DE60025865D1 - Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung - Google Patents

Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung

Info

Publication number
DE60025865D1
DE60025865D1 DE60025865T DE60025865T DE60025865D1 DE 60025865 D1 DE60025865 D1 DE 60025865D1 DE 60025865 T DE60025865 T DE 60025865T DE 60025865 T DE60025865 T DE 60025865T DE 60025865 D1 DE60025865 D1 DE 60025865D1
Authority
DE
Germany
Prior art keywords
electric power
power conversion
semiconductor device
conversion device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60025865T
Other languages
English (en)
Other versions
DE60025865T2 (de
Inventor
Shinji Shirakawa
Eiji Fukumoto
Akira Mishima
Keiichi Mashino
Toshiyuki Innami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60025865D1 publication Critical patent/DE60025865D1/de
Publication of DE60025865T2 publication Critical patent/DE60025865T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)
DE60025865T 2000-03-30 2000-09-04 Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung Expired - Lifetime DE60025865T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000097816 2000-03-30
JP2000097816A JP3633432B2 (ja) 2000-03-30 2000-03-30 半導体装置及び電力変換装置

Publications (2)

Publication Number Publication Date
DE60025865D1 true DE60025865D1 (de) 2006-04-20
DE60025865T2 DE60025865T2 (de) 2006-11-02

Family

ID=18612388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60025865T Expired - Lifetime DE60025865T2 (de) 2000-03-30 2000-09-04 Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung

Country Status (4)

Country Link
US (1) US6525950B1 (de)
EP (1) EP1143603B1 (de)
JP (1) JP3633432B2 (de)
DE (1) DE60025865T2 (de)

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JP4911370B2 (ja) * 2006-02-17 2012-04-04 株式会社安川電機 電力変換装置
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JP4642804B2 (ja) * 2007-04-27 2011-03-02 カルソニックカンセイ株式会社 Ｐｗｍモジュール
DE102007029657B4 (de) * 2007-06-27 2017-10-19 Fuji Electric Co., Ltd. Wechselrichtermodul für Stromrichter
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DE102008035234B4 (de) 2007-07-30 2020-01-02 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verbessertes Leistungsmodullayout für Kraftfahrzeugleistungswandler und Kraftfahrzeugantriebssystem einen solchen umfassend
US8462529B2 (en) * 2007-07-30 2013-06-11 GM Global Technology Operations LLC Power converter assembly with symmetrical layout of power modules
EP2264894B1 (de) 2009-06-19 2011-10-12 Vincotech Holdings S.a.r.l. Leistungsmodul mit zusätzlichem transientem Strompfad und Leistungsmodulsystem
JP5201171B2 (ja) 2010-05-21 2013-06-05 株式会社デンソー 半導体モジュール、および、それを用いた駆動装置
WO2011145219A1 (ja) 2010-05-21 2011-11-24 三菱電機株式会社 パワー半導体モジュール
JP5067679B2 (ja) 2010-05-21 2012-11-07 株式会社デンソー 半導体モジュール、および、それを用いた駆動装置
JP5177711B2 (ja) 2010-05-21 2013-04-10 株式会社デンソー 電動装置
JP5267959B2 (ja) 2011-05-30 2013-08-21 株式会社デンソー 半導体モジュール、及び、それを用いた駆動装置
JP5370440B2 (ja) 2011-08-31 2013-12-18 株式会社デンソー 電子装置の製造方法
US8405206B1 (en) * 2011-09-30 2013-03-26 Infineon Technologies Ag Low-inductive semiconductor module
FR2985597B1 (fr) * 2012-01-05 2014-10-24 Valeo Equip Electr Moteur Dispositif d'assemblage de capacites pour convertisseur electronique
JP2014107957A (ja) * 2012-11-28 2014-06-09 Hitachi Automotive Systems Ltd インバータ装置およびモータ一体型インバータ装置
JP6053642B2 (ja) * 2013-08-23 2016-12-27 日立オートモティブシステムズ株式会社 電力変換装置
JP6123722B2 (ja) * 2014-03-26 2017-05-10 株式会社デンソー 半導体装置
JP5862702B2 (ja) 2014-05-07 2016-02-16 トヨタ自動車株式会社 三相インバータモジュール
JP6345583B2 (ja) * 2014-12-03 2018-06-20 ルネサスエレクトロニクス株式会社 半導体装置
US11218080B2 (en) * 2015-08-31 2022-01-04 Faraday & Future Inc. Inverter AC bus bar assembly
US10135355B2 (en) * 2015-08-31 2018-11-20 Faraday&Future Inc. Inverter DC bus bar assembly
CN205160384U (zh) * 2015-08-31 2016-04-13 法拉第未来公司 逆变器组件
US9241428B1 (en) 2015-08-31 2016-01-19 Faraday & Future Inc. Inverter assembly
JP6665456B2 (ja) * 2015-09-11 2020-03-13 富士電機株式会社 パワー半導体装置
WO2017136788A1 (en) * 2016-02-03 2017-08-10 Faraday & Future Inc. Inverter assembly
JP2017143679A (ja) 2016-02-12 2017-08-17 三菱電機株式会社 パワーモジュール
DE102016206501A1 (de) * 2016-04-18 2017-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leistungshalbleiterbauteil mit zwei lateralen Leistungshalbleiterbauelementen in Halbbrückenschaltung
JP6240262B2 (ja) * 2016-06-15 2017-11-29 株式会社東芝 半導体装置
DE112017005829A5 (de) * 2016-11-18 2019-08-08 Schaeffler Technologies AG & Co. KG Sammelschiene mit einem Blechstapel sowie Verfahren zum Herstellen einer Sammelschiene
CN110785842B (zh) * 2017-05-02 2023-10-20 日立能源瑞士股份公司 具有dc端子的同轴布置的半桥模块
FR3068545B1 (fr) * 2017-06-28 2019-07-19 Valeo Equipements Electriques Moteur Convertisseur de tension, systeme electrique, vehicule automobile et procede de fabrication associes
DE102017219674A1 (de) * 2017-11-06 2019-05-09 Audi Ag Halbleiter-Leistungsmodul mit integriertem Kondensator
JP7034043B2 (ja) * 2018-09-28 2022-03-11 京セラ株式会社 パワーモジュール及びパワーモジュールを有する電気装置
DE102019202728A1 (de) * 2019-02-28 2020-09-03 Robert Bosch Gmbh Schaltungsanordnung zur Ansteuerung einer elektrischen Maschine
US20200328027A1 (en) * 2019-04-12 2020-10-15 Karma Automotive Llc Integrated dc busbar and dc-link capacitor
TWI693682B (zh) * 2019-08-28 2020-05-11 財團法人工業技術研究院 電子元件封裝結構
JP2022006780A (ja) * 2020-06-25 2022-01-13 富士電機株式会社 半導体モジュール

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GB2242580B (en) 1990-03-30 1994-06-15 Mitsubishi Electric Corp Inverter unit with improved bus-plate configuration
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JP2979923B2 (ja) 1993-10-13 1999-11-22 富士電機株式会社 半導体装置
JP2809095B2 (ja) * 1994-03-04 1998-10-08 株式会社デンソー インバータ装置
JPH07311552A (ja) 1994-05-17 1995-11-28 Kyoto Jushi Kk 看 板
JPH08140363A (ja) 1994-11-04 1996-05-31 Fuji Electric Co Ltd 電力変換装置
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JPH1022451A (ja) * 1996-07-01 1998-01-23 Mitsubishi Electric Corp 半導体装置
JP3550970B2 (ja) * 1997-09-19 2004-08-04 株式会社日立製作所 電力変換装置並びに多層積層導体と電気部品接続体
JP3424532B2 (ja) * 1997-11-25 2003-07-07 株式会社日立製作所 電力変換装置
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Also Published As

Publication number Publication date
EP1143603B1 (de) 2006-02-08
EP1143603A2 (de) 2001-10-10
JP2001286158A (ja) 2001-10-12
US6525950B1 (en) 2003-02-25
EP1143603A3 (de) 2002-10-16
DE60025865T2 (de) 2006-11-02
JP3633432B2 (ja) 2005-03-30

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