CN101147249B - 电子部件安装方法和电子电路装置 - Google Patents

电子部件安装方法和电子电路装置 Download PDF

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Publication number
CN101147249B
CN101147249B CN2006800096027A CN200680009602A CN101147249B CN 101147249 B CN101147249 B CN 101147249B CN 2006800096027 A CN2006800096027 A CN 2006800096027A CN 200680009602 A CN200680009602 A CN 200680009602A CN 101147249 B CN101147249 B CN 101147249B
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Prior art keywords
resin composition
electronic
resin
electronic unit
solder powder
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CN2006800096027A
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CN101147249A (zh
Inventor
山下嘉久
辛岛靖治
北江孝史
中谷诚
小岛俊之
小松慎五
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
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    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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Abstract

一种电子部件安装方法，包括以上步骤：在将包括焊料粉、对流添加剂和在焊料粉的熔化温度下具有流动性的树脂的树脂合成物(3)涂敷到配线衬底(1)的主表面上，所述配线衬底配置有导电配线和连接端子；准备包括多个电子部件(7、8和9)的电子部件组，所述电子部件至少包括无源部件，各个电子部件包括电极端子；将连接端子和电极端子的位置对齐，并且使电子部件组与树脂合成物的表面毗邻；通过至少加热树脂合成物来熔化焊料粉，使得使用对流添加剂在连接端子和电极端子之间自组装焊料粉的同时生长焊料粉，并且将连接端子和电极端子彼此焊接连接；以及使树脂合成物中的树脂硬化，并且使用硬化的树脂将电子部件组的每一个牢固地粘附到配线衬底上。因此，可以无需预先形成凸块显著地简化安装工艺。

Description

电子部件安装方法和电子电路装置
技术领域
本发明涉及一种电子部件安装方法，用于通过焊接将诸如半导体元件和贴片电阻器之类的电子部件一批地安装到配线衬底上，以及根据所述方法产生的电路装置。
背景技术
在通过将诸如半导体元件和贴片电阻器之类的电子部件安装到配线衬底上来生产电子电路的情况下，所述部件一般通过焊接相连。
例如，当对诸如贴片电阻器和贴片电容器之类的无源部件进行固定时，通过丝网印刷将预定量的焊剂印刷到配线衬底的连接端子上，并且利用焊剂的粘附强度来固定无源部件。在固定了多个无源部件之后，将它们放置在回流炉中并且一批地焊接相连。
然而前述连接方法具有以下问题：随着诸如贴片电阻器和贴片电容器之类的无源部件尺寸持续减小时，当将部件极性焊料连接时，在相邻连接端子之间可能会出现焊料短路；并且通过丝网印刷涂敷焊剂更加困难，并且使用部件供应者将无源部件精确地安装到配线衬底上的预定位置处更加困难。
作为生产电子电路装置的方法，不但将无源部件而且将半导体元件一批地安装到配线衬底上。例如，在半导体元件包括诸如QFP之类的引腿(lead pin)和诸如贴片电阻器之类的芯片部件情况下，按照与前述情况类似的方式将焊剂预先涂敷到配线衬底的连接端子上，并且利用焊剂的粘附强度固定半导体元件和芯片部件。随后，将它们放置在回流炉中以一批地焊接连接。
在半导体元件具有BGA结构的情况下，提供焊料球，并且通过焊料球将半导体元件和配线衬底彼此相连。另外，在一些情况下将具有裸芯片结构的半导体元件直接安装在配线衬底上。在所述直接安装方法中，在半导体元件的电极端子的表面上形成材料是焊料、金(Au)等的凸块(bump)，以便经由凸块实现连接。可以广泛地采用其中使用这种凸块的倒装芯片安装方法，因为可以实现这样的连接：其中可以实现具有精细间距和小尺寸高功能型的电子电路装置。
图8A至图8B是用于描述传统电子电路装置生产方法示例的过程的剖面图。如图8A所示，首先通过丝网印刷方法等将焊剂层53形成于配置有导电配线(未示出)的配线衬底51的连接端子52的表面上，并且将焊料凸块56形成于半导体元件54的电极端子55上。接下来，将配线衬底51的连接端子52和半导体元件54的电极端子55的位置对齐，并且另外将芯片部件57和配线衬底51的连接端子52的位置对齐。然后，将配线衬底51和半导体元件54和芯片部件57临时地彼此固定，并且按照将配线衬底51和半导体元件54和芯片部件57放置在回流炉中的方式对配线衬底51和半导体元件54和芯片部件57加热，使得焊料熔化。因此，电极端子55和58与配线衬底51的连接端子52电连接。因此获得的连接状态如图8B所示。
可以将已封装的半导体元件按照与处理芯片部件相同的方式进行处理并且在相同工艺中受到回流工艺。然而，裸芯片半导体元件经常要求与精细间距的连接，这使得半导体元件难以按照与芯片部件的焊接连接相同的工艺进行回流。
为了克服这种困难，提出了一种传统的方法，其中将诸如贴片电阻器和贴片电容器之类的芯片部件在第一回流工艺中进行安装，并且随后使用超声波将配置有凸块的半导体元件的电极端子安装到配线衬底的连接端子上(例如，参见专利文献1)。
为了实现倒装芯片安装方法，需要在半导体元件的电极端子的表面上形成凸块。然而，随着端子数目的增加，凸块的形成变得更加昂贵。
用于形成凸块的传统方法的示例包括镀敷方法、丝网印刷方法等。镀敷方法能够形成具有精细间距的凸块，然而镀敷工艺复杂。另外，镀敷方法在其生产率和废料处置方面是不利的。丝网印刷方法在生产率方面是出众的，然而要求使用印刷掩模，使得难以形成具有精细间距的凸块。
例如，以下方法可用于通过焊料形成具有精细间距的凸块的方法。将其主要成分是有机酸铅盐和金属锡的糊状合成物(通过化学反应沉积的焊料)完全地散布在配置有连接端子的配线衬底上，并且加热配线衬底，使得在铅(Pb)和锡(Sn)之间产生替代反应，然后将Pb/Sn合金选择性地沉积到配线衬底的连接端子上(例如，参见专利文献2)。
专利文献1：日本专利特许公开2003-60339
专利文献2：日本专利特许公开H01-157796
发明内容
本发明将要解决的问题
如上所述，在传统采用的半导体元件倒装芯片安装方法中，不管是对半导体元件和诸如芯片部件之类的其他元件一批进行回流焊接的方法、还是在不同的工艺中使用上述超声波只连接半导体元件的方法，需要在半导体元件中提供凸块。
在使用通过化学反应衬底的焊料形成凸块时，因为采用特定的化学反应，限制了焊料合成物的选择，并且不易于处理其中支持无铅(无Pb)安装结构的当前趋势。
另外，存在其中使用各向异性导电材料代替焊料的倒装芯片安装方法，以及其中使用导电树脂材料代替焊料的方法。然而在这些方法中，存在这样的缺点：增加了连接电阻，难以实现具有精细间距的安装，以及难以将半导体元件和芯片部件等一批地安装。
另外，例如实际采用0603尺寸作为诸如贴片电阻器和贴片电容器的无源部件的尺寸，并且正在进行将所述尺寸减小到0402尺寸的发展。根据传统的安装方法非常难以安装具有这种小尺寸的无源部件。
提出本发明以便解决前述问题，并且本发明的主要目的是提出一种电子部件安装方法，能够按照可靠地方式一批地安装具有诸如贴片电阻器之类的微尺寸的无源部件和诸如精细间距半导体元件之类的电子部件，以及其中采用所述方法的电子电路装置。
解决所述问题的方法
为了实现前述目的，根据本发明的电子部件安装方法包括：
第一步骤，准备包括主表面并且在主表面上配置有导电配线和连接端子的配线衬底，至少包含无源部件的包括多个电子部件的一组电子部件，各个电子部件包括电极端子，并且树脂合成物包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂；
第二步骤，将树脂合成物涂敷到配线衬底的主表面上；
第三步骤，将连接端子和电极端子的位置对齐，并且使电子部件组与树脂合成物的表面毗邻；
第四步骤，通过至少加热树脂合成物来熔化焊料粉，在使用对流添加剂在连接端子和电极端子之间自组装焊料粉的同时生长焊料粉，并且将连接端子和电极端子彼此焊接连接；以及
第五步骤，使树脂合成物中的树脂硬化，并且使用硬化的树脂将电子部件组的每一个牢固地粘附到配线衬底上。
在前述方法中，优选地在第一步骤中准备至少包括半导体元件的电子部件组。无源部件指的是诸如贴片电阻器或贴片电容器之类的电子部件。半导体元件指的是在诸如半导体集成电路元件自身起作用的电子部件。这些部件与通常定义的部件相同。
根据本方法，可以一批地焊接连接至少包括无源部件的多个电子部件。因为无需在这些电子部件中事先形成凸块、焊剂等，可以大大简化生产工艺。
在其中将至少半导体元件包括作为电子部件的情况下，不管是精细间距的半导体元件还是裸芯片半导体元件，可以在相同的工艺中一批地安装所述部件。
如上所述，根据本发明的安装方法，可以将类型彼此不同的多个电子部件在相同的工艺中、相同的工艺条件下安装到配线衬底上。另外，可以在焊接连接步骤之后通过树脂合成物中的树脂将电子部件和配线衬底彼此固定，这简化了工艺并且改善了连接的可靠性。另外，本安装方法与传统方法不同之处在于：通过焊料粉的自组装来生长焊料。因此，甚至当各个电子部件和配线衬底之间的间隔不同时，也可以有利地将各个电子部件和配线衬底彼此连接。结果，可以改善安装工艺中的生产率。
在第三步骤的优选模式中，准备包括多个凹入部分的临时固定衬底，所述凹入部分用于分离地容纳组成电子部件组的电子部件，将电子部件插入到临时固定衬底的相应凹入部分中，并且临时地与所述凹入部分固定，对临时固定衬底进行定位以便面对树脂合成物，使得通过一次操作使电子部件组与树脂合成物毗邻。优选地在其中保持电子部件组与树脂合成物毗邻的情况下执行第四步骤。
因此，可以精确地设定配线衬底上提供电子部件的位置。在这种情况下，优选地，临时固定衬底的表面具有相对于焊料较弱的润湿性。另外，可以使用胶带等以便将电子部件临时地固定到临时固定衬底的凹入部分上。作为不同的方法，可以将具有橡胶弹性的材料用作临时固定衬底，使得通过橡胶弹性将电子部件固定到凹入部分中。在安装厚度(高度维度)彼此不同的电子部件的情况下，临时固定衬底可以具有平板形状。
优选地，在第三步骤中通过树脂合成物的树脂将临时固定衬底牢固地粘附到配线衬底上。因此，临时固定衬底可以作为电子部件的保护构件。
在第三步骤的另一个优选模式中，准备其与电子部件组接触的表面具有柔性的挤压构件，并且在使电子部件组与树脂合成物毗邻之后，通过挤压构件一批地挤压电子部件组，以便使电子部件组与树脂合成物毗邻。优选地在其中保持电子部件组与树脂合成物毗邻的状态的同时执行第四步骤。
因此，当加热树脂合成物使得焊料自组装地生长时，可以保持电子部件与树脂合成物毗邻的状态。结果，可以可靠地焊接连接微尺寸芯片部件。另外，在电子部件具有不同厚度的情况下，柔性挤压构件可以吸收不同的厚度，允许按照稳定的方式通过按焊接一批地连接电子部件。
在第二步骤的优选模式中，将树脂合成物涂敷到配线衬底的整个表面上，或者将树脂合成物只涂敷到配线衬底上与电子部件相对应的区域上。
优选地，在第一步骤中准备包括具有以下性质的对流添加剂的树脂合成物：在焊料粉的熔化温度时产生气体。优选地，通过当在第四步骤中熔化焊料粉时从对流添加剂产生的气体对流，将焊料粉自组装到电极端子的表面和连接端子的表面上。
在前述情况下，优选地，在第一步骤中准备包括对流添加剂的树脂合成物，所述对流添加剂具有沸点，所述沸点至少是焊料粉的熔化温度并且至多是树脂的硬化温度。在第四步骤中，树脂合成物的加热温度至少是对流添加剂的沸点，并且至多是树脂合成物的硬化温度。
优选地在第一步骤中准备树脂合成物，所述树脂合成物包括从由树脂基焊剂、甘油和蜡构成的组中选定的一个、两个或更多对流添加剂。
优选地，在从第三步骤到第五步骤的时间段期间，保持电子部件组和配线衬底之间的间隔。
因此，通过对流添加剂稳妥地产生对流。因此，可以在各个电极端子和连接端子之间均匀地出现通过焊料粉的自组装产生的焊料生长。结果，可以显著地避免焊料连接的失效。
优选地，在第一步骤中准备包括作为树脂的热固性树脂的树脂合成物。
在前述情况下，优选地，在第五步骤中按照比在第四步骤中使用的树脂合成物的加热温度高的温度对树脂进行加热和硬化。
因此，可以通过焊料的生长稳妥地实现焊料连接，并且可以减少树脂合成物中的焊料粉的残留。另外，因为可以在将焊料熔化的状态时将树脂硬化，焊接不能成为环形。因此，可以当端子之间的间隔是精细间隔时防止相邻电子部件免于短路。
优选地，在第一步骤中准备包括光固化树脂(photosettingresin)作为树脂的树脂合成物。在这种情况下，优选地通过在第五步骤中光的照射来使树脂硬化。因此，可以减小硬化所需的时间段。
根据本发明的电子电路装置包括：
配线衬底，包括主表面并且在主表面上配置有导电配线和连接端子；
一组电子部件，包括至少包含无源部件的多个电子部件并且将所述电子部件安装到配线衬底上，各个电子部件包括电极端子；以及
树脂合成物，用于将各个电子部件牢固地粘附到配线衬底上，其中
树脂合成物包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂，通过焊料粉的自组装和熔化将电极端子和连接端子彼此相连，并且通过树脂将电子部件和配线衬底牢固地彼此相连。
根据前述构造，可以将包括无源部件的多个电子部件采用相同的树脂一批地安装和固定。另外，在其中包括一个或更多半导体元件的情况下，可以按照类似地方式将电子部件一批地安装到配线衬底上，这大大地简化了安装工艺。
根据本发明的电子电路装置包括：
配线衬底，包括主表面并且在主表面上配置有导电配线和连接端子；
一组电子部件，包括至少包含无源部件的多个电子部件并且将所述电子部件安装到配线衬底上，各个电子部件包括电极端子；
保护衬底，用于覆盖电子部件组；以及
树脂合成物，用于将各个电子部件和保护衬底牢固地粘附到配线衬底上，其中
树脂合成物包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂，通过焊料粉的自组装和熔化将电极端子和连接端子彼此相连，并且通过树脂将电子部件和配线衬底牢固地彼此相连。
根据前述构造，可以将包括无源部件的多个电子部件一批地安装到配线衬底上，并且通过保护衬底进行保护。
在前述构造中，优选地电子部件还至少包括半导体元件。
本发明的效果
根据本发明的电子部件安装方法，不必在电子部件和配线衬底的任意一个上形成焊料凸块，这大大地简化了安装工艺。因为可以在相同的工艺中安装诸如芯片部件之类的无源部件和半导体元件，可以进一步地简化安装工艺。结果，可以便宜地提供电子电路装置。
附图说明
图1A是用于描述根据本发明第一优选实施例的电子部件安装方法的第一主工艺的剖面图。
图1B是用于描述根据第一优选实施例的电子部件安装方法的第二主工艺的剖面图。
图1C是用于描述根据第一优选实施例的电子部件安装方法的第三工艺的剖面图。
图2A是用于描述根据本发明第二优选实施例的电子部件安装方法的第一主工艺的剖面图。
图2B是用于描述根据第二优选实施例的电子部件安装方法的第二主工艺的剖面图。
图2C是用于描述根据第二优选实施例的电子部件安装方法的第三工艺的剖面图。
图3是用于描述根据第一优选实施例或第二优选实施例的电子部件安装方法将安装其部件的另一个电子电路装置的平面图。
图4A是用于描述根据本发明第三优选实施例的电子部件安装方法的第一主工艺的剖面图。
图4B是用于描述根据第三优选实施例的电子部件安装方法的第二主工艺的剖面图。
图4C是用于描述根据第三优选实施例的电子部件安装方法的第三工艺的剖面图。
图5是根据所述安装方法产生的电子电路装置的平面图。
图6是作为根据第三优选实施例的电子部件安装方法产生的修改示例的电子电路装置的剖面图。
图7是作为根据第三优选实施例的电子部件安装方法产生的另一个修改示例的电子电路装置的剖面图。
图8A是用于描述根据传统技术的电子电路装置生产方法的示例的第一工艺的剖面图。
图8B是用于描述根据传统技术的电子电路装置生产方法的示例的第二工艺的剖面图。
附图标记描述
1、14、21、51            配线衬底
2a、2b、2c、22a、
22b、22c、22d、52        连接端子
3                        树脂合成物
4                        树脂
5                        焊料粉
6、15、16、17、23、43    半导体元件(电子部件)
7、18、19                贴片电阻器(电子部件)
8、20                    贴片电容器(电子部件)
6a、7a、8a、18a、19a、20a、
23a、24a、25a、55、58    电极端子
10                       挤压构件
11                       焊料
12、30、40、50           临时固定衬底
13a、13b、13c、30a、
30b、30c、40a、40b、
40c、50a、50b、50c        凹入部分
24                    第一贴片电容器
25                    第二贴片电容器
26                    导电配线
40d、40e、40f、40g    区域
50d、50e              凸出部分
53                    焊料层
56                    焊料凸块
57                    芯片部件
具体实施方式
在下文中，将参考附图描述本发明的优选实施例。对同样的部件提供相同的附图标记，并且不会多余地进行描述。
第一优选实施例
图1A至图1C是用于描述根据本发明第一优选实施例的电子部件安装方法的主要工艺的剖面图。
如图1A所示，准备了配线衬底1，配置有与组成将要安装的电子部件组的各个电子部件的电极端子相对应的连接端子2a、2b和2c。在配线衬底1的表面上不仅形成连接端子2a、2b和2c，而且形成将这些连接端子和用于外部连接等的连接端子相连的导电配线(未示出)。配线衬底1可以包括单层的配线或双面配线，或者可以具有多层结构，其中提供内部层导体和直通电极或内部通孔等，并且在所述多层结构的背表面上进一步地形成导电配线。配线衬底1的主要介质可以是树脂、诸如铝、玻璃等之类的陶瓷。
在本优选实施例中描述了其中将半导体元件、贴片电阻器和贴片电容器作为电子部件组而一批地安装的示例。因此，当描述各个电子部件时，将它们相应地称为半导体元件6、贴片电阻器7和贴片电容器8。另外在本优选实施例中，仅仅在半导体元件6的电极端子6a的表面上形成相对于焊料具有有利的润湿性的薄膜，并且在所述表面上不提供焊料凸块等。
按照与半导体元件6的电极端子6a相对应的这种方式形成配线衬底1的连接端子2a。按照类似的方式，按照与贴片电阻器7相对应的方式形成连接端子2b，并且按照与贴片电容器8相对应的方式形成连接端子2c。
将树脂合成物3在配线衬底1上展开。那么所使用的树脂合成物3是糊状的，并且具有相对较大的粘性。树脂合成物3作为其主要成分包括：焊料粉5、对流添加剂(未示出)和对流添加剂(未示出)和在焊料粉5的熔化温度具有流动性的树脂4。在涂敷树脂合成物3之前，需要用诸如丙酮、乙醇或之类的有机溶剂或清洁液体对配线衬底1的表面(具体地，连接端子2a、2b和2c的表面)进行清洁。
以下描述使用锡(Sn)-银(Ag)-铜(Cu)基合金作为焊料粉5的情况，活性成分为有机酸的树脂基焊剂用作对流添加剂，并且使用诸如环氧树脂之类的热固性树脂作为树脂合成物3中的树脂。
