DE3889950T2 - Epoxyharzzusammensetzung. - Google Patents

Epoxyharzzusammensetzung.

Info

Publication number
DE3889950T2
DE3889950T2 DE3889950T DE3889950T DE3889950T2 DE 3889950 T2 DE3889950 T2 DE 3889950T2 DE 3889950 T DE3889950 T DE 3889950T DE 3889950 T DE3889950 T DE 3889950T DE 3889950 T2 DE3889950 T2 DE 3889950T2
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3889950T
Other languages
English (en)
Other versions
DE3889950D1 (de
Inventor
Toshio Shiobara
Kazutoshi Tomiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Citizen Holdings Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, Citizen Watch Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE3889950D1 publication Critical patent/DE3889950D1/de
Publication of DE3889950T2 publication Critical patent/DE3889950T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
DE3889950T 1987-03-16 1988-03-15 Epoxyharzzusammensetzung. Expired - Lifetime DE3889950T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62061631A JPH0617458B2 (ja) 1987-03-16 1987-03-16 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE3889950D1 DE3889950D1 (de) 1994-07-14
DE3889950T2 true DE3889950T2 (de) 1995-01-12

Family

ID=13176731

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3889950T Expired - Lifetime DE3889950T2 (de) 1987-03-16 1988-03-15 Epoxyharzzusammensetzung.

Country Status (6)

Country Link
US (1) US4859722A (de)
EP (1) EP0282977B1 (de)
JP (1) JPH0617458B2 (de)
KR (1) KR920009738B1 (de)
CN (1) CN1014796B (de)
DE (1) DE3889950T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662735B2 (ja) * 1989-02-07 1994-08-17 住友ベークライト株式会社 エポキシ樹脂組成物
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US5034445A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making same
US5034446A (en) * 1989-05-26 1991-07-23 Genesee Polymers Corporation Stabilized polysiloxane fluids and a process for making the same
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
JP2576701B2 (ja) * 1990-01-25 1997-01-29 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5284938A (en) * 1990-02-27 1994-02-08 Shell Oil Company Polysiloxane modified thermoset compositions
US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP2966463B2 (ja) * 1990-03-27 1999-10-25 信越化学工業株式会社 硬化性樹脂組成物
JPH0747622B2 (ja) * 1990-11-30 1995-05-24 信越化学工業株式会社 エポキシ樹脂組成物及びその硬化物
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5529847A (en) * 1992-06-10 1996-06-25 Eastman Kodak Company Cured epoxy polysiloxane coated articles useful in toner fusing members
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3147677B2 (ja) * 1994-09-30 2001-03-19 株式会社村田製作所 液状エポキシ樹脂組成物
JPH08157561A (ja) * 1994-12-01 1996-06-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
US5652463A (en) * 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
US5689137A (en) * 1995-10-16 1997-11-18 Hestia Technologies, Inc. Method for transfer molding standard electronic packages and apparatus formed thereby
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6128195A (en) * 1997-11-18 2000-10-03 Hestia Technologies, Inc. Transfer molded PCMCIA standard cards
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
US6107370A (en) * 1999-01-04 2000-08-22 Aegis Coating Technologies Single pack siliconized epoxy coating
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6486549B1 (en) 2001-11-10 2002-11-26 Bridge Semiconductor Corporation Semiconductor module with encapsulant base
US6706405B2 (en) 2002-02-11 2004-03-16 Analytical Services & Materials, Inc. Composite coating for imparting particel erosion resistance
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2009043914A (ja) * 2007-08-08 2009-02-26 Ishida Yukio 配線板の製造法および配線板
CN101696263B (zh) * 2009-10-29 2012-12-05 复旦大学 一种环氧树脂固化剂及其制备方法和应用
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板
EP2933257B1 (de) * 2012-09-17 2017-07-26 Korea Institute Of Industrial Technology Epoxidverbindung mit einer alkoxysilylgruppe, verfahren zur herstellung davon, zusammensetzung damit, gehärtetes produkt daraus und verwendung davon
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407169A (en) * 1965-02-25 1968-10-22 Navy Usa Heat resistant adhesive
US4394496A (en) * 1971-08-19 1983-07-19 The Dow Chemical Company Epoxidation products of 1,1,1-tri-(hydroxyphenyl) alkanes
US4022753A (en) * 1974-03-25 1977-05-10 Ciba-Geigy Corporation Reaction products of polysiloxanes and polyphenols
JPS6056171B2 (ja) * 1980-03-17 1985-12-09 信越化学工業株式会社 エポキシ樹脂組成物
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS58198526A (ja) * 1982-05-17 1983-11-18 Mitsubishi Gas Chem Co Inc 耐熱性エポキシ樹脂組成物
JPS59129251A (ja) * 1983-01-14 1984-07-25 Matsushita Electric Works Ltd エポキシ樹脂成形材料
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61285270A (ja) * 1985-06-12 1986-12-16 Shin Etsu Chem Co Ltd 表面被覆剤

Also Published As

Publication number Publication date
CN88101396A (zh) 1988-10-05
EP0282977B1 (de) 1994-06-08
DE3889950D1 (de) 1994-07-14
JPH0617458B2 (ja) 1994-03-09
KR920009738B1 (ko) 1992-10-22
EP0282977A2 (de) 1988-09-21
EP0282977A3 (en) 1989-07-26
US4859722A (en) 1989-08-22
CN1014796B (zh) 1991-11-20
JPS63227621A (ja) 1988-09-21
KR880011269A (ko) 1988-10-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: CITIZEN HOLDINGS CO., LTD., NISHITOKYO, TOKIO/, JP

Owner name: SHIN-ETSU CHEMICAL CO., LTD., TOKIO/TOKYO, JP