DE69031212T2 - Randbelichtungsverfahren für Halbleiterscheiben - Google Patents

Randbelichtungsverfahren für Halbleiterscheiben

Info

Publication number
DE69031212T2
DE69031212T2 DE1990631212 DE69031212T DE69031212T2 DE 69031212 T2 DE69031212 T2 DE 69031212T2 DE 1990631212 DE1990631212 DE 1990631212 DE 69031212 T DE69031212 T DE 69031212T DE 69031212 T2 DE69031212 T2 DE 69031212T2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
exposure process
edge exposure
edge
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1990631212
Other languages
English (en)
Other versions
DE69031212D1 (de
Inventor
Tesuji Arai
Shinji Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Application granted granted Critical
Publication of DE69031212D1 publication Critical patent/DE69031212D1/de
Publication of DE69031212T2 publication Critical patent/DE69031212T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
    • G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
DE1990631212 1990-03-23 1990-03-23 Randbelichtungsverfahren für Halbleiterscheiben Expired - Lifetime DE69031212T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19900105588 EP0448735B1 (de) 1990-03-23 1990-03-23 Randbelichtungsverfahren für Halbleiterscheiben

Publications (2)

Publication Number Publication Date
DE69031212D1 DE69031212D1 (de) 1997-09-11
DE69031212T2 true DE69031212T2 (de) 1998-01-29

Family

ID=8203803

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990631212 Expired - Lifetime DE69031212T2 (de) 1990-03-23 1990-03-23 Randbelichtungsverfahren für Halbleiterscheiben

Country Status (2)

Country Link
EP (1) EP0448735B1 (de)
DE (1) DE69031212T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6572252B1 (en) 2000-04-25 2003-06-03 Advanced Micro Devices, Inc. System and method for illuminating a semiconductor processing system
US6632283B1 (en) * 2000-04-25 2003-10-14 Advanced Micro Devices, Inc. System and method for illuminating a semiconductor processing system
SE522183C2 (sv) 2002-04-24 2004-01-20 Obducat Ab Förfarande, anordning och datorprogramprodukt för litografi
CN1313884C (zh) * 2002-04-24 2007-05-02 奥博杜卡特股份公司 光刻术的方法和装置
JP2012114259A (ja) * 2010-11-25 2012-06-14 Lapis Semiconductor Co Ltd 基板処理システム及び基板処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2143737A1 (de) * 1971-09-01 1973-03-08 Ibm Deutschland Photoaetzverfahren
DE3314156A1 (de) * 1983-04-19 1984-10-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur beschichtung scheibenfoermiger halbleitersubstrate mit photolack
JPS6019564A (ja) * 1983-07-13 1985-01-31 Fuji Photo Film Co Ltd サイドプリント装置
US4899195A (en) * 1988-01-29 1990-02-06 Ushio Denki Method of exposing a peripheral part of wafer

Also Published As

Publication number Publication date
DE69031212D1 (de) 1997-09-11
EP0448735B1 (de) 1997-08-06
EP0448735A1 (de) 1991-10-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition