DE3612692A1 - Negativfotolack-entwicklungsgeraet - Google Patents

Negativfotolack-entwicklungsgeraet

Info

Publication number
DE3612692A1
DE3612692A1 DE19863612692 DE3612692A DE3612692A1 DE 3612692 A1 DE3612692 A1 DE 3612692A1 DE 19863612692 DE19863612692 DE 19863612692 DE 3612692 A DE3612692 A DE 3612692A DE 3612692 A1 DE3612692 A1 DE 3612692A1
Authority
DE
Germany
Prior art keywords
developer
flow rate
water solution
flow rates
development
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19863612692
Other languages
German (de)
English (en)
Other versions
DE3612692C2 (enExample
Inventor
Yoshiki Suzuki
Teruhiko Itami Hyogo Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3612692A1 publication Critical patent/DE3612692A1/de
Application granted granted Critical
Publication of DE3612692C2 publication Critical patent/DE3612692C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE19863612692 1985-06-05 1986-04-15 Negativfotolack-entwicklungsgeraet Granted DE3612692A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60121913A JPS61279858A (ja) 1985-06-05 1985-06-05 ネガレジスト現像装置

Publications (2)

Publication Number Publication Date
DE3612692A1 true DE3612692A1 (de) 1986-12-11
DE3612692C2 DE3612692C2 (enExample) 1989-08-31

Family

ID=14823010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863612692 Granted DE3612692A1 (de) 1985-06-05 1986-04-15 Negativfotolack-entwicklungsgeraet

Country Status (3)

Country Link
US (1) US4688918A (enExample)
JP (1) JPS61279858A (enExample)
DE (1) DE3612692A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578505A3 (en) * 1992-07-10 1994-05-25 Tokyo Ohka Kogyo Co Ltd Method of adjusting concentration of developer
WO2010142050A2 (de) 2009-06-11 2010-12-16 Stefan Schonert Anlage für das befüllen von auskleidungsschläuchen (liner)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886012A (en) * 1987-06-30 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Spin coating apparatus
US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
JPH0754795B2 (ja) * 1993-01-28 1995-06-07 日本電気株式会社 レジスト現像方法
EP0620495A1 (en) * 1993-04-13 1994-10-19 Kodak Limited Photographic processing apparatus
JP3276449B2 (ja) * 1993-05-13 2002-04-22 富士通株式会社 回転塗布方法
TW256929B (enExample) * 1993-12-29 1995-09-11 Hirama Rika Kenkyusho Kk
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
US5821035A (en) * 1996-03-06 1998-10-13 Sony Corporation Resist developing apparatus and resist developing method
KR0183834B1 (ko) * 1996-03-30 1999-04-15 김광호 반도체 제조 장치 및 이를 이용한 웨이퍼 처리 방법
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
IT1291747B1 (it) * 1997-05-16 1999-01-21 Rosauto Srl Apparecchiatura di lavaggio automatica e manuale a funzionamento variabile per pistole a spruzzo e loro componenti
JP2959763B1 (ja) * 1998-01-13 1999-10-06 島田理化工業株式会社 ウェーハ洗浄装置
JPH11260707A (ja) * 1998-03-09 1999-09-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
US6203218B1 (en) * 1998-07-31 2001-03-20 Tokyo Electron Ltd. Substrate processing apparatus and substrate processing method
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US7404681B1 (en) 2000-05-31 2008-07-29 Fsi International, Inc. Coating methods and apparatus for coating
JP3869306B2 (ja) * 2001-08-28 2007-01-17 東京エレクトロン株式会社 現像処理方法および現像液塗布装置
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20040072450A1 (en) * 2002-10-15 2004-04-15 Collins Jimmy D. Spin-coating methods and apparatuses for spin-coating, including pressure sensor
US20050161061A1 (en) * 2003-09-17 2005-07-28 Hong Shih Methods for cleaning a set of structures comprising yttrium oxide in a plasma processing system
TWI249218B (en) * 2004-08-10 2006-02-11 Powerchip Semiconductor Corp Measuring equipment and monitor method for the wet cleaning process
JP2007040739A (ja) * 2005-08-01 2007-02-15 Tokyo Electron Ltd 処理流体の流量測定方法、処理流体を用いる処理方法及びその装置並びに処理用記録媒体
JP5341427B2 (ja) * 2008-08-20 2013-11-13 東京エレクトロン株式会社 基板処理装置、基板処理方法、基板処理プログラム、及び基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
WO2022176685A1 (ja) * 2021-02-19 2022-08-25 富士フイルム株式会社 混合比率の決定方法、および、現像装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005374A2 (en) * 1978-05-05 1979-11-14 Litton Industrial Products Inc. Automatic liquid mixing system
JPS5752132A (en) * 1980-09-16 1982-03-27 Toshiba Corp Manufacturing apparatus for semiconductor
DE3225575A1 (de) * 1981-07-08 1983-03-31 Pioneer Electronic Corp., Tokyo Verfahren und vorrichtung zum entwickeln eines photo-resistmaterials
EP0095711A2 (de) * 1982-05-28 1983-12-07 Agfa-Gevaert AG Nachdosiereinrichtung in einer mit einem Fotosatz in Verbindung stehenden fotografischen Entwicklungsmaschine
DE3416599A1 (de) * 1984-05-04 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur endpunktkontrolle von fotolack-entwicklungsprozessen bei der herstellung integrierter halbleiterschaltungen

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604331A (en) * 1967-07-26 1971-09-14 Du Pont Machine for developing resist images
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
JPS52132A (en) * 1975-06-23 1977-01-05 Nec Corp Memory
CH608115A5 (enExample) * 1975-07-04 1978-12-15 Welp Microbox Dr Gmbh & Co
JPS5364472A (en) * 1976-11-22 1978-06-08 Hitachi Ltd Processing apparatus
JPS54116925A (en) * 1978-03-03 1979-09-11 Hitachi Ltd Development of photoresist
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
JPS5694290A (en) * 1979-12-27 1981-07-30 Kiiningaa Undo Oobaagufueru Fu Clock having timeesounder
JPS56144444A (en) * 1980-04-12 1981-11-10 Victor Co Of Japan Ltd Developing method
JPS56145332A (en) * 1980-04-12 1981-11-12 Victor Co Of Japan Ltd Detecting device for state of proper development
JPS5823440A (ja) * 1981-08-04 1983-02-12 Nec Kyushu Ltd 半導体製造装置
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005374A2 (en) * 1978-05-05 1979-11-14 Litton Industrial Products Inc. Automatic liquid mixing system
JPS5752132A (en) * 1980-09-16 1982-03-27 Toshiba Corp Manufacturing apparatus for semiconductor
DE3225575A1 (de) * 1981-07-08 1983-03-31 Pioneer Electronic Corp., Tokyo Verfahren und vorrichtung zum entwickeln eines photo-resistmaterials
EP0095711A2 (de) * 1982-05-28 1983-12-07 Agfa-Gevaert AG Nachdosiereinrichtung in einer mit einem Fotosatz in Verbindung stehenden fotografischen Entwicklungsmaschine
DE3416599A1 (de) * 1984-05-04 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur endpunktkontrolle von fotolack-entwicklungsprozessen bei der herstellung integrierter halbleiterschaltungen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578505A3 (en) * 1992-07-10 1994-05-25 Tokyo Ohka Kogyo Co Ltd Method of adjusting concentration of developer
US5843602A (en) * 1992-07-10 1998-12-01 Tokyo Ohka Kogyo Co., Ltd. Method of adjusting concentration of developer through load cell utilization and wet nitrogen gas atmosphere
WO2010142050A2 (de) 2009-06-11 2010-12-16 Stefan Schonert Anlage für das befüllen von auskleidungsschläuchen (liner)
WO2010142050A3 (de) * 2009-06-11 2012-04-19 Stefan Schonert Anlage für das befüllen von auskleidungsschläuchen

Also Published As

Publication number Publication date
US4688918A (en) 1987-08-25
JPS61279858A (ja) 1986-12-10
DE3612692C2 (enExample) 1989-08-31
JPH0574816B2 (enExample) 1993-10-19

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8380 Miscellaneous part iii

Free format text: IM HEFT 14/93, SEITE 4000, SP.1: DIE VEROEFFENTLICHUNG IST ZU STREICHEN

8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: PRUFER & PARTNER GBR, 81545 MUENCHEN