DE3879271D1 - Mehrschichtiges supraleitendes substrat fuer schaltkreise und dessen herstellungsprozess. - Google Patents
Mehrschichtiges supraleitendes substrat fuer schaltkreise und dessen herstellungsprozess.Info
- Publication number
- DE3879271D1 DE3879271D1 DE8888303768T DE3879271T DE3879271D1 DE 3879271 D1 DE3879271 D1 DE 3879271D1 DE 8888303768 T DE8888303768 T DE 8888303768T DE 3879271 T DE3879271 T DE 3879271T DE 3879271 D1 DE3879271 D1 DE 3879271D1
- Authority
- DE
- Germany
- Prior art keywords
- supral
- multilayered
- circuits
- production process
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
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- C04B35/63416—Polyvinylalcohols [PVA]; Polyvinylacetates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10562487 | 1987-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3879271D1 true DE3879271D1 (de) | 1993-04-22 |
DE3879271T2 DE3879271T2 (de) | 1993-06-24 |
Family
ID=14412642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888303768T Expired - Fee Related DE3879271T2 (de) | 1987-04-27 | 1988-04-27 | Mehrschichtiges supraleitendes substrat fuer schaltkreise und dessen herstellungsprozess. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4954480A (de) |
EP (2) | EP0292125B1 (de) |
KR (1) | KR900007678B1 (de) |
CN (2) | CN88102545A (de) |
CA (1) | CA1329952C (de) |
DE (1) | DE3879271T2 (de) |
Families Citing this family (62)
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US4960751A (en) * | 1987-04-01 | 1990-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting multilayered structure and manufacturing method for same |
CA1329952C (en) | 1987-04-27 | 1994-05-31 | Yoshihiko Imanaka | Multi-layer superconducting circuit substrate and process for manufacturing same |
EP0290271B1 (de) * | 1987-05-08 | 1995-03-15 | Fujitsu Limited | Supraleitende Schaltungskarte und Verfahren zu ihrer Herstellung |
JPS63277549A (ja) * | 1987-05-08 | 1988-11-15 | Fujitsu Ltd | 超伝導セラミックスペ−スト組成物 |
US4980339A (en) * | 1987-07-29 | 1990-12-25 | Matsushita Electric Industrial Co., Ltd. | Superconductor structure |
US5079222A (en) * | 1987-08-31 | 1992-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Superconducting ceramic circuits and manufacturing method for the same |
US5225394A (en) * | 1987-08-31 | 1993-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing high Tc superconducting circuits |
US4837609A (en) * | 1987-09-09 | 1989-06-06 | American Telephone And Telegraph Company, At&T Bell Laboratories | Semiconductor devices having superconducting interconnects |
EP0440791A1 (de) * | 1987-09-29 | 1991-08-14 | Mitsubishi Materials Corporation | Struktur einer supraleiterverdrahtung und verfahren zu ihrer herstellung |
JP2586513B2 (ja) * | 1987-09-29 | 1997-03-05 | 三菱マテリアル株式会社 | 超伝導体膜形成用ペースト |
US5122508A (en) * | 1987-12-11 | 1992-06-16 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Coprecipitation process for preparing raw material powder for Y1 Ba2 Cu3 Ox oxide superconductor |
US5795849A (en) * | 1987-12-21 | 1998-08-18 | Hickman; Paul L. | Bulk ceramic superconductor structures |
GB2211662B (en) * | 1988-01-16 | 1991-01-16 | Int Computers Ltd | Multichip carriers |
JPH01249651A (ja) * | 1988-02-18 | 1989-10-04 | E I Du Pont De Nemours & Co | セラミツク/蒸留可能な結合剤組成物 |
US4929595A (en) * | 1988-02-26 | 1990-05-29 | The University Of Alabama At Huntsville | Superconducting thin film fabrication |
JPH02148789A (ja) * | 1988-03-11 | 1990-06-07 | Internatl Business Mach Corp <Ibm> | 電子回路基板 |
US5140300A (en) * | 1988-10-24 | 1992-08-18 | Sharp Kabushiki Kaisha | Superconductive magneto-resistive device comprising laminated superconductive ceramic films |
US5147851A (en) * | 1988-11-02 | 1992-09-15 | Hitachi Chemical Company Ltd. | Superconducting thick film circuit board, production thereof, thick film superconductor and production thereof |
US5256897A (en) * | 1988-11-28 | 1993-10-26 | Hitachi, Ltd. | Oxide superconducting device |
US4997808A (en) * | 1988-12-27 | 1991-03-05 | Eastman Kodak Company | Superconductive ceramic oxide combination |
US5278135A (en) * | 1989-02-18 | 1994-01-11 | E. I. Du Pont De Nemours And Company | Ceramic/distillable binder compositions |
