ATE453232T1 - Gütegeschalteter co2 laser für materialbearbeitung - Google Patents
Gütegeschalteter co2 laser für materialbearbeitungInfo
- Publication number
- ATE453232T1 ATE453232T1 AT02721681T AT02721681T ATE453232T1 AT E453232 T1 ATE453232 T1 AT E453232T1 AT 02721681 T AT02721681 T AT 02721681T AT 02721681 T AT02721681 T AT 02721681T AT E453232 T1 ATE453232 T1 AT E453232T1
- Authority
- AT
- Austria
- Prior art keywords
- laser
- cavity
- signal generation
- generation system
- pulsed
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1123—Q-switching
- H01S3/115—Q-switching using intracavity electro-optic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1123—Q-switching
- H01S3/117—Q-switching using intracavity acousto-optic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/40—Paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08095—Zig-zag travelling beam through the active medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/081—Construction or shape of optical resonators or components thereof comprising three or more reflectors
- H01S3/0813—Configuration of resonator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
- H01S3/09702—Details of the driver electronics and electric discharge circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
- H01S3/107—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using electro-optic devices, e.g. exhibiting Pockels or Kerr effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
- H01S3/1305—Feedback control systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
- H01S3/2325—Multi-pass amplifiers, e.g. regenerative amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2366—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media comprising a gas as the active medium
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28151601P | 2001-04-04 | 2001-04-04 | |
PCT/US2002/010765 WO2002082596A2 (en) | 2001-04-04 | 2002-04-04 | Q-switched co2 laser for material processing |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE453232T1 true ATE453232T1 (de) | 2010-01-15 |
Family
ID=23077629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02721681T ATE453232T1 (de) | 2001-04-04 | 2002-04-04 | Gütegeschalteter co2 laser für materialbearbeitung |
Country Status (6)
Country | Link |
---|---|
US (2) | US6826204B2 (de) |
EP (1) | EP1384293B1 (de) |
JP (1) | JP2004535663A (de) |
AT (1) | ATE453232T1 (de) |
DE (1) | DE60234823D1 (de) |
WO (1) | WO2002082596A2 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002082600A2 (en) * | 2001-04-04 | 2002-10-17 | Coherent Deos | Q-switched cavity dumped co2 laser for material processing |
ATE453232T1 (de) * | 2001-04-04 | 2010-01-15 | Coherent Deos | Gütegeschalteter co2 laser für materialbearbeitung |
WO2002090037A1 (en) | 2001-05-09 | 2002-11-14 | Electro Scientific Industries, Inc. | Micromachining with high-energy, intra-cavity q-switched co2 laser pulses |
US20040208602A1 (en) * | 2001-12-01 | 2004-10-21 | James Plante | Free space optical communications link tolerant of atmospheric interference |
US8148989B2 (en) * | 2002-03-11 | 2012-04-03 | Keith Kopp | Ferromagnetic detection enhancer compatible with magnetic resonance |
US7039079B2 (en) * | 2003-03-14 | 2006-05-02 | Coherent, Inc. | Pulsed CO2 laser including an optical damage resistant electro-optical switching arrangement |
US7113529B2 (en) * | 2003-03-14 | 2006-09-26 | Coherent, Inc. | Pulsed CO2 laser including an optical damage resistant electro-optical switching arrangement |
JP4151476B2 (ja) * | 2003-05-14 | 2008-09-17 | ソニー株式会社 | レーザ光安定化方法、レーザ光発生装置 |
US7046709B2 (en) * | 2003-11-18 | 2006-05-16 | Coherent, Inc. | CO2 waveguide laser with beryllium oxide waveguides |
DE10357303A1 (de) * | 2003-12-05 | 2005-07-07 | Focke & Co.(Gmbh & Co. Kg) | Verfahren und Vorrichtung zum Herstellen von Zigaretten |
DE10358927B4 (de) * | 2003-12-16 | 2021-09-09 | Carl Zeiss Meditec Ag | Laservorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung |
US20050255406A1 (en) * | 2004-05-11 | 2005-11-17 | Shlomo Assa | Marking on a thin film |
US7280569B2 (en) * | 2004-07-08 | 2007-10-09 | Coherent, Inc. | Electro-optical modulator module for CO2 laser Q-switching, mode-locking, and cavity dumping |
JP2006196638A (ja) * | 2005-01-13 | 2006-07-27 | Institute Of Physical & Chemical Research | パルスレーザーのレーザー発振制御方法およびパルスレーザーシステム |
US7394479B2 (en) * | 2005-03-02 | 2008-07-01 | Marken Corporation | Pulsed laser printing |
US20080002751A1 (en) * | 2005-08-10 | 2008-01-03 | Gongxue Hua | High damage threshold Q-switched CO2 laser |
US7453918B2 (en) * | 2005-08-11 | 2008-11-18 | Coherent, Inc. | Pulsed RF high pressure CO2 lasers |
US7327769B2 (en) * | 2005-10-18 | 2008-02-05 | Coherent, Inc. | Injection locking Q-switched and Q-switched cavity dumped CO2 lasers for extreme UV generation |
US20070238046A1 (en) * | 2006-04-07 | 2007-10-11 | The Domino Corporation | Laser marking |
CN100389526C (zh) * | 2006-04-12 | 2008-05-21 | 李力钧 | 桁架式折叠准封离型千瓦级co2激光器 |
US20070272666A1 (en) * | 2006-05-25 | 2007-11-29 | O'brien James N | Infrared laser wafer scribing using short pulses |
JP5173153B2 (ja) * | 2006-06-14 | 2013-03-27 | 日本電信電話株式会社 | 電気光学素子 |
US7630147B1 (en) * | 2007-02-16 | 2009-12-08 | University Of Central Florida Research Foundation, Inc. | Laser beam shaping for pitchfork profile |
US8080072B2 (en) * | 2007-03-05 | 2011-12-20 | 3M Innovative Properties Company | Abrasive article with supersize coating, and methods |
US7959694B2 (en) * | 2007-03-05 | 2011-06-14 | 3M Innovative Properties Company | Laser cut abrasive article, and methods |
US7903699B2 (en) * | 2007-05-24 | 2011-03-08 | Coherent, Inc. | Acousto-optically Q-switched CO2 laser |
US20090045178A1 (en) * | 2007-08-15 | 2009-02-19 | Che-Kang Hsu | Laser engraver |
KR200447896Y1 (ko) * | 2009-09-16 | 2010-03-03 | 주식회사 호수산업 | 수납식 관람석의 가동 안내장치 |
JP5933521B2 (ja) * | 2010-03-26 | 2016-06-08 | ローレンス リバモア ナショナル セキュリティー, エルエルシー | 高出力レーザシステムのための多重パス増幅器アーキテクチャ |
WO2011162776A1 (en) * | 2010-06-25 | 2011-12-29 | Markem-Imaje Corporation | Ingress protected laser |
US8611391B2 (en) | 2011-05-03 | 2013-12-17 | Coherent, Inc. | Waveguide CO2 laser with mutiply folded resonator |
DE102012002470A1 (de) | 2012-02-03 | 2013-08-08 | Iai Industrial Systems B.V. | CO2-Laser mit schneller Leistungssteuerung |
US8767291B2 (en) * | 2012-03-16 | 2014-07-01 | Kla-Tencor Corporation | Suppression of parasitic optical feedback in pulse laser systems |
US8731015B2 (en) | 2012-03-30 | 2014-05-20 | Coherent, Inc. | Compact CO2 slab-laser |
LT6021B (lt) * | 2012-08-16 | 2014-04-25 | Integrated Optics, Uab | Lazeris, veikiantis aktyvios modų sinchronizacijos ir rezonatoriaus iškrovos režimu |
JP6207289B2 (ja) * | 2013-08-06 | 2017-10-04 | キヤノン株式会社 | 被検体情報取得装置、レーザー装置および医療装置 |
US9414498B2 (en) | 2013-09-20 | 2016-08-09 | Coherent, Inc. | Via-hole drilling in a printed circuit board using a carbon monoxide laser |
DE102014111774A1 (de) | 2014-08-18 | 2016-02-18 | AMOtronics UG | Anordnung und Verfahren zum Modulieren von Laserpulsen |
US9925620B2 (en) | 2015-08-19 | 2018-03-27 | Coherent, Inc. | Carbon monoxide laser machining system |
US10274806B2 (en) | 2015-11-06 | 2019-04-30 | Coherent, Inc. | Pulse-dividing method and apparatus for a pulsed carbon monoxide laser |
US11123822B2 (en) * | 2016-03-31 | 2021-09-21 | AGC Inc. | Manufacturing method for glass substrate, method for forming hole in glass substrate, and apparatus for forming hole in glass substrate |
US10423047B2 (en) | 2016-07-27 | 2019-09-24 | Coherent, Inc. | Laser machining method and apparatus |
WO2017042688A1 (en) * | 2016-07-27 | 2017-03-16 | Universidad Tecnológica De Panamá | Laser cutting device |
WO2018166610A1 (en) | 2017-03-16 | 2018-09-20 | Fastree3D Sa | Method and device for optimizing the use of multiple emitters and a detector in an active remote sensing application |
US11619715B2 (en) | 2017-03-16 | 2023-04-04 | Fastree3D Sa | Method and device for optimizing the use of emitter and detector in an active remote sensing application |
US10583668B2 (en) | 2018-08-07 | 2020-03-10 | Markem-Imaje Corporation | Symbol grouping and striping for wide field matrix laser marking |
DE102018221189A1 (de) | 2018-12-07 | 2020-06-10 | Carl Zeiss Smt Gmbh | Verfahren zum Bilden von Nanostrukturen an einer Oberfläche und optisches Element |
JP2021165814A (ja) * | 2020-04-08 | 2021-10-14 | 三菱重工業株式会社 | レーザ加工装置 |
KR20240101949A (ko) * | 2021-11-18 | 2024-07-02 | 코히어런트, 인크. | Q스위치 가스 레이저의 펄스 등화 |
CN115361506B (zh) * | 2022-08-17 | 2024-05-24 | 中科微机电技术(北京)有限公司 | 有源像素传感器的控制方法、有源像素传感器及电子设备 |
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-
2002
- 2002-04-04 AT AT02721681T patent/ATE453232T1/de not_active IP Right Cessation
- 2002-04-04 JP JP2002580446A patent/JP2004535663A/ja active Pending
- 2002-04-04 WO PCT/US2002/010765 patent/WO2002082596A2/en active Application Filing
- 2002-04-04 US US10/116,392 patent/US6826204B2/en not_active Expired - Fee Related
- 2002-04-04 DE DE60234823T patent/DE60234823D1/de not_active Expired - Lifetime
- 2002-04-04 EP EP02721681A patent/EP1384293B1/de not_active Expired - Lifetime
-
2004
- 2004-10-15 US US10/966,943 patent/US20050069007A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1384293A2 (de) | 2004-01-28 |
WO2002082596A3 (en) | 2003-11-06 |
US20050069007A1 (en) | 2005-03-31 |
DE60234823D1 (de) | 2010-02-04 |
WO2002082596A2 (en) | 2002-10-17 |
US20030156615A1 (en) | 2003-08-21 |
US6826204B2 (en) | 2004-11-30 |
JP2004535663A (ja) | 2004-11-25 |
EP1384293B1 (de) | 2009-12-23 |
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