DE3622090C1 - - Google Patents

Info

Publication number
DE3622090C1
DE3622090C1 DE19863622090 DE3622090A DE3622090C1 DE 3622090 C1 DE3622090 C1 DE 3622090C1 DE 19863622090 DE19863622090 DE 19863622090 DE 3622090 A DE3622090 A DE 3622090A DE 3622090 C1 DE3622090 C1 DE 3622090C1
Authority
DE
Germany
Prior art keywords
copper
acid
tetrakis
ethylenediamine
hydroxypropyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19863622090
Other languages
German (de)
English (en)
Inventor
Walter Dr. 5000 Koeln De Kronenberg
Herbert 5650 Solingen De Breidenbach
Juergen Dr. Hupe
Eberhard 4018 Langenfeld De Knaak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blasberg-Oberflaechentechnik 5650 Solingen De GmbH
Original Assignee
Blasberg-Oberflaechentechnik 5650 Solingen De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg-Oberflaechentechnik 5650 Solingen De GmbH filed Critical Blasberg-Oberflaechentechnik 5650 Solingen De GmbH
Priority to DE19863622090 priority Critical patent/DE3622090C1/de
Priority to EP87109422A priority patent/EP0251302A3/de
Application granted granted Critical
Publication of DE3622090C1 publication Critical patent/DE3622090C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE19863622090 1986-07-02 1986-07-02 Expired - Fee Related DE3622090C1 (xx)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19863622090 DE3622090C1 (xx) 1986-07-02 1986-07-02
EP87109422A EP0251302A3 (de) 1986-07-02 1987-06-30 Alkalisches aussenstromloses Kupferbad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863622090 DE3622090C1 (xx) 1986-07-02 1986-07-02

Publications (1)

Publication Number Publication Date
DE3622090C1 true DE3622090C1 (xx) 1990-02-15

Family

ID=6304162

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863622090 Expired - Fee Related DE3622090C1 (xx) 1986-07-02 1986-07-02

Country Status (2)

Country Link
EP (1) EP0251302A3 (xx)
DE (1) DE3622090C1 (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843164B2 (ja) * 2001-08-21 2011-12-21 日本リーロナール有限会社 銅−樹脂複合材料の形成方法
EP1411147A1 (en) * 2002-10-18 2004-04-21 Shipley Co. L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
CN100402700C (zh) * 2002-11-20 2008-07-16 希普雷公司 无甲醛化学镀铜方法及该方法中使用的溶液
US7892413B2 (en) 2006-09-27 2011-02-22 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
US8425753B2 (en) 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB999497A (en) * 1960-12-31 1965-07-28 Bayer Ag Chemical metal plating
DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
DE1521439A1 (de) * 1964-06-24 1970-03-26 Photocircuits Corp Autokatalytisches Bad und Verfahren zum Herstellen von Metallueberzuegen
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
DE2124331A1 (de) * 1970-05-21 1971-12-02 Shipley Co Wäßrige Lösung zum stromlosen Abscheiden von Kupfer
DE2505958A1 (de) * 1974-02-22 1975-08-28 Philips Nv Universelle verkupferungsloesung
US3959531A (en) * 1971-04-23 1976-05-25 Photocircuits Corporation Improvements in electroless metal plating
US4124399A (en) * 1977-09-13 1978-11-07 Shipley Company Inc. Stabilized electroless plating solutions
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4443257A (en) * 1982-03-09 1984-04-17 Alfachimici S.P.A. Stabilizing mixture for a chemical copper plating bath

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
JPS5920460A (ja) * 1982-07-27 1984-02-02 Nec Corp 無電解銅めつき液

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB999497A (en) * 1960-12-31 1965-07-28 Bayer Ag Chemical metal plating
DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
DE1521439A1 (de) * 1964-06-24 1970-03-26 Photocircuits Corp Autokatalytisches Bad und Verfahren zum Herstellen von Metallueberzuegen
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
DE2124331A1 (de) * 1970-05-21 1971-12-02 Shipley Co Wäßrige Lösung zum stromlosen Abscheiden von Kupfer
US3959531A (en) * 1971-04-23 1976-05-25 Photocircuits Corporation Improvements in electroless metal plating
DE2505958A1 (de) * 1974-02-22 1975-08-28 Philips Nv Universelle verkupferungsloesung
US4124399A (en) * 1977-09-13 1978-11-07 Shipley Company Inc. Stabilized electroless plating solutions
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4443257A (en) * 1982-03-09 1984-04-17 Alfachimici S.P.A. Stabilizing mixture for a chemical copper plating bath

Also Published As

Publication number Publication date
EP0251302A2 (de) 1988-01-07
EP0251302A3 (de) 1988-07-27

Similar Documents

Publication Publication Date Title
DE69224914T2 (de) Stromloses goldbeschichtungsbad
DE69219645T2 (de) Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung
DE69924807T2 (de) Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
DE3210268C2 (de) Wäßriges alkalisches Bad zur stromlosen Abscheidung von Goldüberzügen
DE2049061C3 (de) Alkalisches wäßriges Bad und dessen Verwendung zur stromlosen Verkupferung
DE69213840T2 (de) Bad zur stromlosen Beschichtung mit einer Zinn-Blei-Legierung
DE1521440B2 (de) Verfahren zum Stabilisieren von Bädern für die stromlose reduktive Metallabscheidung. Aren: Photocircuits Corp., Glen Cove, N.Y. (V.St.A.)
DE2457829A1 (de) Verfahren und loesungen fuer die stromlose metallauftragung
DE10026680C1 (de) Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE102006020988B4 (de) Edelmetallhaltiges Nickelbad, dessen Verwendung zur Herstellung einer edelmetallhaltigen Nickelschicht, edelmetallhaltige Nickelschicht sowie deren Verwendung
DE1621311B2 (de) Alkalisches bad zur stromlosen verkupferung
DE3000526A1 (de) Bad zur stromlosen abscheidung von palladium, autokatalytisches palladium- abscheidungsverfahren und palladium-legierung
DE2028950A1 (de) Wässrige Lösung zum stromlosen Abscheiden von Nickel oder Kobalt
DE2559059C3 (de) Stabilisiertes Bad für die stromlose Metallabscheidung
DE3622090C1 (xx)
DE3320308C2 (de) Wäßriges Bad zur stromlosen Abscheidung von Gold und dessen Legierungen und seine Anwendung
DE69002656T2 (de) Formaldehydfreie stromlose Kupferplattierlösung.
DE2124331C3 (de) Wäßrige Lösung zum stromlosen Abscheiden von Kupfer
DE2412134C3 (de) Mittel zum Reinigen von Zinn-Blei-Legierungen
EP0281804A2 (de) Stabilisiertes alkalisches Goldbad zur stromlosen Abscheidung von Gold
DE1621352C3 (de) Stabilisiertes alkalisches Kupferbad zur stromlosen Abscheidung von Kupfer
DE69506344T2 (de) Goldlösung für stromloses Plattieren
EP1763594B1 (de) Verfahren zur verbesserung der lötbarkeit von nickelüberzügen
DE2057757B2 (de) Badlosung zum stromlosen Abscheiden von Metallen
DE1266099B (de) Bad fuer die reduktive Kupferabscheidung

Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D3 Patent maintained restricted (no unexamined application published)
8339 Ceased/non-payment of the annual fee