JPH035361A (ja) * | 1989-03-17 | 1991-01-11 | Dow Chem Co:The | 乾燥プレス成形生素地用のセラミツク生素地配合物 |
DE68929020T2 (de) * | 1989-04-04 | 1999-11-25 | Murata Mfg. Co., Ltd. | Herstellungsprozess für ein keramisches mehrschichtiges Substrat |
US5178934A (en) * | 1989-06-27 | 1993-01-12 | Digital Equipment Corporation | Thick-film devices having dielectric layers with embedded microspheres |
NL8901874A (nl) * | 1989-07-20 | 1991-02-18 | Philips Nv | Planaire josephson inrichting. |
US5116810A (en) * | 1989-10-16 | 1992-05-26 | American Superconductor Corporation | Process for making electrical connections to high temperature superconductors using a metallic precursor and the product made thereby |
JPH03261006A (ja) * | 1990-03-08 | 1991-11-20 | Sumitomo Electric Ind Ltd | 超電導線材の製造方法 |
DE4014570A1 (de) * | 1990-05-07 | 1991-11-14 | Hoechst Ag | Loesung und ihre verwendung zur herstellung supraleitender faeden und beschichtungen |
EP0456963B1 (de) * | 1990-05-18 | 1996-01-17 | International Business Machines Corporation | Supraleitendes Mehrschichtkeramiksubstrat |
JP2503725B2 (ja) * | 1990-05-18 | 1996-06-05 | 日本電気株式会社 | 多層配線基板 |
US5212626A (en) * | 1990-11-09 | 1993-05-18 | International Business Machines Corporation | Electronic packaging and cooling system using superconductors for power distribution |
WO1992020108A1 (en) * | 1991-05-08 | 1992-11-12 | Superconductor Technologies, Inc. | Multichip interconnect module including superconductive materials |
EP0523275B1 (de) * | 1991-07-19 | 1996-02-28 | International Business Machines Corporation | Verbesserter supraleitender Feldeffekt-Transistor mit inverser MISFET-Struktur und Verfahren zu dessen Herstellung |
US5474834A (en) * | 1992-03-09 | 1995-12-12 | Kyocera Corporation | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
US5238913A (en) * | 1992-03-30 | 1993-08-24 | The United States Of America As Represented By The United States Department Of Energy | Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials |
US5338598A (en) * | 1992-12-14 | 1994-08-16 | Corning Incorporated | Sintered inorganic composites comprising co-sintered tape reinforcement |
DE69309306T2 (de) * | 1992-12-15 | 1997-09-04 | Du Pont | Elektrische Verbindungsstrukturen |
US5490965A (en) * | 1994-01-24 | 1996-02-13 | Hewlett-Packard Company | Method for closing holes in ceramic substrates |
US5777486A (en) * | 1994-10-03 | 1998-07-07 | United Microelectronics Corporation | Electromigration test pattern simulating semiconductor components |
US5578226A (en) * | 1995-07-18 | 1996-11-26 | Trw Inc. | Multi-layered superconductive interconnects |
US5863868A (en) * | 1996-04-08 | 1999-01-26 | Trw Inc. | Superconductive quantum interference device for digital logic circuits |
US6362527B1 (en) * | 1996-11-21 | 2002-03-26 | Advanced Micro Devices, Inc. | Borderless vias on bottom metal |
US6002951A (en) * | 1997-11-12 | 1999-12-14 | International Business Machines Corporation | Multi-layer ceramic substrate having high TC superconductor circuitry |
US7283381B2 (en) | 2000-08-17 | 2007-10-16 | David Earl Butz | System and methods for addressing a matrix incorporating virtual columns and addressing layers |
US6462977B2 (en) | 2000-08-17 | 2002-10-08 | David Earl Butz | Data storage device having virtual columns and addressing layers |
US6917461B2 (en) | 2000-12-29 | 2005-07-12 | Texas Instruments Incorporated | Laminated package |
WO2004093508A1 (ja) * | 2003-04-18 | 2004-10-28 | Ibiden Co., Ltd. | フレックスリジッド配線板 |
JP4536430B2 (ja) | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
US8315678B2 (en) * | 2007-10-10 | 2012-11-20 | D-Wave Systems Inc. | Systems, methods, and apparatus for multilayer superconducting printed circuit boards |
US8649834B1 (en) * | 2009-02-11 | 2014-02-11 | The United States Of America As Represented By The Secretary Of The Navy | Layered superconductor device and method |
US8989829B1 (en) * | 2009-02-11 | 2015-03-24 | The United States Of America As Represented By The Secretary Of The Navy | Layered superconductor device |
US9014771B1 (en) * | 2009-02-11 | 2015-04-21 | The United States Of America As Represented By The Secretary Of The Navy | Layered superconductor device |
CN103296344B (zh) * | 2012-03-01 | 2017-11-10 | 深圳光启高等理工研究院 | 一种介质滤波器的介质及其连接方法 |
CN103713169B (zh) * | 2013-12-23 | 2016-09-21 | 上海金陵智能电表有限公司 | 一种感应式电能表 |
CN106032076B (zh) * | 2015-03-20 | 2019-12-20 | 深圳光启高等理工研究院 | 陶瓷基超材料及其制备方法 |
US10291231B2 (en) | 2016-07-20 | 2019-05-14 | Microsoft Technology Licensing, Llc | Superconducting device with dummy elements |
WO2018106942A1 (en) * | 2016-12-07 | 2018-06-14 | D-Wave Systems Inc. | Superconducting printed circuit board related systems, methods, and apparatus |
US10157842B1 (en) * | 2017-05-31 | 2018-12-18 | International Business Machines Corporation | Semiconductor device including superconducting metal through-silicon-vias and method of manufacturing the same |
US10651362B2 (en) * | 2017-09-26 | 2020-05-12 | Microsoft Technology Licensing, Llc | Method of forming superconducting apparatus including superconducting layers and traces |
US11678433B2 (en) | 2018-09-06 | 2023-06-13 | D-Wave Systems Inc. | Printed circuit board assembly for edge-coupling to an integrated circuit |
US11647590B2 (en) | 2019-06-18 | 2023-05-09 | D-Wave Systems Inc. | Systems and methods for etching of metals |
US12033996B2 (en) | 2019-09-23 | 2024-07-09 | 1372934 B.C. Ltd. | Systems and methods for assembling processor systems |
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US4224630A (en) * | 1978-08-25 | 1980-09-23 | Sperry Corporation | Multiple weak-link SQUID |
US4220959A (en) * | 1979-03-23 | 1980-09-02 | Sperry Corporation | Josephson tunnel junction with polycrystalline silicon, germanium or silicon-germanium alloy tunneling barrier |
JPS5832797B2 (ja) | 1979-10-09 | 1983-07-15 | 富士通株式会社 | バイアホ−ルの形成方法 |
US4235944A (en) * | 1979-10-29 | 1980-11-25 | E. I. Du Pont De Nemours And Company | Process for producing gold conductors |
US4316785A (en) * | 1979-11-05 | 1982-02-23 | Nippon Telegraph & Telephone Public Corporation | Oxide superconductor Josephson junction and fabrication method therefor |
JPS5824037B2 (ja) * | 1980-05-26 | 1983-05-18 | 富士通株式会社 | 導体ボ−ル配列方法 |
JPS5832797A (ja) * | 1981-08-20 | 1983-02-25 | 三洋電機株式会社 | 脱水洗濯機 |
JPS59995A (ja) | 1982-06-16 | 1984-01-06 | 富士通株式会社 | 銅導体多層構造体の製造方法 |
JPS60173885A (ja) | 1984-02-18 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 酸化物超伝導材料およびその製造方法 |
JPS60254697A (ja) | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 多層セラミック回路基板および製法 |
US4568657A (en) | 1984-10-03 | 1986-02-04 | Intevep, S.A. | Catalyst formed of natural clay for use in the hydrodemetallization and hydroconversion of heavy crudes and residues and method of preparation of same |
US4960751A (en) | 1987-04-01 | 1990-10-02 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting multilayered structure and manufacturing method for same |
CA1329952C (en) | 1987-04-27 | 1994-05-31 | Yoshihiko Imanaka | Multi-layer superconducting circuit substrate and process for manufacturing same |
-
1988
- 1988-04-21 CA CA000564766A patent/CA1329952C/en not_active Expired - Fee Related
- 1988-04-25 KR KR1019880004692A patent/KR900007678B1/ko not_active IP Right Cessation
- 1988-04-27 EP EP88303768A patent/EP0292125B1/de not_active Expired - Lifetime
- 1988-04-27 CN CN88102545A patent/CN88102545A/zh active Pending
- 1988-04-27 US US07/197,583 patent/US4954480A/en not_active Expired - Fee Related
- 1988-04-27 EP EP19920110979 patent/EP0510727A3/en not_active Withdrawn
- 1988-04-27 DE DE8888303768T patent/DE3879271T2/de not_active Expired - Fee Related
-
1989
- 1989-12-31 CN CN89109655A patent/CN1044869A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0292125A1 (de) | 1988-11-23 |
KR880013428A (ko) | 1988-11-30 |
DE3879271T2 (de) | 1993-06-24 |
EP0510727A2 (de) | 1992-10-28 |
EP0510727A3 (en) | 1992-12-16 |
KR900007678B1 (ko) | 1990-10-18 |
CN1044869A (zh) | 1990-08-22 |
EP0292125B1 (de) | 1993-03-17 |
US4954480A (en) | 1990-09-04 |
CA1329952C (en) | 1994-05-31 |
CN88102545A (zh) | 1988-11-23 |
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Legal Events
Date | Code | Title | Description |
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8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |