GB2211662B - Multichip carriers - Google Patents

Multichip carriers

Info

Publication number
GB2211662B
GB2211662B GB8829920A GB8829920A GB2211662B GB 2211662 B GB2211662 B GB 2211662B GB 8829920 A GB8829920 A GB 8829920A GB 8829920 A GB8829920 A GB 8829920A GB 2211662 B GB2211662 B GB 2211662B
Authority
GB
United Kingdom
Prior art keywords
multichip
carriers
multichip carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8829920A
Other versions
GB2211662A (en
GB8829920D0 (en
Inventor
James Charles Richard Massey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB888800959A external-priority patent/GB8800959D0/en
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB8829920D0 publication Critical patent/GB8829920D0/en
Publication of GB2211662A publication Critical patent/GB2211662A/en
Application granted granted Critical
Publication of GB2211662B publication Critical patent/GB2211662B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
GB8829920A 1988-01-16 1988-12-22 Multichip carriers Expired - Fee Related GB2211662B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB888800959A GB8800959D0 (en) 1988-01-16 1988-01-16 Multichip carriers
GB888828209A GB8828209D0 (en) 1988-01-16 1988-12-02 Multichip carriers

Publications (3)

Publication Number Publication Date
GB8829920D0 GB8829920D0 (en) 1989-02-15
GB2211662A GB2211662A (en) 1989-07-05
GB2211662B true GB2211662B (en) 1991-01-16

Family

ID=26293334

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8829920A Expired - Fee Related GB2211662B (en) 1988-01-16 1988-12-22 Multichip carriers

Country Status (1)

Country Link
GB (1) GB2211662B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8944151B2 (en) * 2008-05-28 2015-02-03 International Business Machines Corporation Method and apparatus for chip cooling
US11158781B2 (en) 2019-11-27 2021-10-26 International Business Machines Corporation Permanent wafer handlers with through silicon vias for thermalization and qubit modification

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1500313A (en) * 1974-05-30 1978-02-08 Ibm Micro-electronic modules
EP0285445A2 (en) * 1987-04-01 1988-10-05 Semiconductor Energy Laboratory Co., Ltd. Electric circuit having superconducting multilayered structure and manufacturing method for same
DE3812662A1 (en) * 1987-04-17 1988-10-27 Hitachi Ltd Semiconductor component with superconducting connections
EP0290271A2 (en) * 1987-05-08 1988-11-09 Fujitsu Limited Superconducting circuit board and process of manufacturing it
EP0292125A1 (en) * 1987-04-27 1988-11-23 Fujitsu Limited Multi-layer superconducting circuit substrate and process for manufacturing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1500313A (en) * 1974-05-30 1978-02-08 Ibm Micro-electronic modules
EP0285445A2 (en) * 1987-04-01 1988-10-05 Semiconductor Energy Laboratory Co., Ltd. Electric circuit having superconducting multilayered structure and manufacturing method for same
DE3812662A1 (en) * 1987-04-17 1988-10-27 Hitachi Ltd Semiconductor component with superconducting connections
EP0292125A1 (en) * 1987-04-27 1988-11-23 Fujitsu Limited Multi-layer superconducting circuit substrate and process for manufacturing same
EP0290271A2 (en) * 1987-05-08 1988-11-09 Fujitsu Limited Superconducting circuit board and process of manufacturing it

Also Published As

Publication number Publication date
GB2211662A (en) 1989-07-05
GB8829920D0 (en) 1989-02-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20051222