接下来如图1B所示，将半导体元件6的电极端子6a与连接端子2a位置对齐，使得半导体元件6与树脂合成物3毗邻。按照类似的方式，将贴片电阻器7的电极端子7a与连接端子2b位置对齐，使得贴片电阻器7与树脂合成物3毗邻。另外，将贴片电容器8的电极端子8a与连接端子2c位置对齐，使得贴片电容器8与树脂合成物3毗邻。
在电极端子6a、7a和8a以及连接端子2a、2b和2c的表面上形成相对于焊料具有有利的润湿性的金属层，例如金(Au)层。另外，将相对于焊料具有较差的润湿性的保护膜至少形成于配线衬底上涂敷树脂合成物3区域中的导电配线的表面上。保护膜的示例包括诸如氧化硅薄膜之类的无机保护膜和诸如镀敷抗蚀剂之类的树脂保护膜。
在使诸如半导体元件6、贴片电阻器7和贴片电容器8之类的全部电子部件与树脂合成物3的表面毗邻之后，通过具有柔性的挤压构件10向所述表面施加压力到在电子部件和配线衬底1之间不会产生任何间隔或移位的程度。例如，可以使用其中将热阻液体容纳在金属板和聚酰亚胺膜之间的构件作为具有柔性的挤压构件10。因此，可以通过一次操作容易地挤压具有不同厚度的多个电子部件。可以相等地设定电极端子6a、7a和8a与连接端子2a、2b和2c之间的间隔H。然而，可以依赖于相应电子部件的电极端子的间距而不同地设定该间隔，例如在精细间距的情况下较小而在粗略间距的情况下较大。可以通过所施加树脂合成物的量来确定间隔H。因此，可以依赖于各个电子部件来设定所施加的量。
在上述情况下，至少将树脂合成物3加热到熔化焊料粉5的温度。可以通过从配线衬底1一侧或者挤压构件10一侧通过加热器加热树脂合成物3。作为替代方法，可以将整个结构放置在加热炉中以从加热炉的整个外围进行加热，或者可以照射微波使得只加热树脂合成物3及其附近。
加热温度减小了树脂4的粘性，并且增加其流动性。同时，在该温度使对流添加剂沸腾或分解，从而释放出气体。所释放的气体使焊料粉集中地在树脂合成物3附近移动。当处于这种运动中的焊料粉5接触电极端子6a、7a和8a的表面以及连接端子2a、2b和2c的表面时，通过相对于焊料具有有利润湿性的这些表面捕获焊料粉，并且将其生长为熔化状态的焊料11。
因此生长了焊料11，并且当不再由对流添加剂释放气体时，通过焊料11将电极端子6a、7a和8a与连接端子2a、2b和2c彼此相连。
在通过焊料11将电极端子6a、7a和8a与连接端子2a、2b和2c彼此相连、并且不再由对流添加剂释放气体时，使树脂4硬化。在其中使用热固性树脂作为树脂合成物3的树脂4的情况下，可以将树脂4加热到比焊料粉5的熔化温度高的温度时对其进行硬化。作为硬化工艺的结果，将半导体元件6、贴片电阻器7和贴片电容器8粘附并且固定到配线衬底1上。
结果，可以获得根据本优选实施例的电子部件安装方法产生的电子电路装置。
在使用锡-银-铜(Sn-Ag-Au)基合金焊料作为焊料粉5以及使用其活性成分是有机酸的树脂基焊剂作为上述对流添加剂的情况下，优选地，将用于加热配线衬底20以便熔化焊料粉5的温度设定在150-220℃。
在对树脂4进行硬化使得在完成所述连接之后将电子部件6、7、8和配线衬底1彼此粘附并且固定的情况下(例如，在使用环氧树脂作为热固性树脂的情况下)，优选地将加热温度设定在235-260℃的范围内。
焊料粉5不必局限于Sn-Ag-Cu合金，并且可以采用具有在100-300℃范围内的低熔点的任意金属。例如可以使用锡-锌(Sn-Zn)基合金焊料、锡-铋(Sn-Bi)基合金焊料、铜-银(Cu-Ag)基合金焊料等作为低熔点金属。
对流添加剂不必局限于其活性成分是有机酸的树脂基焊剂。可以采用在加热配线衬底1的同时在焊料粉5熔化的温度下沸腾或分解时释放气体的任意材料。
在其中配线衬底1是诸如玻璃之类的透明衬底的情况下，可以使用诸如光聚合低聚体之类的光固化树脂作为树脂合成物3的树脂4，使得通过所照射的光对树脂4进行硬化。
在本优选实施例中，描述了在配置有包括半导体元件、贴片电阻器和贴片电容器的电子部件的电子电路装置中的安装方法，然而本发明不局限于此。例如本发明可应用于将至少包括诸如贴片电阻器和贴片电容器之类的无源部件的多个电子部件一批地安装的情况。另外，可以一批地安装至少包括一个半导体元件的电子部件。无源部件不局限于贴片电阻器和贴片电容器，并且可以没有任何限制地使用表面安装类型的无源部件。半导体元件可以是已封装的半导体元件，或者是裸芯片半导体元件，只要其是无铅的。
第二优选实施例
图2A至图2C是用于描述根据本发明第二优选实施例的电子部件安装方法的主要工艺的剖面图。在本优选实施例中再次描述了其中将半导体元件6、贴片电阻器7和贴片电容器8作为电子部件组一批地安装的示例。因此当描述各个电子部件时，将它们分别称作半导体元件6、贴片电阻器7和贴片电容器8，或者可整体描述时也可以将它们称作电子部件6、7和8。
如图2A所示，准备了临时固定衬底12，用于保持多个电子部件6、7和8以及组成电子电路装置的电子电路组(电子部件6、7和8)。在临时固定衬底12上形成具有与半导体元件6相对应的开口和深度的凹入部分13a、具有与贴片电阻器7相对应的开口和深度的凹入部分13b、以及与贴片电容器8相对应的深度和开口的凹入部分13c。按照吸附的方式，将半导体元件6、贴片电阻器7和贴片电容器8临时地粘附到临时固定衬底12的凹入部分13a、13b和13c。
在前述状态中，将临时固定衬底12相对于配线衬底1位置对齐，使得如图2B所示电子部件6、7和8与配线衬底1上的树脂合成物3毗邻。
接下来如图2C所示，按照与第一优选实施例类似的方式加热树脂合成物3，并且从而使对流添加剂沸腾或分解，使得产生气体并且通过气体产生对流。与气体对流一起，加热熔化的焊料粉5在电极端子6a、7a和8a和连接端子2a、2b和2c的表面上自组装以进行生长。当已熔化的焊料粉5(即焊料11)生长时，经由熔化的焊料11将电极端子6a、7a和8a与连接端子2a、2b和2c彼此粘附。当焊料11进一步地生长并且对流添加剂不再释放气体时，通过焊料11将电极端子6a、7a和8a与连接端子2a、2b和2c彼此相连。在将这些端子完全地彼此相连之后，在比焊料粉5的熔化温度高的温度下加热这些端子，使得树脂合成物3中的树脂4热硬化。其后，去除临时固定衬底12。结果，获得了如图1C所示的电子电路装置(具有与根据第一优选实施例的电子电路装置相同的形状)。
临时固定衬底12可以通过真空吸引牢固地吸附电子部件6、7和8。可以使用透明衬底作为临时固定衬底12，其中将在其上光照射时失去粘附力的粘合剂涂敷到凹入部分13a、13b和13c上，使得通过粘合剂临时地固定电子部件。在这种情况下，当最终去除临时固定衬底12时，从与形成凹入部分13a、13b和13c的表面相对的表面照射光，粘合剂失去粘合剂的粘附力。结果，可以容易地去除临时固定衬底12。
本优选实施例描述了其中按照与第一优选实施例类似的方式将树脂合成物3分离地涂敷到每一个电子部件6、7和8上的示例。可以将所述安装方法应用于如图3所示的电子电路装置。
图3是用于描述根据第一优选实施例或第二优选实施例的电子部件安装方法安装其部件的另一个电子电路装置的平面图。在图3中示出了其中将半导体元件15、16和17、贴片电阻器18和19、以及贴片电容器20一批地安装到配线衬底14上作为电子部件的电子电路装置。因此，在其中将包括作为无源部件的半导体元件15、16和17以及贴片电阻器18、19以及贴片电容器20的多个电子部件一批地进行安装的情况下，可以根据本发明的安装方法将所述电子部件以较好的生产率和简化的结构方法来安装。在如图3所示的半导体元件15、16和17、贴片电阻器18和19、以及贴片电容器20之间存在相对较大间隔的情况下，可以在其中将各个电子部件如第一和第二优选实施例中所述进行安装的区域中彼此独立地形成树脂合成物3。在这种情况下，按照与每一个电子部件相对应的形式(具体地厚度)形成树脂合成物3。
在图3中，贴片电阻器18和19以及贴片电容器20分别配置有电极端子18a、19a和20a。半导体元件15、16和17也配置有电极端子，然而，该电极端子在平面图中不可见而未示出。
第三实施例
图4A至图4C是用于描述根据本发明第三优选实施例的电子部件安装方法的主要工艺的剖面图。电子电路装置可以要求将具有较大电容的贴片电容器布置在的半导体元件电极端子附近作为电子部件，以便从电源配线引入噪声并且防止信号延迟。在这种情况下，可以在某一时间将树脂合成物涂敷到其中提供电子部件组的区域。在本优选实施例中，描述了这种情况下的安装方法。
图5是根据图4A至图4C所示的安装方法产生的电子电路装置的平面图。在图5中示出了在配线衬底21上配置有电子部件组(半导体元件23、第一贴片电容器24和第二贴片电容器25)的电子电路装置的示例。在实际使用许多电子电路装置时，安装了大量的贴片电容器25。在本优选实施例中，将参考其中设置第一和第二贴片电容器24和25的结构作为典型示例进行描述。图5还是出了导电配线26的一部分。另外，图4C是图5所示的电子电路装置沿C-D线得到的剖面图。
在图5中，第一贴片电容器24和第二贴片电容器25是旁路电容器。半导体元件23的电源线分别经由第一和第二贴片电容器24和25通过从连接端子22a延伸的导电配线26以及从连接端子22d延伸的导电配线26接地。
以下参考图4A至图4C描述用于产生电子电路装置的电子部件安装方法。
首先如图4A所示，准备其上形成连接端子22a、22b、22c和22d的配线衬底21。在配线衬底21上还形成省略并且未示出的导电线。在配线衬底21上形成的连接端子中，连接端子24a与第一贴片电容器24的电极端子24a相连，连接端子22d与第二贴片电容器25的电极端子25a相连，连接端子22b与半导体元件23的电极端子23a和第一贴片电容器24的电极端子24a相连，以及连接端子22c与半导体元件23的电极端子23和第二贴片电容器25的电极端子24a相连。这些连接端子22b和22c通过导电配线26相连。在导电配线26的表面上形成相对于焊料具有较差润湿性的保护膜，然而在导电配线26的表面上与连接端子22b和22c毗邻的部分上选择性地形成相对于焊料具有较好润湿性的薄膜。
将树脂合成物3涂敷到因此组成如图4A所示的端子和配线的配线衬底1的整个表面上。使用与第一和第二优选实施例中所述相同的树脂合成物作为树脂合成物3。
将半导体元件23、第一电容器24和第二电容器25分别嵌入并且临时地固定到临时固定衬底30的凹入部分30a、30b和30c中。临时固定衬底30的结构和使用临时固定衬底30的电子部件的临时固定与在第二优选实施例中所述的临时固定衬底12的结构和使用临时固定衬底12的电子部件的临时固定相同。
接下来如图4B所示，将临时固定衬底30放置为面对配线衬底21，并且将临时固定衬底30与配线衬底21位置对齐，使得半导体元件23的电极端子23a、24a和25a、第一和第二电容器24和25分别面对连接端子22a、22b、22c和22d。在位置对齐之后，挤压临时固定衬底30，使得半导体元件23、第一和第二电容器24和25与树脂合成物3毗邻。
在前述状态中，至少将树脂合成物3加热到焊料粉5熔化的温度。可以从配线衬底21一侧或者来自临时固定衬底30一侧通过加热器来加热树脂合成物30。作为替代方法，可以将整个结构放置在加热炉中以从结构的整个外围加热，或者可以照射微波使得只加热树脂合成物3及其附近。
在焊料粉5熔化的加热温度时，减小了树脂4的粘性并且增加了树脂4的流动性。同时，在此温度使对流添加剂沸腾或分解，从而释放出气体。释放出的气体使焊料粉5集中地在树脂合成物3周围运动。当这种运动的焊料粉5接触电极端子23a、24a和25a的表面以及连接端子22a、22b、22c和22d的表面，通过相对于焊料具有有利润湿性的这些表面捕获焊料粉，并且将熔化的焊料生长到这些端子的表面上。
当因此生长焊料时，当对流添加剂不再释放气体时通过焊料11将电极端子23a、24a和25a与连接端子22a、22b、22c和22d相连。
在通过焊料11将电极端子23a、24a和25a与连接端子22a、22b、22c和22d相连并且对流添加剂不再释放气体时，树脂4硬化。当使用热固性树脂作为树脂合成物3中的树脂4时，在比焊料粉5的熔化温度高的温度下加热，使得可以硬化树脂4。由于硬化工艺的原因，将半导体元件23、第一和第二电容器24和25粘附并且固定到配线衬底21。
当在硬化工艺之后去除临时固定衬底30时，产生如图4C所示的电子电路装置。
图4A至图4C示出了其中将树脂合成物3涂敷到配线衬底1的整个表面上的示例，然而可以一批处理较少的电子部件，使得可以将树脂合成物3涂敷到相应的区域。
如上所述，根据本优选实施例的电子部件安装方法，可以在相同的工艺以及相同的条件下无需预先形成焊料凸块而将包括半导体元件和无源部件的多个电子部件一批地安装。
图6是作为根据本优选实施例的电子部件安装方法产生的修改示例的电子电路装置的剖面图。电子电路装置与图4的电子电路装置不同之处在于：在本优选实施例中描述的临时固定衬底30在硬化树脂4之后保留，并且用于保护电子部件。在该修改示例中，临时固定衬底40作为保护衬底。
在电子电路装置中，在其中临时固定衬底40与树脂合成物3毗邻的区域40d、40e、40f和40g中将临时固定衬底40和树脂合成物3彼此粘附，并且从而通过配线衬底21粘附和保持临时固定衬底40。因此，已经对其中临时固定衬底40与树脂合成物3毗邻的区域40d、40e、40f和40g进行了处理，使得可以将所述区域的材料和表面容易地与树脂合成物接合。临时固定衬底40还配置有凹入部分40a、40b和40c，并且按照与涉及根据本优选实施例的电子部件安装方法中描述的临时固定衬底30的凹入部分相同的方式组成这些凹入部分。按照这种方式，临时固定衬底40可以保持，并且硬化树脂4之后用作保护衬底。
图7是作为根据本优选实施例的电子部件安装方法产生的另一个修改示例的电子电路装置的剖面图。在电子电路装置中，临时固定衬底50在树脂4硬化之后仍然保持，以便用于保护电子部件的目的，这意味着临时固定衬底50也在该进一步修改的示例中作为保护衬底。然而，将凸出部分50d和50e设置在临时固定衬底50的外围区域中的至少三个部分中，并且临时固定衬底50通过凸出部分50d和50e直接接触配线衬底21。在图7中，只示出了多个凸出部分50d和50e的两个。当临时固定衬底50因此直接接触配线衬底21时，可以保持电子部件23、24和25与配线衬底21之间的恒定间隔。因此，按照全部电极端子和全部连接端子之间更可靠的方式，可以实现通过焊料粉5的自组装生长的焊接连接。临时固定衬底50还配置有凹入部分50a、50b和50c，并且按照与涉及根据本优选实施例的电子部件安装方法中描述的临时固定衬底30的凹入部分相同的方式组成这些凹入部分。
在根据图7所示的进一步修改示例的电子电路装置中，临时固定衬底50保持并且用作保护衬底，但是可以本优选实施例之前所述那样，在树脂4硬化之后去除临时固定衬底50。
当使用光固化树脂作为组成树脂合成物3的树脂4来代替在前述生产方法中的热固性树脂使，可以当在其上照射光时硬化所述树脂。
在各个优选实施例中描述了其中安装半导体元件、贴片电阻器、贴片电容器的组合的情况，以及其中安装多个半导体元件、贴片电阻器、贴片电容器等的组合的情况，然而本发明不局限于此。例如在图3所示的电子电路装置的描述中，使用三个半导体元件、两个贴片电阻器和一个贴片电容器，然而可以一批地安装大量的电子部件。
半导体元件可以具有裸芯片结构，或者可以具有如在CSP情况下的已封装结构。可以使用可以焊接的表面安装类型的任意部件作为诸如贴片电阻器和贴片电容器之类的无源部件。
工业应用性
在根据本发明的电子部件安装方法中，不必在电子部件或配线衬底上预先形成凸块。另外根据所述方法，可以一批地高密度地安装具有精细间距的半导体元件和无源部件。所述安装方法极大地简化了电子电路装置安装工艺，并且因此对于各种电子装置是有用的。

Claims (18)

1.一种电子部件安装方法，包括：
第一步骤，准备包括主表面并且在主表面上配置有导电配线和连接端子的配线衬底，至少包含无源部件的包括多个电子部件的一组电子部件，各个电子部件包括电极端子，以及包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂的树脂合成物；
第二步骤，将树脂合成物涂敷到配线衬底的主表面上；
第三步骤，将连接端子和电极端子的位置对齐，并且使电子部件组与树脂合成物的表面毗邻；
第四步骤，通过至少加热树脂合成物来熔化焊料粉，在使用对流添加剂使得焊料粉在连接端子和电极端子之间自组装的同时生长焊料粉，并且将连接端子和电极端子彼此焊接连接；以及
第五步骤，使树脂合成物中的树脂硬化，并且使用硬化的树脂将电子部件组的每一个粘附到配线衬底上。
2.根据权利要求1所述的电子部件安装方法，其中
在第一步骤中准备至少包含半导体元件的电子部件组。
3.根据权利要求1所述的电子部件安装方法，其中
准备包括多个凹入部分的临时固定衬底，所述凹入部分用于分离地容纳组成电子部件组的电子部件，将电子部件插入到临时固定衬底的相应凹入部分中，并且临时地与所述凹入部分固定，对临时固定衬底进行定位以便面对树脂合成物，使得在第三步骤中通过一次操作使电子部件组与树脂合成物毗邻；以及
在其中保持电子部件组与树脂合成物毗邻的状态的同时执行第四步骤。
4.根据权利要求3所述的电子部件安装方法，其中
在第三步骤中通过树脂合成物的树脂将临时固定衬底粘附到配线衬底上。
5.根据权利要求1所述的电子部件安装方法，其中
在第三步骤中，准备其与电子部件组接触的表面具有柔性的挤压构件，并且在使电子部件组与树脂合成物毗邻之后，通过挤压构件一批地挤压电子部件组，以便使电子部件组与树脂合成物毗邻；以及
在其中保持电子部件组与树脂合成物毗邻状态的同时执行第四步骤。
6.根据权利要求1所述的电子部件安装方法，其中
在第二步骤中将树脂合成物涂敷到配线衬底的整个表面上。
7.根据权利要求1所述的电子部件安装方法，其中
将树脂合成物仅涂敷到配线衬底上与电子部件相对应的区域上。
8.根据权利要求1所述的电子部件安装方法，其中
在第一步骤中准备包含具有以下性质的对流添加剂的树脂合成物：在焊料粉的熔化温度时产生气体；以及
通过当在第四步骤中熔化焊料粉时从对流添加剂产生的气体对流，将焊料粉自组装到电极端子的表面和连接端子的表面上。
9.根据权利要求8所述的电子部件安装方法，其中
在第一步骤中准备包含对流添加剂的树脂合成物，所述对流添加剂具有沸点，所述沸点至少是焊料粉的熔化温度并且至多是树脂的硬化温度；以及
树脂合成物的加热温度至少是对流添加剂的沸点，并且至多是树脂合成物的硬化温度。
10.根据权利要求9所述的电子部件安装方法，其中
在第一步骤中准备树脂合成物，所述树脂合成物包含从树脂基焊剂、甘油和蜡构成的组中选定的一个、两个或更多对流添加剂。
11.根据权利要求1所述的电子部件安装方法，其中
在从第三步骤到第五步骤的时间段期间，保持电子部件组和配线衬底之间的间隔。
12.根据权利要求1所述的电子部件安装方法，其中
在第一步骤中准备包含作为树脂的热固性树脂的树脂合成物。
13.根据权利要求12所述的电子部件安装方法，其中
在第五步骤中按照比在第四步骤中使用的树脂合成物的加热温度高的温度对树脂进行加热和硬化。
14.根据权利要求1所述的电子部件安装方法，其中
在第一步骤中准备包含作为树脂的光固化树脂的树脂合成物；以及
第五步骤中通过光的照射来使树脂硬化。
15.一种电子电路装置，包括：
配线衬底，包括主表面并且在主表面上配置有导电配线和连接端子；
一组电子部件，包括至少包含无源部件的多个电子部件并且安装到配线衬底上，各个电子部件包括电极端子；以及
树脂合成物，用于将各个电子部件粘附到配线衬底上，其中
树脂合成物包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂，通过焊料粉的自组装和熔化将电极端子和连接端子彼此相连，并且通过树脂将电子部件和配线衬底彼此相连。
16.根据权利要求15所述的电子电路装置，其中
所述电子电路装置至少包括半导体元件。
17.一种电子电路装置，包括
配线衬底，包括主表面并且在主表面上配置有导电配线和连接端子；
一组电子部件，包括至少包含无源部件的多个电子部件并且安装到配线衬底上，各个电子部件包括电极端子；
保护衬底，用于覆盖电子部件组；以及
树脂合成物，用于将各个电子部件和保护衬底粘附到配线衬底上，其中
树脂合成物包括焊料粉、对流添加剂和在焊料粉的熔化温度时具有流动性的树脂，通过焊料粉的自组装和熔化将电极端子和连接端子彼此相连，并且通过树脂将电子部件和配线衬底彼此相连。
18.根据权利要求17所述的电子电路装置，其中
所述电子部件至少包括半导体元件。
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