DE3871297D1 - Zusammensetzung sowie verfahren zum niederschlagen von loetmittel. - Google Patents

Zusammensetzung sowie verfahren zum niederschlagen von loetmittel.

Info

Publication number
DE3871297D1
DE3871297D1 DE8888115029T DE3871297T DE3871297D1 DE 3871297 D1 DE3871297 D1 DE 3871297D1 DE 8888115029 T DE8888115029 T DE 8888115029T DE 3871297 T DE3871297 T DE 3871297T DE 3871297 D1 DE3871297 D1 DE 3871297D1
Authority
DE
Germany
Prior art keywords
composition
depositing solvent
depositing
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888115029T
Other languages
English (en)
Inventor
Takao Fukunaga
Hisao Nakajima
Kenzo Kobayashi
Masanao Kono
Hisao Irie
Ryo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Harima Chemical Inc
Original Assignee
Furukawa Electric Co Ltd
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Harima Chemical Inc filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE3871297D1 publication Critical patent/DE3871297D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
DE8888115029T 1987-09-14 1988-09-14 Zusammensetzung sowie verfahren zum niederschlagen von loetmittel. Expired - Fee Related DE3871297D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22829887 1987-09-14
JP63156688A JPH0747233B2 (ja) 1987-09-14 1988-06-27 半田析出用組成物および半田析出方法

Publications (1)

Publication Number Publication Date
DE3871297D1 true DE3871297D1 (de) 1992-06-25

Family

ID=26484372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888115029T Expired - Fee Related DE3871297D1 (de) 1987-09-14 1988-09-14 Zusammensetzung sowie verfahren zum niederschlagen von loetmittel.

Country Status (10)

Country Link
US (1) US5145532A (de)
EP (1) EP0307888B1 (de)
JP (1) JPH0747233B2 (de)
KR (1) KR920009987B1 (de)
CN (1) CN1030695C (de)
BR (1) BR8804731A (de)
DE (1) DE3871297D1 (de)
ES (1) ES2032915T3 (de)
MY (1) MY104328A (de)
SG (1) SG35293G (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JP3390245B2 (ja) * 1993-06-01 2003-03-24 富士通株式会社 洗浄液及び洗浄方法
EP0683008A4 (de) * 1993-12-06 1997-10-08 Furukawa Electric Co Ltd Lotschichtzusammensetzung und packungsverfahren unter benutzung desselben.
US5565261A (en) * 1994-10-31 1996-10-15 Motorola, Inc. Selective call radio having a ceramic substrate for circuit device interconnection
EP0961809B1 (de) * 1997-02-20 2007-02-07 Partnerships Limited, Inc. Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
US6752309B1 (en) * 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
JP4094982B2 (ja) 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
KR100772306B1 (ko) 2004-03-30 2007-11-02 가부시키가이샤 다무라 세이사쿠쇼 가열 장치 및 리플로 장치, 땜납 범프 형성 방법 및 장치
JP3964911B2 (ja) 2004-09-03 2007-08-22 松下電器産業株式会社 バンプ付き基板の製造方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
JP4287475B2 (ja) 2004-12-17 2009-07-01 パナソニック株式会社 樹脂組成物
WO2006082909A1 (ja) 2005-02-03 2006-08-10 Matsushita Electric Industrial Co., Ltd. フリップチップ実装体とその実装方法及びバンプ形成方法
US7910403B2 (en) 2005-03-09 2011-03-22 Panasonic Corporation Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
US7927997B2 (en) 2005-03-15 2011-04-19 Panasonic Corporation Flip-chip mounting method and bump formation method
WO2006098268A1 (ja) * 2005-03-16 2006-09-21 Matsushita Electric Industrial Co., Ltd. 導電性粒子を用いたフリップチップ実装方法およびバンプ形成方法
WO2006098196A1 (ja) 2005-03-17 2006-09-21 Matsushita Electric Industrial Co., Ltd. 半導体チップを備えた実装体およびその製造方法
CN101147249B (zh) 2005-03-24 2010-05-19 松下电器产业株式会社 电子部件安装方法和电子电路装置
CN100536102C (zh) 2005-03-28 2009-09-02 松下电器产业株式会社 倒装片安装体和倒装片安装方法及倒装片安装装置
KR101181140B1 (ko) 2005-03-29 2012-09-14 파나소닉 주식회사 플립칩 실장방법 및 기판간 접속방법
WO2006103948A1 (ja) 2005-03-29 2006-10-05 Matsushita Electric Industrial Co., Ltd. フリップチップ実装方法およびバンプ形成方法
JP4227659B2 (ja) 2005-04-06 2009-02-18 パナソニック株式会社 フリップチップ実装方法及びバンプ形成方法
WO2006123554A1 (ja) * 2005-05-17 2006-11-23 Matsushita Electric Industrial Co., Ltd. フリップチップ実装体およびフリップチップ実装方法
CN101176200B (zh) 2005-05-17 2010-11-03 松下电器产业株式会社 倒装片安装方法、倒装片安装装置及倒装片安装体
US7905011B2 (en) 2006-03-16 2011-03-15 Panasonic Corporation Bump forming method and bump forming apparatus
US7537961B2 (en) 2006-03-17 2009-05-26 Panasonic Corporation Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
US8297488B2 (en) 2006-03-28 2012-10-30 Panasonic Corporation Bump forming method using self-assembling resin and a wall surface
CN100390050C (zh) * 2006-03-30 2008-05-28 云南省化工研究院 一种连续式制备磷酸二氢钾的方法
WO2007125789A1 (ja) 2006-04-27 2007-11-08 Panasonic Corporation 接続構造体及びその製造方法
CN101578694B (zh) 2006-12-27 2011-07-13 松下电器产业株式会社 导电性凸块及其形成方法和半导体装置及其制造方法
US7569164B2 (en) * 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
JP5368299B2 (ja) 2007-04-27 2013-12-18 パナソニック株式会社 電子部品実装体及びハンダバンプ付き電子部品の製造方法
US9877399B2 (en) * 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
GB201812664D0 (en) * 2018-08-03 2018-09-19 Imperial Innovations Ltd Recycling of lead-and tin-based materials
KR102561654B1 (ko) * 2019-04-09 2023-07-31 이시카와 테크놀로지 라보라토리 컴퍼니 리미티드 땜납 제품의 제조 방법, 땜납, 납땜 부품, 땜납 제품, 프린트 배선판, 프린트 회로판, 선재, 납땜 제품, 플렉시블 프린트 기판, 전자 부품, 주석 성형품의 제조 방법, 주석 중간제품의 제조 방법, 주석 성형품, 주석 중간제품 및 도전부재
CN110634593B (zh) * 2019-10-30 2021-05-25 合肥微晶材料科技有限公司 一种具有低方阻及优异耐弯折性能的纳米银线柔性透明导电膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1508343A1 (de) * 1966-05-21 1969-10-30 Siemens Ag Loetpaste zur Herstellung von Loetverbindungen metallischer Teile
US3978378A (en) * 1973-02-12 1976-08-31 The Dow Chemical Company Articles having electroconductive components of highly electroconductive resinous compositions
DE3010610A1 (de) * 1980-03-20 1981-10-01 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen
HU181746B (en) * 1980-10-22 1983-11-28 Richter Gedeon Vegyeszet Process for preparing vinblastine and leurosidine derivatives
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
SE8403074D0 (sv) * 1984-06-07 1984-06-07 Granstroem Ab E Ljusspridande lins
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
JPS62227593A (ja) * 1986-03-28 1987-10-06 Harima Chem Inc 有機半田
JP2604593B2 (ja) * 1986-05-19 1997-04-30 ハリマ化成 株式会社 金属表面に半田被膜を形成する方法
JPS63113073A (ja) * 1986-05-19 1988-05-18 Harima Chem Inc 電子回路部材を接着し且つその端子間に選択的に電気的導通を得る方法
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream

Also Published As

Publication number Publication date
MY104328A (en) 1994-03-31
ES2032915T3 (es) 1993-03-01
JPH0747233B2 (ja) 1995-05-24
BR8804731A (pt) 1989-04-18
CN1030695C (zh) 1996-01-17
US5145532A (en) 1992-09-08
EP0307888A2 (de) 1989-03-22
SG35293G (en) 1993-06-11
EP0307888B1 (de) 1992-05-20
JPH01157796A (ja) 1989-06-21
KR920009987B1 (ko) 1992-11-10
EP0307888A3 (en) 1989-09-06
KR890004816A (ko) 1989-05-10
CN1044428A (zh) 1990-08-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee