GB8607105D0 - Carrier - Google Patents

Carrier

Info

Publication number
GB8607105D0
GB8607105D0 GB8607105A GB8607105A GB8607105D0 GB 8607105 D0 GB8607105 D0 GB 8607105D0 GB 8607105 A GB8607105 A GB 8607105A GB 8607105 A GB8607105 A GB 8607105A GB 8607105 D0 GB8607105 D0 GB 8607105D0
Authority
GB
United Kingdom
Prior art keywords
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8607105A
Other versions
GB2188194A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB8607105A priority Critical patent/GB2188194A/en
Publication of GB8607105D0 publication Critical patent/GB8607105D0/en
Publication of GB2188194A publication Critical patent/GB2188194A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8607105A 1986-03-21 1986-03-21 Carrier for high frequency integrated circuits Withdrawn GB2188194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8607105A GB2188194A (en) 1986-03-21 1986-03-21 Carrier for high frequency integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8607105A GB2188194A (en) 1986-03-21 1986-03-21 Carrier for high frequency integrated circuits

Publications (2)

Publication Number Publication Date
GB8607105D0 true GB8607105D0 (en) 1986-04-30
GB2188194A GB2188194A (en) 1987-09-23

Family

ID=10595045

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8607105A Withdrawn GB2188194A (en) 1986-03-21 1986-03-21 Carrier for high frequency integrated circuits

Country Status (1)

Country Link
GB (1) GB2188194A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
DE102004047659A1 (en) * 2004-09-30 2006-04-13 Infineon Technologies Ag A method of manufacturing a flange for a semiconductor device and a flange made by this method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310843B (en) * 1966-06-28 1973-10-25 Photocircuits Corp Process for manufacturing a printed circuit board
GB1372901A (en) * 1971-12-02 1974-11-06 Ibm Electrical interconnection structure
DE2306236C2 (en) * 1973-02-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Process for the production of multilayer circuits with conductive layers on both sides of a ceramic substrate
DE2310062A1 (en) * 1973-02-28 1974-08-29 Siemens Ag THICK-FILM CONNECTION ON CERAMIC SUBSTRATE WITH THROUGH CONTACTS BETWEEN THE CONDUCTORS ON BOTH SIDES OF THE SUBSTRATE
US3934074A (en) * 1974-04-22 1976-01-20 Trw Inc. Ceramic circuit board mounted in housing and method of fabrication thereof
GB1485569A (en) * 1974-09-10 1977-09-14 Siemens Ag Multi-layer wired substrates for multi-chip circuits
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
FR2296988A1 (en) * 1974-12-31 1976-07-30 Ibm France IMPROVEMENT OF THE MANUFACTURING PROCESSES OF A CERAMIC MULTILAYER CIRCUIT MODULE
EP0109084B1 (en) * 1982-11-15 1987-06-10 Storno A/S A method of making a double-sided thick-film integrated circuit
GB2136210B (en) * 1983-02-14 1987-09-23 Raymond E Wiech Method of forming substrates
KR850700099A (en) * 1983-09-21 1985-10-21 로이 에이취. 맷신길 Printed Circuit Board Manufacturing Method
GB2156593B (en) * 1984-03-28 1987-06-17 Plessey Co Plc Through hole interconnections

Also Published As

Publication number Publication date
GB2188194A (en) 1987-09-23

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)