DE4407682C2 - Laserbearbeitungsvorrichtung und Verfahren zu deren Brennpunkteinstellung - Google Patents

Laserbearbeitungsvorrichtung und Verfahren zu deren Brennpunkteinstellung

Info

Publication number
DE4407682C2
DE4407682C2 DE4407682A DE4407682A DE4407682C2 DE 4407682 C2 DE4407682 C2 DE 4407682C2 DE 4407682 A DE4407682 A DE 4407682A DE 4407682 A DE4407682 A DE 4407682A DE 4407682 C2 DE4407682 C2 DE 4407682C2
Authority
DE
Germany
Prior art keywords
distance
lens
workpiece
laser beam
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4407682A
Other languages
German (de)
English (en)
Other versions
DE4407682A1 (de
Inventor
Tetsuya Otsuki
Manabu Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE4407682A1 publication Critical patent/DE4407682A1/de
Application granted granted Critical
Publication of DE4407682C2 publication Critical patent/DE4407682C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
DE4407682A 1993-03-08 1994-03-08 Laserbearbeitungsvorrichtung und Verfahren zu deren Brennpunkteinstellung Expired - Fee Related DE4407682C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5046633A JPH06254691A (ja) 1993-03-08 1993-03-08 レーザ加工機およびレーザ加工機の焦点設定方法

Publications (2)

Publication Number Publication Date
DE4407682A1 DE4407682A1 (de) 1994-09-15
DE4407682C2 true DE4407682C2 (de) 1999-10-21

Family

ID=12752703

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4407682A Expired - Fee Related DE4407682C2 (de) 1993-03-08 1994-03-08 Laserbearbeitungsvorrichtung und Verfahren zu deren Brennpunkteinstellung

Country Status (7)

Country Link
US (1) US5624587A (online.php)
JP (1) JPH06254691A (online.php)
KR (2) KR940703727A (online.php)
CN (1) CN1057721C (online.php)
DE (1) DE4407682C2 (online.php)
TW (1) TW231985B (online.php)
WO (1) WO1994020256A1 (online.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10248458A1 (de) * 2002-10-17 2004-05-13 Precitec Kg Verfahren und Vorrichtung zum Einstellen der Fokuslage eines auf ein Werkstück gerichteten Laserstrahls

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1009138A3 (nl) * 1995-02-20 1996-12-03 Lvd Co Laserapparaat met automatische focusseerinrichting.
US6020573A (en) * 1996-10-31 2000-02-01 Nippei Toyama Corporation Laser beam machining apparatus
JP3216570B2 (ja) * 1997-05-19 2001-10-09 松下電器産業株式会社 光ビーム加熱装置
DE29904489U1 (de) * 1999-03-11 1999-05-27 Precitec GmbH, 76571 Gaggenau Arbeitskopf zur Bearbeitung eines Werkstücks mittels eines Laserstrahls
JP2003037085A (ja) 2001-07-06 2003-02-07 Data Storage Inst レーザ照射を用いた基板切断方法および装置
JP2004001067A (ja) * 2002-03-28 2004-01-08 Fanuc Ltd レーザ加工機及びレーザ加工方法
BR0312868A (pt) * 2002-07-24 2005-06-14 Pfizer Prod Inc Sistema farmacêutico de perfuração a laser
US20050155956A1 (en) * 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
WO2004024384A1 (en) * 2002-09-13 2004-03-25 Tamicare Ltd. Laser modification of complex objects
US20040094526A1 (en) * 2002-11-15 2004-05-20 Mccoy Edward D. Cutting laser beam nozzle assembly
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US20050035097A1 (en) * 2003-08-11 2005-02-17 Richard Stoltz Altering the emission of an ablation beam for safety or control
JP2005129851A (ja) * 2003-10-27 2005-05-19 Disco Abrasive Syst Ltd レーザ光線を利用した加工方法
JP4509578B2 (ja) * 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP3708104B2 (ja) * 2004-01-13 2005-10-19 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
US20050194367A1 (en) * 2004-03-02 2005-09-08 Fredrick William G.Jr. System and method for remote controlled actuation of laser processing head
JP2005297012A (ja) * 2004-04-13 2005-10-27 Disco Abrasive Syst Ltd レーザー加工装置
JP2005324248A (ja) * 2004-04-15 2005-11-24 Denso Corp レーザ加工方法及びレーザ加工装置
JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
JP2006167728A (ja) * 2004-12-13 2006-06-29 Yamazaki Mazak Corp レーザ加工機における集光レンズの汚れ検出方法及び装置
DE502005001790D1 (de) 2005-06-23 2007-12-06 Trumpf Werkzeugmaschinen Gmbh Verfahren zur bestimmung der fokuslage eines laserstrahls
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
CN100562877C (zh) * 2006-04-24 2009-11-25 日产自动车株式会社 可照射区域识别方法和装置以及移动路径设定方法
EP1859895A1 (en) * 2006-05-24 2007-11-28 Yamazaki Mazak Corporation Method and device for detecting contaminant on condenser lens in laser processing machine
JP4994452B2 (ja) * 2007-07-04 2012-08-08 三菱電機株式会社 レーザ加工装置、加工制御装置および加工装置
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) * 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
WO2012037465A1 (en) 2010-09-16 2012-03-22 Raydiance, Inc. Laser based processing of layered materials
US20120102831A1 (en) * 2010-11-03 2012-05-03 King Abdul Aziz City For Science And Technology A method for germination of haloxylon persicum
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US20130213943A1 (en) * 2012-02-17 2013-08-22 Mitsubishi Electric Corporation Laser machining method
KR101482784B1 (ko) * 2013-05-30 2015-01-16 주식회사 이오테크닉스 고속 레이저 가공 방법 및 장치
CN104400227B (zh) * 2014-09-26 2016-02-17 四川汉能光伏有限公司 一种用于激光刻划fto玻璃的加工方法
CN111246961A (zh) * 2017-11-07 2020-06-05 村田机械株式会社 激光加工机及焦点调整方法
JP6753835B2 (ja) * 2017-11-20 2020-09-09 ファナック株式会社 レーザ加工装置
WO2022249352A1 (ja) * 2021-05-26 2022-12-01 ファナック株式会社 レーザ加工機の動作を教示するための教示装置、レーザ加工システム、及び方法
CN117102664B (zh) * 2022-05-16 2025-11-21 浙江正雅齿科股份有限公司 用于切割牙科器械的激光切割机的焦点确定方法、系统
CN115255626B (zh) * 2022-07-14 2026-01-02 武汉逸飞激光股份有限公司 一种实时调整焊接平面至焊接焦距处的方法及装置
CN116203892B (zh) * 2022-12-20 2025-11-21 深圳镁伽科技有限公司 用于加工装置的控制系统和方法、电子设备及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61165288A (ja) * 1985-01-18 1986-07-25 Mitsubishi Electric Corp レ−ザ加工機の制御装置
JPS6478692A (en) * 1987-09-19 1989-03-24 Nippei Toyama Corp Nozzle checking device for laser beam machine
JPS6478691A (en) * 1987-09-19 1989-03-24 Nippei Toyama Corp Device for sampling sensor output of laser beam machine
EP0554523A1 (en) * 1992-02-03 1993-08-11 Matsushita Electric Industrial Co., Ltd. Laser beam machining apparatus and method for adjusting the height of its condenser lens

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729999Y2 (online.php) * 1975-03-25 1982-06-30
JPS5274197A (en) * 1975-12-17 1977-06-21 Hitachi Ltd Laser working machine
JPS57159285A (en) * 1981-03-27 1982-10-01 Mitsubishi Electric Corp Laser working device
US4358659A (en) * 1981-07-13 1982-11-09 Mostek Corporation Method and apparatus for focusing a laser beam on an integrated circuit
JPS61193795A (ja) * 1985-02-21 1986-08-28 Shimada Phys & Chem Ind Co Ltd レ−ザ加工装置用被加工物距離検出装置
JPS62259691A (ja) * 1986-05-06 1987-11-12 Mitsubishi Electric Corp レ−ザ加工装置
JPS6380087A (ja) * 1986-09-24 1988-04-11 Daikin Ind Ltd スクロ−ル形流体機械
JPS6397386A (ja) * 1986-10-11 1988-04-28 Nikon Corp レ−ザ加工装置
JPS6380087U (online.php) * 1986-11-14 1988-05-26
JPH0630826B2 (ja) * 1987-05-27 1994-04-27 三菱電機株式会社 レ−ザ加工装置
JP2501594B2 (ja) * 1987-09-07 1996-05-29 川崎製鉄株式会社 レ―ザ加工機の焦点位置調整方法
JPS6487692A (en) * 1987-09-29 1989-03-31 Dai Ichi Kogyo Seiyaku Co Ltd Long-life additive for high-concentration coal-water slurry
JPS6487093A (en) * 1987-09-30 1989-03-31 Komatsu Mfg Co Ltd Automatic focal distance adjusting device in laser beam machine
JP2677856B2 (ja) * 1989-02-23 1997-11-17 株式会社アマダ レーザ加工方法
JP2796346B2 (ja) * 1989-04-19 1998-09-10 ファナック 株式会社 レーザ加工機用ギャップ検出器の補正方法
JPH02280987A (ja) * 1989-04-20 1990-11-16 Koike Sanso Kogyo Co Ltd レーザ光の走査長の変動に対する焦点制御方法
JPH03258479A (ja) * 1990-03-06 1991-11-18 Mitsubishi Electric Corp レーザ加工装置
US5239159A (en) * 1990-05-31 1993-08-24 Fanuc Ltd. Nozzle movement system for laser machining equipment
JPH058070A (ja) * 1991-06-28 1993-01-19 Toshiba Corp レーザ加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61165288A (ja) * 1985-01-18 1986-07-25 Mitsubishi Electric Corp レ−ザ加工機の制御装置
JPS6478692A (en) * 1987-09-19 1989-03-24 Nippei Toyama Corp Nozzle checking device for laser beam machine
JPS6478691A (en) * 1987-09-19 1989-03-24 Nippei Toyama Corp Device for sampling sensor output of laser beam machine
EP0554523A1 (en) * 1992-02-03 1993-08-11 Matsushita Electric Industrial Co., Ltd. Laser beam machining apparatus and method for adjusting the height of its condenser lens

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10248458A1 (de) * 2002-10-17 2004-05-13 Precitec Kg Verfahren und Vorrichtung zum Einstellen der Fokuslage eines auf ein Werkstück gerichteten Laserstrahls
DE10248458B4 (de) * 2002-10-17 2006-10-19 Precitec Kg Verfahren und Vorrichtung zum Einstellen der Fokuslage eines auf ein Werkstück gerichteten Laserstrahls

Also Published As

Publication number Publication date
KR940703727A (ko) 1994-12-12
CN1057721C (zh) 2000-10-25
DE4407682A1 (de) 1994-09-15
KR970010889B1 (ko) 1997-07-02
JPH06254691A (ja) 1994-09-13
CN1105798A (zh) 1995-07-26
US5624587A (en) 1997-04-29
TW231985B (online.php) 1994-10-11
WO1994020256A1 (fr) 1994-09-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee