DE3789301T2 - Verfahren und Vorrichtung zur Herstellung von leitfähigen siebgedruckten Durchleitlöchern unter Verwendung von metallisch plattierten Dickpolymerfilmen. - Google Patents
Verfahren und Vorrichtung zur Herstellung von leitfähigen siebgedruckten Durchleitlöchern unter Verwendung von metallisch plattierten Dickpolymerfilmen.Info
- Publication number
- DE3789301T2 DE3789301T2 DE3789301T DE3789301T DE3789301T2 DE 3789301 T2 DE3789301 T2 DE 3789301T2 DE 3789301 T DE3789301 T DE 3789301T DE 3789301 T DE3789301 T DE 3789301T DE 3789301 T2 DE3789301 T2 DE 3789301T2
- Authority
- DE
- Germany
- Prior art keywords
- printed
- metal
- polymer films
- conductive screen
- producing conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0831—Machines for printing webs
- B41F15/0845—Machines for printing webs with flat screens
- B41F15/0854—Machines for printing webs with flat screens with a stationary squeegee and a moving screen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1262487A | 1987-02-09 | 1987-02-09 | |
US07/058,520 US4747211A (en) | 1987-02-09 | 1987-06-05 | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3789301D1 DE3789301D1 (de) | 1994-04-14 |
DE3789301T2 true DE3789301T2 (de) | 1994-08-11 |
Family
ID=26683800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3789301T Expired - Fee Related DE3789301T2 (de) | 1987-02-09 | 1987-10-09 | Verfahren und Vorrichtung zur Herstellung von leitfähigen siebgedruckten Durchleitlöchern unter Verwendung von metallisch plattierten Dickpolymerfilmen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4747211A (de) |
EP (1) | EP0281704B1 (de) |
DE (1) | DE3789301T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
US5973588A (en) * | 1990-06-26 | 1999-10-26 | Ecco Limited | Multilayer varistor with pin receiving apertures |
GB2242068C (en) * | 1990-03-16 | 1996-01-24 | Ecco Ltd | Varistor manufacturing method and apparatus |
US5044306A (en) * | 1990-06-11 | 1991-09-03 | Gunter Erdmann | Solder applying mechanism |
US6183685B1 (en) | 1990-06-26 | 2001-02-06 | Littlefuse Inc. | Varistor manufacturing method |
US5189261A (en) * | 1990-10-09 | 1993-02-23 | Ibm Corporation | Electrical and/or thermal interconnections and methods for obtaining such |
JPH04361043A (ja) * | 1991-06-06 | 1992-12-14 | Riso Kagaku Corp | 裏写りを生じない孔版印刷法 |
CA2055148C (en) * | 1991-10-25 | 2002-06-18 | Alain Langevin | Method of forming an electrically conductive contact on a substrate |
US5284189A (en) * | 1992-03-16 | 1994-02-08 | Printron, Inc. | Conductive ink packaging for printed circuit board screen printing operations |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US5922397A (en) * | 1997-03-03 | 1999-07-13 | Ormet Corporation | Metal-plating of cured and sintered transient liquid phase sintering pastes |
JP3914606B2 (ja) * | 1997-04-25 | 2007-05-16 | 松下電器産業株式会社 | 接着層の製造装置、両面基板の製造装置および多層基板の製造装置 |
US5980785A (en) * | 1997-10-02 | 1999-11-09 | Ormet Corporation | Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements |
US7005179B2 (en) * | 2002-07-26 | 2006-02-28 | The Regents Of The University Of California | Conductive inks for metalization in integrated polymer microsystems |
WO2008001430A1 (en) * | 2006-06-27 | 2008-01-03 | Mitsubishi Electric Corporation | Screen printing machine and solar battery cell |
TWI347810B (en) * | 2008-10-03 | 2011-08-21 | Po Ju Chou | A method for manufacturing a flexible pcb and the structure of the flexible pcb |
CN102152603B (zh) * | 2010-11-26 | 2012-12-05 | 绍兴三高网印设备有限公司 | 全自动卷装丝印机 |
CN102328504B (zh) * | 2011-06-03 | 2013-04-17 | 珠海紫翔电子科技有限公司 | 一种用于挠性线路板油墨固化的装置和方法 |
CN102328500B (zh) * | 2011-06-03 | 2013-04-17 | 珠海紫翔电子科技有限公司 | 用于挠性线路板连续印刷并干燥的装置和方法 |
