DE60025865D1 - Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung - Google Patents
Halbleitervorrichtung und elektrische StromwandlungsvorrichtungInfo
- Publication number
- DE60025865D1 DE60025865D1 DE60025865T DE60025865T DE60025865D1 DE 60025865 D1 DE60025865 D1 DE 60025865D1 DE 60025865 T DE60025865 T DE 60025865T DE 60025865 T DE60025865 T DE 60025865T DE 60025865 D1 DE60025865 D1 DE 60025865D1
- Authority
- DE
- Germany
- Prior art keywords
- electric power
- power conversion
- semiconductor device
- conversion device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000097816A JP3633432B2 (ja) | 2000-03-30 | 2000-03-30 | 半導体装置及び電力変換装置 |
JP2000097816 | 2000-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60025865D1 true DE60025865D1 (de) | 2006-04-20 |
DE60025865T2 DE60025865T2 (de) | 2006-11-02 |
Family
ID=18612388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60025865T Expired - Lifetime DE60025865T2 (de) | 2000-03-30 | 2000-09-04 | Halbleitervorrichtung und elektrische Stromwandlungsvorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6525950B1 (de) |
EP (1) | EP1143603B1 (de) |
JP (1) | JP3633432B2 (de) |
DE (1) | DE60025865T2 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3642012B2 (ja) * | 2000-07-21 | 2005-04-27 | 株式会社日立製作所 | 半導体装置,電力変換装置及び自動車 |
US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
JP4066644B2 (ja) * | 2001-11-26 | 2008-03-26 | 株式会社豊田自動織機 | 半導体装置、半導体装置の配線方法 |
DE10237561C1 (de) | 2002-08-16 | 2003-10-16 | Semikron Elektronik Gmbh | Induktivitätsarme Schaltungsanordnung bzw. Schaltungsaufbau für Leistungshalbleitermodule |
WO2004105220A2 (en) * | 2003-05-16 | 2004-12-02 | Ballard Power Systems Corporation | Power module system |
JP2006187083A (ja) * | 2004-12-27 | 2006-07-13 | Daikin Ind Ltd | インバータ装置およびコンバータ用モジュールおよび空気調和機 |
EP1878032B1 (de) * | 2005-05-02 | 2011-06-08 | Epcos Ag | Modul der Leistungselektronik umfassend einen Kondensator |
WO2006116967A2 (de) * | 2005-05-02 | 2006-11-09 | Epcos Ag | Leistungskondensator |
EP1908049A2 (de) * | 2005-06-24 | 2008-04-09 | International Rectifier Corporation | Halbleiter-halbbrückenmodul mit geringer induktivität |
CN101385225B (zh) * | 2006-02-17 | 2012-01-18 | 株式会社安川电机 | 功率转换设备 |
JP4564937B2 (ja) | 2006-04-27 | 2010-10-20 | 日立オートモティブシステムズ株式会社 | 電気回路装置及び電気回路モジュール並びに電力変換装置 |
JP4642804B2 (ja) * | 2007-04-27 | 2011-03-02 | カルソニックカンセイ株式会社 | Pwmモジュール |
DE102007029657B4 (de) * | 2007-06-27 | 2017-10-19 | Fuji Electric Co., Ltd. | Wechselrichtermodul für Stromrichter |
US8462529B2 (en) * | 2007-07-30 | 2013-06-11 | GM Global Technology Operations LLC | Power converter assembly with symmetrical layout of power modules |
US20090284213A1 (en) * | 2008-05-15 | 2009-11-19 | Gm Global Technology Operations, Inc. | Power module layout for automotive power converters |
DE102008035234B4 (de) | 2007-07-30 | 2020-01-02 | GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) | Verbessertes Leistungsmodullayout für Kraftfahrzeugleistungswandler und Kraftfahrzeugantriebssystem einen solchen umfassend |
ATE528856T1 (de) * | 2009-06-19 | 2011-10-15 | Vincotech Holdings S A R L | Leistungsmodul mit zusätzlichem transientem strompfad und leistungsmodulsystem |
JP5177711B2 (ja) | 2010-05-21 | 2013-04-10 | 株式会社デンソー | 電動装置 |
JP5201171B2 (ja) | 2010-05-21 | 2013-06-05 | 株式会社デンソー | 半導体モジュール、および、それを用いた駆動装置 |
JP5067679B2 (ja) | 2010-05-21 | 2012-11-07 | 株式会社デンソー | 半導体モジュール、および、それを用いた駆動装置 |
CN102906874B (zh) | 2010-05-21 | 2015-11-25 | 三菱电机株式会社 | 功率半导体模块 |
JP5267959B2 (ja) | 2011-05-30 | 2013-08-21 | 株式会社デンソー | 半導体モジュール、及び、それを用いた駆動装置 |
JP5370440B2 (ja) | 2011-08-31 | 2013-12-18 | 株式会社デンソー | 電子装置の製造方法 |
US8405206B1 (en) * | 2011-09-30 | 2013-03-26 | Infineon Technologies Ag | Low-inductive semiconductor module |
FR2985597B1 (fr) | 2012-01-05 | 2014-10-24 | Valeo Equip Electr Moteur | Dispositif d'assemblage de capacites pour convertisseur electronique |
JP2014107957A (ja) * | 2012-11-28 | 2014-06-09 | Hitachi Automotive Systems Ltd | インバータ装置およびモータ一体型インバータ装置 |
JP6053642B2 (ja) * | 2013-08-23 | 2016-12-27 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP6123722B2 (ja) * | 2014-03-26 | 2017-05-10 | 株式会社デンソー | 半導体装置 |
JP5862702B2 (ja) | 2014-05-07 | 2016-02-16 | トヨタ自動車株式会社 | 三相インバータモジュール |
JP6345583B2 (ja) * | 2014-12-03 | 2018-06-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN205160384U (zh) * | 2015-08-31 | 2016-04-13 | 法拉第未来公司 | 逆变器组件 |
US9241428B1 (en) * | 2015-08-31 | 2016-01-19 | Faraday & Future Inc. | Inverter assembly |
US10135355B2 (en) * | 2015-08-31 | 2018-11-20 | Faraday&Future Inc. | Inverter DC bus bar assembly |
US11218080B2 (en) * | 2015-08-31 | 2022-01-04 | Faraday & Future Inc. | Inverter AC bus bar assembly |
JP6665456B2 (ja) * | 2015-09-11 | 2020-03-13 | 富士電機株式会社 | パワー半導体装置 |
CN109005671A (zh) * | 2016-02-03 | 2018-12-14 | 法拉第未来公司 | 逆变器组件 |
JP2017143679A (ja) | 2016-02-12 | 2017-08-17 | 三菱電機株式会社 | パワーモジュール |
DE102016206501A1 (de) * | 2016-04-18 | 2017-10-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leistungshalbleiterbauteil mit zwei lateralen Leistungshalbleiterbauelementen in Halbbrückenschaltung |
JP6240262B2 (ja) * | 2016-06-15 | 2017-11-29 | 株式会社東芝 | 半導体装置 |
US10749325B2 (en) * | 2016-11-18 | 2020-08-18 | Schaeffler Technologies AG & Co. KG | Busbar comprising a metal-sheet stack and method for producing a busbar |
EP3613077B1 (de) * | 2017-05-02 | 2020-10-07 | ABB Power Grids Switzerland AG | Halbbrückenmodul mit koaxialer anordnung der dc-anschlüsse |
FR3068545B1 (fr) * | 2017-06-28 | 2019-07-19 | Valeo Equipements Electriques Moteur | Convertisseur de tension, systeme electrique, vehicule automobile et procede de fabrication associes |
