JPH0574816B2 - - Google Patents

Info

Publication number
JPH0574816B2
JPH0574816B2 JP60121913A JP12191385A JPH0574816B2 JP H0574816 B2 JPH0574816 B2 JP H0574816B2 JP 60121913 A JP60121913 A JP 60121913A JP 12191385 A JP12191385 A JP 12191385A JP H0574816 B2 JPH0574816 B2 JP H0574816B2
Authority
JP
Japan
Prior art keywords
flow rate
developer
solution
development
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60121913A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61279858A (ja
Inventor
Yoshiki Suzuki
Teruhiko Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60121913A priority Critical patent/JPS61279858A/ja
Priority to US06/841,468 priority patent/US4688918A/en
Priority to DE19863612692 priority patent/DE3612692A1/de
Publication of JPS61279858A publication Critical patent/JPS61279858A/ja
Publication of JPH0574816B2 publication Critical patent/JPH0574816B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60121913A 1985-06-05 1985-06-05 ネガレジスト現像装置 Granted JPS61279858A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60121913A JPS61279858A (ja) 1985-06-05 1985-06-05 ネガレジスト現像装置
US06/841,468 US4688918A (en) 1985-06-05 1986-03-20 Negative type photoresist developing apparatus
DE19863612692 DE3612692A1 (de) 1985-06-05 1986-04-15 Negativfotolack-entwicklungsgeraet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60121913A JPS61279858A (ja) 1985-06-05 1985-06-05 ネガレジスト現像装置

Publications (2)

Publication Number Publication Date
JPS61279858A JPS61279858A (ja) 1986-12-10
JPH0574816B2 true JPH0574816B2 (enExample) 1993-10-19

Family

ID=14823010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60121913A Granted JPS61279858A (ja) 1985-06-05 1985-06-05 ネガレジスト現像装置

Country Status (3)

Country Link
US (1) US4688918A (enExample)
JP (1) JPS61279858A (enExample)
DE (1) DE3612692A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886012A (en) * 1987-06-30 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Spin coating apparatus
US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
JP2670211B2 (ja) * 1992-07-10 1997-10-29 東京応化工業株式会社 現像液の調整方法
JPH0754795B2 (ja) * 1993-01-28 1995-06-07 日本電気株式会社 レジスト現像方法
EP0620495A1 (en) * 1993-04-13 1994-10-19 Kodak Limited Photographic processing apparatus
JP3276449B2 (ja) * 1993-05-13 2002-04-22 富士通株式会社 回転塗布方法
TW256929B (enExample) * 1993-12-29 1995-09-11 Hirama Rika Kenkyusho Kk
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
US5821035A (en) * 1996-03-06 1998-10-13 Sony Corporation Resist developing apparatus and resist developing method
KR0183834B1 (ko) * 1996-03-30 1999-04-15 김광호 반도체 제조 장치 및 이를 이용한 웨이퍼 처리 방법
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
IT1291747B1 (it) * 1997-05-16 1999-01-21 Rosauto Srl Apparecchiatura di lavaggio automatica e manuale a funzionamento variabile per pistole a spruzzo e loro componenti
JP2959763B1 (ja) * 1998-01-13 1999-10-06 島田理化工業株式会社 ウェーハ洗浄装置
JPH11260707A (ja) * 1998-03-09 1999-09-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
US6203218B1 (en) * 1998-07-31 2001-03-20 Tokyo Electron Ltd. Substrate processing apparatus and substrate processing method
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US7404681B1 (en) 2000-05-31 2008-07-29 Fsi International, Inc. Coating methods and apparatus for coating
JP3869306B2 (ja) * 2001-08-28 2007-01-17 東京エレクトロン株式会社 現像処理方法および現像液塗布装置
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US20040072450A1 (en) * 2002-10-15 2004-04-15 Collins Jimmy D. Spin-coating methods and apparatuses for spin-coating, including pressure sensor
US20050161061A1 (en) * 2003-09-17 2005-07-28 Hong Shih Methods for cleaning a set of structures comprising yttrium oxide in a plasma processing system
TWI249218B (en) * 2004-08-10 2006-02-11 Powerchip Semiconductor Corp Measuring equipment and monitor method for the wet cleaning process
JP2007040739A (ja) * 2005-08-01 2007-02-15 Tokyo Electron Ltd 処理流体の流量測定方法、処理流体を用いる処理方法及びその装置並びに処理用記録媒体
JP5341427B2 (ja) * 2008-08-20 2013-11-13 東京エレクトロン株式会社 基板処理装置、基板処理方法、基板処理プログラム、及び基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
CH701245B1 (de) * 2009-06-11 2013-05-31 Stefan Schonert Anlage für das Befüllen von Auskleidungsschläuchen.
WO2022176685A1 (ja) * 2021-02-19 2022-08-25 富士フイルム株式会社 混合比率の決定方法、および、現像装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604331A (en) * 1967-07-26 1971-09-14 Du Pont Machine for developing resist images
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
JPS52132A (en) * 1975-06-23 1977-01-05 Nec Corp Memory
CH608115A5 (enExample) * 1975-07-04 1978-12-15 Welp Microbox Dr Gmbh & Co
JPS5364472A (en) * 1976-11-22 1978-06-08 Hitachi Ltd Processing apparatus
JPS54116925A (en) * 1978-03-03 1979-09-11 Hitachi Ltd Development of photoresist
US4312595A (en) * 1978-05-05 1982-01-26 Litton Industrial Products, Inc. Automatic fluid mixing system and a multi compartmented container therefore
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
JPS5694290A (en) * 1979-12-27 1981-07-30 Kiiningaa Undo Oobaagufueru Fu Clock having timeesounder
JPS56144444A (en) * 1980-04-12 1981-11-10 Victor Co Of Japan Ltd Developing method
JPS56145332A (en) * 1980-04-12 1981-11-12 Victor Co Of Japan Ltd Detecting device for state of proper development
JPS5752132A (en) * 1980-09-16 1982-03-27 Toshiba Corp Manufacturing apparatus for semiconductor
GB2108707B (en) * 1981-07-08 1985-06-19 Pioneer Electronic Corp Method and system for developing a photo-resist material used as a recording medium
JPS5823440A (ja) * 1981-08-04 1983-02-12 Nec Kyushu Ltd 半導体製造装置
DE3220169A1 (de) * 1982-05-28 1983-12-01 Agfa-Gevaert Ag, 5090 Leverkusen Nachdosiereinrichtung in einer mit einem fotosatz in verbindung stehenden fotografischen entwicklungsmaschine
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm
DE3416599A1 (de) * 1984-05-04 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur endpunktkontrolle von fotolack-entwicklungsprozessen bei der herstellung integrierter halbleiterschaltungen

Also Published As

Publication number Publication date
US4688918A (en) 1987-08-25
JPS61279858A (ja) 1986-12-10
DE3612692C2 (enExample) 1989-08-31
DE3612692A1 (de) 1986-12-11

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