CN102328497B (zh) * | 2011-06-03 | 2013-04-17 | 珠海紫翔电子科技有限公司 | 用于挠性线路板连续印刷并油墨干燥的装置和方法 |
CN102303464A (zh) * | 2011-07-04 | 2012-01-04 | 昆山兴协和光电科技有限公司 | 笔记型键盘线路板的全自动卷式印刷工艺及印刷组件 |
US10856365B2 (en) | 2018-11-14 | 2020-12-01 | Mark Allen Ester | Self regulating flexible heating device |
IT202200009725A1 (it) * | 2022-05-11 | 2023-11-11 | Tastitalia S R L | Circuito stampato flessibile ottenuto con un processo semi-additivo |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2419694A (en) * | 1944-10-26 | 1947-04-29 | Mohawk Carpet Mills Inc | Method of stencilling pile fabrics by suction |
US2923651A (en) * | 1954-12-15 | 1960-02-02 | John V Petriello | Metal-plastic film laminates |
US2904916A (en) * | 1957-03-11 | 1959-09-22 | Gladding Mcbean & Co | Apparatus for placing a desing on a three dimensional porous carrier |
US3129442A (en) * | 1959-07-14 | 1964-04-21 | Bradford Dyers Ass Ltd | Stencil printing of thick fabrics |
US3138095A (en) * | 1960-10-27 | 1964-06-23 | Commander Engineering And Mfg | Silk screen printing press |
US3221648A (en) * | 1962-04-11 | 1965-12-07 | Poster Products Inc | Stencil printing process |
US3172358A (en) * | 1962-04-11 | 1965-03-09 | Weiss Franz | Suction stenciling apparatus |
US3221649A (en) * | 1963-04-15 | 1965-12-07 | Poster Products Inc | Screen printing apparatus |
GB1112978A (en) * | 1965-07-21 | 1968-05-08 | Bradford Dyers Ass Ltd | Apparatus for stencil-printing thick fabrics |
US3453957A (en) * | 1966-10-31 | 1969-07-08 | Mc Donnell Douglas Corp | Apparatus for producing filter element |
US3536005A (en) * | 1967-10-12 | 1970-10-27 | American Screen Process Equip | Vacuum screen printing method |
US3741116A (en) * | 1970-06-25 | 1973-06-26 | American Screen Process Equip | Vacuum belt |
US3881971A (en) * | 1972-11-29 | 1975-05-06 | Ibm | Method for fabricating aluminum interconnection metallurgy system for silicon devices |
DE2643226C2 (de) * | 1976-09-25 | 1982-07-29 | Mathias 4815 Schloss Holte Mitter | Vorrichtung zum absatzweisen Bedrucken von Druckgut, insbesondere Warenbahnen mittels mehrerer bewegbarer ebener Schablonen |
NL7710299A (nl) * | 1976-09-25 | 1978-03-29 | Mitter Mathias | Inrichting voor het aanbrengen van patronen en kleuren op drukgoed, in het bijzonder textiel- goed, dat aanwezig is in de vorm van banen of vlakke afzonderlijke stukken, door middel van een op en neer beweegbare vlakdrukzeefschabloon. |
DE2963050D1 (en) * | 1978-02-17 | 1982-07-29 | Du Pont | Use of photosensitive stratum to create through-hole connections in circuit boards |
JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
US4283243A (en) * | 1978-10-24 | 1981-08-11 | E. I. Du Pont De Nemours And Company | Use of photosensitive stratum to create through-hole connections in circuit boards |
US4383494A (en) * | 1979-11-13 | 1983-05-17 | Allied Corporation | Solder-coating apparatus |
GB2078448B (en) * | 1980-06-19 | 1984-03-14 | Standard Telephones Cables Ltd | Electrical printed circuits |
FR2490059A1 (fr) * | 1980-09-09 | 1982-03-12 | Serras Paulet Edouard | Circuit imprime et son procede de fabrication |
US4398335A (en) * | 1980-12-09 | 1983-08-16 | Fairchild Camera & Instrument Corporation | Multilayer metal silicide interconnections for integrated circuits |
US4388862A (en) * | 1981-12-18 | 1983-06-21 | Thomas Jr Thomas A | Apparatus for silk screen printing |
US4386116A (en) * | 1981-12-24 | 1983-05-31 | International Business Machines Corporation | Process for making multilayer integrated circuit substrate |
US4478882A (en) * | 1982-06-03 | 1984-10-23 | Italtel Societa Italiana Telecomunicazioni S.P.A. | Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer |
BE896966A (nl) * | 1983-06-06 | 1983-12-06 | Bell Telephone Mfg | Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens |
US4507852A (en) * | 1983-09-12 | 1985-04-02 | Rockwell International Corporation | Method for making a reliable ohmic contact between two layers of integrated circuit metallizations |
JPS60115245A (ja) * | 1983-11-28 | 1985-06-21 | Toshiba Corp | 半導体装置の製造方法 |
US4519760A (en) * | 1984-04-02 | 1985-05-28 | Burroughs Corporation | Machine for filling via holes in an integrated circuit package with conductive ink |
US4592132A (en) * | 1984-12-07 | 1986-06-03 | Hughes Aircraft Company | Process for fabricating multi-level-metal integrated circuits at high yields |
SE453708B (sv) * | 1985-03-05 | 1988-02-22 | Svecia Silkscreen Maskiner Ab | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
-
1987
- 1987-06-05 US US07/058,520 patent/US4747211A/en not_active Expired - Lifetime
- 1987-10-09 DE DE3789301T patent/DE3789301T2/de not_active Expired - Fee Related
- 1987-10-09 EP EP87308968A patent/EP0281704B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0281704A3 (en) | 1989-11-29 |
US4747211A (en) | 1988-05-31 |
EP0281704B1 (de) | 1994-03-09 |
EP0281704A2 (de) | 1988-09-14 |
DE3789301D1 (de) | 1994-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3789301T2 (de) | Verfahren und Vorrichtung zur Herstellung von leitfähigen siebgedruckten Durchleitlöchern unter Verwendung von metallisch plattierten Dickpolymerfilmen. | |
DE3763134D1 (de) | Verfahren und vorrichtung zur herstellung einer endoprothese mit individueller anpassung. | |
DE3882011T2 (de) | Verfahren und Vorrichtung zur Herstellung von Biopolymer-Einkristall. | |
DE69003152T2 (de) | Verfahren und Vorrichtung zur kontinuierlichen Herstellung von mit fibrilliertem Polymer gebundenen Elektrodenkomponenten. | |
DE3863866D1 (de) | Verfahren zur herstellung von 1-olefinpolymeren. | |
DE68910969D1 (de) | Verfahren und vorrichtung zur herstellung von lipidbläschen. | |
DE3784381D1 (de) | Verfahren und vorrichtung zur herstellung von brot. | |
DE3882412D1 (de) | Verfahren zur herstellung einer elektronischen vorrichtung. | |
DE69119969D1 (de) | Elektrisch leitende Abdeckungen, elektrisch leitende Abdeckungen von elektronischen Apparaten und Verfahren zur Herstellung elektrisch leitender Abdeckungen | |
DE3784373D1 (de) | Verfahren zur herstellung von polymeren. | |
DE3782411D1 (de) | Vorrichtung und verfahren zur herstellung von thermoplastischen harzfilmen. | |
DE3783030T2 (de) | Verfahren und vorrichtung zur herstellung von polypropylenfaeden. | |
DE58903308D1 (de) | Verfahren zur herstellung von 1-olefinpolymeren. | |
DE3887659D1 (de) | Verfahren und Vorrichtung zur Herstellung von Verbundglas. | |
DE58903254D1 (de) | Verfahren zur herstellung von mehrkernigen aromatischen polyaminen. | |
DE3674301D1 (de) | Leitfaehige polymerloesung und verfahren zur herstellung leitfaehiger gegenstaende daraus. | |
DE68900844D1 (de) | Verfahren zur herstellung von graphitelektroden. | |
DE3861640D1 (de) | Verfahren und vorrichtung zur herstellung von luftreifen. | |
DE68906287T2 (de) | Verfahren zur herstellung von acrylamidpolymer-teilchen. | |
DE3852540D1 (de) | Verfahren zur herstellung leitfähiger polymerfilme. | |
DE3777256D1 (de) | Verfahren zur herstellung von bisimiden. | |
DE69011336T2 (de) | Verfahren und vorrichtung zur herstellung von broschüren. | |
DE68911725T2 (de) | Verfahren und Vorrichtung zur Herstellung von Polymeren. | |
DE58901668D1 (de) | Verfahren und vorrichtung zur herstellung von caseinaten. | |
DE68914447T2 (de) | Verfahren zur herstellung von teilchenpolymeren. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |