GB2136210B - Method of forming substrates - Google Patents

Method of forming substrates

Info

Publication number
GB2136210B
GB2136210B GB08303980A GB8303980A GB2136210B GB 2136210 B GB2136210 B GB 2136210B GB 08303980 A GB08303980 A GB 08303980A GB 8303980 A GB8303980 A GB 8303980A GB 2136210 B GB2136210 B GB 2136210B
Authority
GB
United Kingdom
Prior art keywords
substrate
binder
moulding
mounting area
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08303980A
Other versions
GB8303980D0 (en
GB2136210A (en
Inventor
Raymond E Wiech
Original Assignee
Raymond E Wiech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raymond E Wiech filed Critical Raymond E Wiech
Priority to GB08303980A priority Critical patent/GB2136210B/en
Publication of GB8303980D0 publication Critical patent/GB8303980D0/en
Publication of GB2136210A publication Critical patent/GB2136210A/en
Priority claimed from GB08620796A external-priority patent/GB2180409B/en
Application granted granted Critical
Publication of GB2136210B publication Critical patent/GB2136210B/en
Application status is Expired legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
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    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Abstract

A substrate is formed by moulding a composition comprising a particulate material (e.g. alumina) and a binder to provide a planar mounting area for a heat producing element (2) (e.g. an integrated circuit chip) and a heat sink aperture (9) directly below the mounting area. The binder is then at least partly removed and the substrate sintered. A fluid may be circulated through the heat sink aperture (9) or a heat pipe system may be utilised. Conductive tracks (24) may be provided by moulding grooves in the substrate which are further filled with a conductive ink before firing. The grooves enable connecting wires (3) to cross the tracks (24) without the risk of short circuiting. A method of making a mould of reduced size from a master is described in which the uniform shrinkage of a ceramic when fired is used in a sequence of replicating steps. <IMAGE>
GB08303980A 1983-02-14 1983-02-14 Method of forming substrates Expired GB2136210B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08303980A GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08303980A GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates
GB08620796A GB2180409B (en) 1983-02-14 1986-08-28 Method of forming multilayer ceramic substrates

Publications (3)

Publication Number Publication Date
GB8303980D0 GB8303980D0 (en) 1983-03-16
GB2136210A GB2136210A (en) 1984-09-12
GB2136210B true GB2136210B (en) 1987-09-23

Family

ID=10537934

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08303980A Expired GB2136210B (en) 1983-02-14 1983-02-14 Method of forming substrates

Country Status (1)

Country Link
GB (1) GB2136210B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
FR2633400B1 (en) * 1988-06-24 1990-11-09 Labo Electronique Physique Automatic control system for integrated circuits
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
FR2798000B1 (en) * 1999-08-27 2002-04-05 St Microelectronics Sa A method of housing a chip optical sensors and in particular semiconductor device or housing containing such a chip
DE102014208526A1 (en) * 2014-05-07 2015-12-03 Infineon Technologies Ag Electronics assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107549A1 (en) * 1970-02-19 1971-09-02 Texas Instruments Inc
JPS5936827B2 (en) * 1979-01-12 1984-09-06 Nippon Telegraph & Telephone

Also Published As

Publication number Publication date
GB2136210A (en) 1984-09-12
GB8303980D0 (en) 1983-03-16

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Effective date: 19950214