DE60029807T2 - Optoelektronische module mit doppelter umhüllung - Google Patents

Optoelektronische module mit doppelter umhüllung Download PDF

Info

Publication number
DE60029807T2
DE60029807T2 DE60029807T DE60029807T DE60029807T2 DE 60029807 T2 DE60029807 T2 DE 60029807T2 DE 60029807 T DE60029807 T DE 60029807T DE 60029807 T DE60029807 T DE 60029807T DE 60029807 T2 DE60029807 T2 DE 60029807T2
Authority
DE
Germany
Prior art keywords
enclosure
heat
optoelectronic
unit
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60029807T
Other languages
German (de)
English (en)
Other versions
DE60029807D1 (de
Inventor
Jean-Marc Palo Alto VERDIELL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23540069&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60029807(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of DE60029807D1 publication Critical patent/DE60029807D1/de
Publication of DE60029807T2 publication Critical patent/DE60029807T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60029807T 1999-09-02 2000-09-01 Optoelektronische module mit doppelter umhüllung Expired - Lifetime DE60029807T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US389864 1995-02-17
US09/389,864 US6252726B1 (en) 1999-09-02 1999-09-02 Dual-enclosure optoelectronic packages
PCT/US2000/024023 WO2001016634A1 (en) 1999-09-02 2000-09-01 Dual-enclosure optoelectronic packages

Publications (2)

Publication Number Publication Date
DE60029807D1 DE60029807D1 (de) 2006-09-14
DE60029807T2 true DE60029807T2 (de) 2007-03-15

Family

ID=23540069

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60029807T Expired - Lifetime DE60029807T2 (de) 1999-09-02 2000-09-01 Optoelektronische module mit doppelter umhüllung

Country Status (8)

Country Link
US (1) US6252726B1 (enExample)
EP (1) EP1218786B1 (enExample)
JP (1) JP4965781B2 (enExample)
AU (1) AU6949000A (enExample)
CA (1) CA2383706C (enExample)
DE (1) DE60029807T2 (enExample)
IL (1) IL148447A0 (enExample)
WO (1) WO2001016634A1 (enExample)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207950B1 (en) * 1999-01-11 2001-03-27 Lightlogic, Inc. Optical electronic assembly having a flexure for maintaining alignment between optical elements
US6325552B1 (en) * 2000-02-14 2001-12-04 Cisco Technology, Inc. Solderless optical transceiver interconnect
JP4646166B2 (ja) * 2000-11-08 2011-03-09 古河電気工業株式会社 レーザダイオードモジュールからなる光源
JP2002280660A (ja) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The レーザダイオードモジュールからなる光源
US6762938B2 (en) * 2001-03-16 2004-07-13 Coretek, Inc. Apparatus and method for providing auxiliary cooling and thermal stability to an opto-electronic component
JP2002280659A (ja) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The レーザダイオードモジュールからなる光源
JP2002280654A (ja) * 2001-03-19 2002-09-27 Eco Twenty One:Kk 光通信用モジュール
WO2002082600A2 (en) * 2001-04-04 2002-10-17 Coherent Deos Q-switched cavity dumped co2 laser for material processing
ATE453232T1 (de) * 2001-04-04 2010-01-15 Coherent Deos Gütegeschalteter co2 laser für materialbearbeitung
US20020167976A1 (en) * 2001-04-04 2002-11-14 Seguin Vernon A. Thermally efficient laser head
US6730993B1 (en) * 2001-07-26 2004-05-04 Ciena Corporation Laser diode and heatsink quick connect/disconnect assembly
EP1289083A1 (en) * 2001-08-28 2003-03-05 The Furukawa Electric Co., Ltd. DFB laser assembly and laser module
US6663294B2 (en) * 2001-08-29 2003-12-16 Silicon Bandwidth, Inc. Optoelectronic packaging assembly
US7070340B2 (en) * 2001-08-29 2006-07-04 Silicon Bandwidth Inc. High performance optoelectronic packaging assembly
JP2003110182A (ja) * 2001-09-28 2003-04-11 Sumitomo Electric Ind Ltd 半導体レーザモジュール
JP4945874B2 (ja) * 2001-09-28 2012-06-06 住友電気工業株式会社 発光モジュールおよび発光モジュール基板生産物
EP1309048A1 (en) * 2001-11-06 2003-05-07 Agilent Technologies, Inc. (a Delaware corporation) Electronic or opto-electronic packages
US6891276B1 (en) 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US6936495B1 (en) 2002-01-09 2005-08-30 Bridge Semiconductor Corporation Method of making an optoelectronic semiconductor package device
US7430081B2 (en) 2002-02-28 2008-09-30 Emcore Corporation Sub-micron adjustable mount for supporting a component and method
US7126078B2 (en) 2002-02-28 2006-10-24 Emcore Corporation Sub-micron adjustable mount for supporting a component and method
KR20050002904A (ko) * 2002-03-26 2005-01-10 엔피스 리미티드 냉각된 발광장치
GB2387025A (en) * 2002-03-26 2003-10-01 Enfis Ltd LED and laser diode array cooling
AU2003244772A1 (en) * 2002-06-07 2003-12-22 Bookham Technology Plc Wavelength stabilized optical device
DE10229712B4 (de) * 2002-07-02 2009-06-25 Jenoptik Laserdiode Gmbh Halbleitermodul
DE60204561T2 (de) * 2002-07-22 2006-05-11 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Überwachungsdatenübertragung in einem optischen Kommunikationssystem
US20040042742A1 (en) * 2002-08-27 2004-03-04 Scott Bradshaw Thermally equalized optical module
US20040047571A1 (en) * 2002-09-06 2004-03-11 Boord Warren Timothy Hermetically sealed ferrule
EP1398655A1 (de) * 2002-09-06 2004-03-17 Agfa-Gevaert AG Temperierung eines Optikmoduls
US6973106B1 (en) * 2002-10-11 2005-12-06 Corvis Corporation Optical package and optical systems apparatuses, and methods of use therein
TWM241691U (en) * 2003-02-24 2004-08-21 Young Optics Inc Holding apparatus for a rod
US7335925B2 (en) * 2003-03-14 2008-02-26 Sumitomo Electric Industries, Ltd. Semiconductor device
US7039079B2 (en) * 2003-03-14 2006-05-02 Coherent, Inc. Pulsed CO2 laser including an optical damage resistant electro-optical switching arrangement
US7556406B2 (en) * 2003-03-31 2009-07-07 Lumination Llc Led light with active cooling
US7543961B2 (en) * 2003-03-31 2009-06-09 Lumination Llc LED light with active cooling
US7204615B2 (en) * 2003-03-31 2007-04-17 Lumination Llc LED light with active cooling
US7299859B2 (en) * 2003-04-28 2007-11-27 Lucent Technologies Inc. Temperature control of thermooptic devices
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
JP2005159104A (ja) * 2003-11-27 2005-06-16 Sony Corp レーザ・システム
US7186038B2 (en) 2003-12-29 2007-03-06 Adc Telecommunications, Inc. Telecommunications connector protective device
US7095110B2 (en) * 2004-05-21 2006-08-22 Gelcore, Llc Light emitting diode apparatuses with heat pipes for thermal management
US20080266884A1 (en) * 2004-12-30 2008-10-30 Georg Bogner Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component
US7457126B2 (en) * 2005-06-27 2008-11-25 Intel Corporation Optical transponder with active heat transfer
US8322889B2 (en) 2006-09-12 2012-12-04 GE Lighting Solutions, LLC Piezofan and heat sink system for enhanced heat transfer
US8031464B2 (en) * 2008-09-08 2011-10-04 Intergraph Technologies Corporation Ruggedized computer capable of operating in high-temperature environments
US8094388B1 (en) 2009-01-12 2012-01-10 Vortran Laser Technology, Inc. Removable and replaceable modular optic package with controlled microenvironment
JP5759191B2 (ja) 2010-01-29 2015-08-05 日東電工株式会社 パワーモジュール
US8547465B2 (en) 2010-01-29 2013-10-01 Nitto Denko Corporation Imaging device module
TW201214809A (en) * 2010-01-29 2012-04-01 Nitto Denko Corp Light-emitting diode device
US8427828B2 (en) 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
CN101963339A (zh) * 2010-10-09 2011-02-02 王春 一种大功率led光源一体化散热装置
JP2012124245A (ja) * 2010-12-07 2012-06-28 Sae Magnetics(H K )Ltd 光伝送モジュール及びその温度調節方法
US8905632B2 (en) 2011-11-29 2014-12-09 Cisco Technology, Inc. Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
US9645333B2 (en) 2014-10-17 2017-05-09 Lumentum Operations Llc Optomechanical assembly
US9596761B2 (en) * 2015-01-06 2017-03-14 Fujitsu Limited Different thermal zones in an opto-electronic module
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
WO2017023257A1 (en) 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Multi-chip module
JP5895091B1 (ja) * 2015-09-01 2016-03-30 株式会社フジクラ 光モジュール
CN105281197A (zh) * 2015-11-11 2016-01-27 中国电子科技集团公司第四十四研究所 一种抗冲击能力强的半导体光源封装结构
DE112018007021B4 (de) * 2018-02-06 2022-05-12 Mitsubishi Electric Corporation Schaft mit einem eingebauten thermoelektrischen Kühler
JP2019212837A (ja) * 2018-06-07 2019-12-12 ルネサスエレクトロニクス株式会社 電子装置およびその製造方法
US10901161B2 (en) 2018-09-14 2021-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Optical power transfer devices with an embedded active cooling chip
CN112444920A (zh) * 2019-08-27 2021-03-05 成都优博创通信技术股份有限公司 一种光模块组件及光通信设备
US11249264B2 (en) * 2020-07-02 2022-02-15 Google Llc Thermal optimizations for OSFP optical transceiver modules
US12313892B2 (en) * 2020-08-06 2025-05-27 Applied Optoelectronics, Inc. Techniques for thermal management within optical subassembly modules
US12470041B2 (en) * 2021-07-21 2025-11-11 Cisco Technology, Inc. Submount architecture for multimode nodes
US11789221B2 (en) * 2021-10-05 2023-10-17 Aeva, Inc. Techniques for device cooling in an optical sub-assembly
TWM649139U (zh) * 2023-07-14 2023-12-01 正文科技股份有限公司 通訊組件及其散熱屏蔽模組

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548700B2 (enExample) 1973-01-30 1980-12-08
US4114177A (en) 1975-05-01 1978-09-12 Bell Telephone Laboratories, Incorporated Optically coupled device with diffusely reflecting enclosure
JPS5262077A (en) * 1975-11-17 1977-05-23 Mitsubishi Chem Ind Optical pyrometer
US4119363A (en) 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
US4357072A (en) 1978-01-28 1982-11-02 Plessey Handel Und Investments Ag Sealing optical fibres into packages
CA1108899A (en) 1978-08-17 1981-09-15 Paul P. Webb Light detector housing for fiber optic applications
JPS6161493A (ja) * 1984-09-03 1986-03-29 松下電器産業株式会社 レ−ザダイオ−ドモジユ−ルの保持装置
JPH06105819B2 (ja) * 1985-12-13 1994-12-21 株式会社日立製作所 半導体レーザモジュール
JPS63302584A (ja) * 1987-06-02 1988-12-09 Fujitsu Ltd レ−ザダイオ−ドの温度制御装置
EP0308749A3 (de) 1987-09-25 1990-07-11 Siemens Aktiengesellschaft Elektrooptische Baugruppe
JP2506067Y2 (ja) * 1987-11-30 1996-08-07 日本電気株式会社 光送信盤の構造
WO1989008374A1 (fr) 1988-02-26 1989-09-08 Fujitsu Limited Support de montage de composants optiques et de composants de circuits electriques et procede de production
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US4926545A (en) 1989-05-17 1990-05-22 At&T Bell Laboratories Method of manufacturing optical assemblies
JP2775859B2 (ja) * 1989-06-23 1998-07-16 日本電気株式会社 フリップフロップ回路
JP2522805Y2 (ja) * 1989-07-24 1997-01-16 日本電気株式会社 光通信装置
US5163108A (en) 1990-07-11 1992-11-10 Gte Laboratories Incorporated Method and device for passive alignment of diode lasers and optical fibers
US5119448A (en) 1990-09-21 1992-06-02 Tacan Corporation Modular micro-optical systems and method of making such systems
JPH04179180A (ja) * 1990-11-08 1992-06-25 Matsushita Electric Ind Co Ltd 短波長レーザ光源
JPH05167143A (ja) * 1991-12-19 1993-07-02 Nippon Steel Corp 半導体レーザ装置
JPH05175608A (ja) * 1991-12-20 1993-07-13 Fujitsu Ltd 光半導体素子モジュール
JP2546146B2 (ja) * 1993-06-24 1996-10-23 日本電気株式会社 半導体レーザ装置
JP3323313B2 (ja) * 1993-12-28 2002-09-09 アンリツ株式会社 半導体レーザモジュール
JPH07230022A (ja) * 1994-02-17 1995-08-29 Fujitsu Ltd 光並列リンク及びその実装構造
JPH07287130A (ja) * 1994-04-19 1995-10-31 Oki Electric Ind Co Ltd 光ファイバモジュール
JP3047735B2 (ja) 1994-05-16 2000-06-05 住友電気工業株式会社 光受信モジュ−ルとその製造方法
US5641984A (en) 1994-08-19 1997-06-24 General Electric Company Hermetically sealed radiation imager
US5619609A (en) 1996-02-02 1997-04-08 E-Tek Dynamics, Inc. Fiberoptic support clip
JP2814987B2 (ja) * 1996-04-05 1998-10-27 日本電気株式会社 半導体レーザモジュール
US6027256A (en) * 1997-02-07 2000-02-22 Coherent, Inc. Composite laser diode enclosure and method for making the same
US5930430A (en) * 1997-04-02 1999-07-27 E-Tek Dynamics, Inc. Integrated laser diode and fiber grating assembly
US6167438A (en) * 1997-05-22 2000-12-26 Trustees Of Boston University Method and system for distributed caching, prefetching and replication

Also Published As

Publication number Publication date
JP2003533009A (ja) 2003-11-05
EP1218786B1 (en) 2006-08-02
EP1218786A1 (en) 2002-07-03
CA2383706C (en) 2007-03-27
IL148447A0 (en) 2002-09-12
US6252726B1 (en) 2001-06-26
EP1218786A4 (en) 2005-05-04
JP4965781B2 (ja) 2012-07-04
AU6949000A (en) 2001-03-26
DE60029807D1 (de) 2006-09-14
CA2383706A1 (en) 2001-03-08
WO2001016634A1 (en) 2001-03-08

Similar Documents

Publication Publication Date Title
DE60029807T2 (de) Optoelektronische module mit doppelter umhüllung
DE69937726T2 (de) Optisches Modul
DE60022479T2 (de) Verfahren zum aufbau einer optoelektronischen anordnung
DE69907351T2 (de) Photodiodenmodul
DE60102214T2 (de) Unter Spannung anschliessbares und mit Glasfasersteckern versehenes opto-elektronisches Sende- und Empfangsmodul
DE3687063T2 (de) Optische komponente mit wellenleiter.
DE69525701T2 (de) Integrierter optoelektronischer Verbund und Stecker
EP1088378A2 (de) Gehäuseanordnung für lasermodul
DE60303140T2 (de) Optische verbindungsanordnung
EP0335104A2 (de) Vorrichtung zum optischen Verbinden eines oder mehrerer optischer Sender mit einem oder mehreren optischen Detektoren eines oder mehrerer integrierter Schaltkreise
CN100559220C (zh) 光传输模组
DE10150401A1 (de) Ausrichten eines optischen Bauelementsystems mit einem optischen Linsensystem
DE102018120895A1 (de) TO-Gehäuse mit einem Erdanschluss
DE69702562T2 (de) Halbleiterlasermodul
DE112015004631B4 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE68929527T2 (de) Optische Übertragungsvorrichtung
DE102007062047A1 (de) Kompaktgehäuse
DE602004004429T2 (de) Integrierte optische Anordnung
DE602005003720T2 (de) Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign
DE102011005251A1 (de) Optoelektronische Transistorkontur (Transistor Outline, TO)-Hülsensockelbaugruppe, welche eine Konfiguration aufweist, die die Wärmedissipation verbessert und einen thermischen Widerstand reduziert
US20060281207A1 (en) Optical device, method of manufacturing the same, optical module, optical transmission system
DE69015588T2 (de) Optischer Kopf integrierbar in einem hybriden Schaltkreis.
WO2003027743A1 (de) Sende- und/oder empfangsanordnung zur optischen signalübertragung
DE112021007646B4 (de) Optische Halbleitervorrichtung
DE102010031023B9 (de) Parallele optische Kommunikationsvorrichtungen mit schweißbaren Einsätzen, sowie zugehörige Verfahren zum Festmachen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: HEYER, V., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 806