DE102017219674A1 (de) * | 2017-11-06 | 2019-05-09 | Audi Ag | Halbleiter-Leistungsmodul mit integriertem Kondensator |
JP7034043B2 (ja) * | 2018-09-28 | 2022-03-11 | 京セラ株式会社 | パワーモジュール及びパワーモジュールを有する電気装置 |
DE102019202728A1 (de) * | 2019-02-28 | 2020-09-03 | Robert Bosch Gmbh | Schaltungsanordnung zur Ansteuerung einer elektrischen Maschine |
US20200328027A1 (en) * | 2019-04-12 | 2020-10-15 | Karma Automotive Llc | Integrated dc busbar and dc-link capacitor |
TWI693682B (zh) * | 2019-08-28 | 2020-05-11 | 財團法人工業技術研究院 | 電子元件封裝結構 |
JP2022006780A (ja) * | 2020-06-25 | 2022-01-13 | 富士電機株式会社 | 半導体モジュール |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4907068A (en) | 1987-01-21 | 1990-03-06 | Siemens Aktiengesellschaft | Semiconductor arrangement having at least one semiconductor body |
DE3721266A1 (de) | 1987-06-27 | 1989-01-12 | Schloemann Siemag Ag | Verstellbare stranggiesskokille zur erzeugung von vorprofilen fuer die traegerwalzung |
GB2242580B (en) | 1990-03-30 | 1994-06-15 | Mitsubishi Electric Corp | Inverter unit with improved bus-plate configuration |
US5172310A (en) * | 1991-07-10 | 1992-12-15 | U.S. Windpower, Inc. | Low impedance bus for power electronics |
JP2910330B2 (ja) * | 1991-07-11 | 1999-06-23 | 富士電機株式会社 | 半導体装置 |
JP2725952B2 (ja) * | 1992-06-30 | 1998-03-11 | 三菱電機株式会社 | 半導体パワーモジュール |
JP2979923B2 (ja) | 1993-10-13 | 1999-11-22 | 富士電機株式会社 | 半導体装置 |
JP2809095B2 (ja) * | 1994-03-04 | 1998-10-08 | 株式会社デンソー | インバータ装置 |
JPH07311552A (ja) | 1994-05-17 | 1995-11-28 | Kyoto Jushi Kk | 看 板 |
JPH08140363A (ja) | 1994-11-04 | 1996-05-31 | Fuji Electric Co Ltd | 電力変換装置 |
US5748456A (en) * | 1995-11-24 | 1998-05-05 | Asea Brown Boveri Ag | Power semiconductor module system |
JPH1022451A (ja) * | 1996-07-01 | 1998-01-23 | Mitsubishi Electric Corp | 半導体装置 |
JP3550970B2 (ja) * | 1997-09-19 | 2004-08-04 | 株式会社日立製作所 | 電力変換装置並びに多層積層導体と電気部品接続体 |
JP3424532B2 (ja) * | 1997-11-25 | 2003-07-07 | 株式会社日立製作所 | 電力変換装置 |
US6024060A (en) * | 1998-06-05 | 2000-02-15 | Buehrle, Ii; Harry W. | Internal combustion engine valve operating mechanism |
-
2000
- 2000-03-30 JP JP2000097816A patent/JP3633432B2/ja not_active Expired - Fee Related
- 2000-09-01 US US09/653,164 patent/US6525950B1/en not_active Expired - Fee Related
- 2000-09-04 EP EP00118264A patent/EP1143603B1/de not_active Expired - Lifetime
- 2000-09-04 DE DE60025865T patent/DE60025865T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1143603B1 (de) | 2006-02-08 |
JP2001286158A (ja) | 2001-10-12 |
US6525950B1 (en) | 2003-02-25 |
EP1143603A2 (de) | 2001-10-10 |
EP1143603A3 (de) | 2002-10-16 |
DE60025865T2 (de) | 2006-11-02 |
JP3633432B2 (ja) | 2005-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |