE 60031943 T DE60031943 T DE 60031943T DE 60031943 D1 DE60031943 D1 DE 60031943D1
Authority
DE
Germany
Prior art keywords
electronic components
producing electronic
producing
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60031943T
Other languages
English (en)
Other versions
DE60031943T2 (de
Inventor
Hideki Kuramitsu
Atsuo Nagai
Yoshiya Sakaguchi
Yoshiyuki Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60031943D1 publication Critical patent/DE60031943D1/de
Publication of DE60031943T2 publication Critical patent/DE60031943T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE60031943T 1999-07-28 2000-07-21 Verfahren zur herstellung von elektronischen bauteilen Expired - Fee Related DE60031943T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21329799A JP3527667B2 (ja) 1999-07-28 1999-07-28 セラミック電子部品の製造方法
JP21329799 1999-07-28
PCT/JP2000/004868 WO2001008177A1 (en) 1999-07-28 2000-07-21 Method of manufacturing ceramic electronic components

Publications (2)

Publication Number Publication Date
DE60031943D1 true DE60031943D1 (de) 2007-01-04
DE60031943T2 DE60031943T2 (de) 2007-06-06

Family

ID=16636801

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60031943T Expired - Fee Related DE60031943T2 (de) 1999-07-28 2000-07-21 Verfahren zur herstellung von elektronischen bauteilen

Country Status (9)

Country Link
US (1) US6602370B1 (de)
EP (1) EP1118089B1 (de)
JP (1) JP3527667B2 (de)
KR (1) KR20010075388A (de)
CN (1) CN1206677C (de)
DE (1) DE60031943T2 (de)
MY (1) MY125229A (de)
TW (1) TW469457B (de)
WO (1) WO2001008177A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780267B1 (en) * 1999-09-22 2004-08-24 Matsushita Electric Industrial Co., Ltd. Electronic device of ceramic
JP4275074B2 (ja) * 2002-12-27 2009-06-10 Ｔｄｋ株式会社 内部電極を持つ電子部品の製造方法
CN1791952A (zh) * 2003-04-18 2006-06-21 Tdk株式会社 用于制造多层电子组件的多层单元的方法
KR100749796B1 (ko) * 2003-04-18 2007-08-16 티디케이가부시기가이샤 적층 전자 부품용 적층체 유닛의 제조방법
JP4357531B2 (ja) * 2004-06-28 2009-11-04 Ｔｄｋ株式会社 積層型電子部品の製造方法
US9490055B2 (en) * 2011-10-31 2016-11-08 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
JP6379357B2 (ja) * 2013-03-25 2018-08-29 パナソニックＩｐマネジメント株式会社 断熱シートおよびこれを用いた冷却構造
CN108054274B (zh) * 2017-11-29 2021-10-08 歌尔微电子股份有限公司 功能陶瓷元件及在功能陶瓷层上形成电极的方法
CN117202485B (zh) * 2023-09-20 2024-04-02 赛维精密科技(广东)有限公司 一种fpcb线路板、组合模切生产工艺及生产设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754780B2 (ja) * 1987-08-10 1995-06-07 株式会社村田製作所 積層セラミックコンデンサの製造方法
JPH0756851B2 (ja) 1988-02-16 1995-06-14 株式会社村田製作所 積層セラミック電子部品の製造方法
JPH04196007A (ja) 1990-11-27 1992-07-15 Taiyo Yuden Co Ltd 導電性ペーストと積層電子部品の製造方法
NL9101108A (nl) 1991-06-26 1993-01-18 Dsm Nv Samengestelde groene keramische laag.
US5412865A (en) * 1991-08-30 1995-05-09 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer electronic component
JPH06333774A (ja) 1993-05-24 1994-12-02 Matsushita Electric Ind Co Ltd 積層磁器コンデンサの電極形成方法およびその方法を用いた積層磁器コンデンサの製造方法
JP3042464B2 (ja) 1997-10-06 2000-05-15 松下電器産業株式会社 セラミック電子部品の製造方法

Also Published As

Publication number Publication date
DE60031943T2 (de) 2007-06-06
US6602370B1 (en) 2003-08-05
JP2001044071A (ja) 2001-02-16
WO2001008177A1 (en) 2001-02-01
EP1118089A1 (de) 2001-07-25
KR20010075388A (ko) 2001-08-09
JP3527667B2 (ja) 2004-05-17
CN1206677C (zh) 2005-06-15
MY125229A (en) 2006-07-31
EP1118089B1 (de) 2006-11-22
TW469457B (en) 2001-12-21
CN1319239A (zh) 2001-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee