DE3411020C2 - - Google Patents
Info
- Publication number
- DE3411020C2 DE3411020C2 DE3411020A DE3411020A DE3411020C2 DE 3411020 C2 DE3411020 C2 DE 3411020C2 DE 3411020 A DE3411020 A DE 3411020A DE 3411020 A DE3411020 A DE 3411020A DE 3411020 C2 DE3411020 C2 DE 3411020C2
- Authority
- DE
- Germany
- Prior art keywords
- region
- carrier injection
- drift
- gate electrode
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000002347 injection Methods 0.000 claims description 22
- 239000007924 injection Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims 1
- 230000005669 field effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/482,075 US4743952A (en) | 1983-04-04 | 1983-04-04 | Insulated-gate semiconductor device with low on-resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3411020A1 DE3411020A1 (de) | 1984-10-11 |
| DE3411020C2 true DE3411020C2 (en, 2012) | 1989-03-23 |
Family
ID=23914547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19843411020 Granted DE3411020A1 (de) | 1983-04-04 | 1984-03-24 | Ig-halbleitervorrichtung mit niedrigem on-widerstand |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4743952A (en, 2012) |
| JP (1) | JPS59215767A (en, 2012) |
| DE (1) | DE3411020A1 (en, 2012) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4779123A (en) * | 1985-12-13 | 1988-10-18 | Siliconix Incorporated | Insulated gate transistor array |
| US5472888A (en) * | 1988-02-25 | 1995-12-05 | International Rectifier Corporation | Depletion mode power MOSFET with refractory gate and method of making same |
| JPH0716009B2 (ja) * | 1988-12-02 | 1995-02-22 | 株式会社日立製作所 | 横型絶縁ゲートバイポーラトランジスタ |
| JPH04363069A (ja) * | 1990-09-24 | 1992-12-15 | Nippondenso Co Ltd | 縦型半導体装置 |
| US5401980A (en) * | 1991-09-04 | 1995-03-28 | International Business Machines Corporation | 2D/1D junction device as a Coulomb blockade gate |
| JPH05283703A (ja) * | 1992-01-16 | 1993-10-29 | Natl Semiconductor Corp <Ns> | Dmost接合絶縁破壊の向上 |
| US6110804A (en) * | 1996-12-02 | 2000-08-29 | Semiconductor Components Industries, Llc | Method of fabricating a semiconductor device having a floating field conductor |
| JPH10256550A (ja) * | 1997-01-09 | 1998-09-25 | Toshiba Corp | 半導体装置 |
| DE102004017723B4 (de) * | 2003-04-10 | 2011-12-08 | Fuji Electric Co., Ltd | In Rückwärtsrichtung sperrendes Halbleiterbauteil und Verfahren zu seiner Herstellung |
| US9349847B2 (en) * | 2011-12-15 | 2016-05-24 | Hitachi, Ltd. | Semiconductor device and power converter |
| US9911838B2 (en) * | 2012-10-26 | 2018-03-06 | Ixys Corporation | IGBT die structure with auxiliary P well terminal |
| JP6088401B2 (ja) * | 2013-11-08 | 2017-03-01 | 株式会社豊田中央研究所 | 逆導通igbt |
| CN109148305A (zh) * | 2018-09-13 | 2019-01-04 | 深圳市心版图科技有限公司 | 一种功率器件及其制备方法 |
| CN109192666A (zh) * | 2018-09-14 | 2019-01-11 | 深圳市心版图科技有限公司 | 一种功率器件及其制备方法 |
| CN109119342A (zh) * | 2018-09-14 | 2019-01-01 | 深圳市心版图科技有限公司 | 一种功率器件及其制备方法 |
| CN109192665A (zh) * | 2018-09-14 | 2019-01-11 | 深圳市心版图科技有限公司 | 一种功率器件及其制备方法 |
| CN109273522A (zh) * | 2018-09-14 | 2019-01-25 | 深圳市心版图科技有限公司 | 一种场效应管及其制作方法 |
| CN109119482A (zh) * | 2018-09-14 | 2019-01-01 | 深圳市心版图科技有限公司 | 一种场效应管及其制作方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1471617A (en) * | 1973-06-21 | 1977-04-27 | Sony Corp | Circuits comprising a semiconductor device |
| IT1133869B (it) * | 1979-10-30 | 1986-07-24 | Rca Corp | Dispositivo mosfet |
| US4455565A (en) * | 1980-02-22 | 1984-06-19 | Rca Corporation | Vertical MOSFET with an aligned gate electrode and aligned drain shield electrode |
| US4364073A (en) * | 1980-03-25 | 1982-12-14 | Rca Corporation | Power MOSFET with an anode region |
| US4345265A (en) * | 1980-04-14 | 1982-08-17 | Supertex, Inc. | MOS Power transistor with improved high-voltage capability |
| DE3103444A1 (de) * | 1981-02-02 | 1982-10-21 | Siemens AG, 1000 Berlin und 8000 München | Vertikal-mis-feldeffekttransistor mit kleinem durchlasswiderstand |
| DE3200660A1 (de) * | 1982-01-12 | 1983-07-21 | Siemens AG, 1000 Berlin und 8000 München | Mis-feldeffekttransistor mit ladungstraegerinjektion |
| DE3224642A1 (de) * | 1982-07-01 | 1984-01-05 | Siemens AG, 1000 Berlin und 8000 München | Igfet mit injektorzone |
| GB2128018A (en) * | 1982-09-22 | 1984-04-18 | Philips Electronic Associated | Insulated-gate field-effect transistors |
| US4523111A (en) * | 1983-03-07 | 1985-06-11 | General Electric Company | Normally-off, gate-controlled electrical circuit with low on-resistance |
-
1983
- 1983-04-04 US US06/482,075 patent/US4743952A/en not_active Expired - Lifetime
-
1984
- 1984-03-24 DE DE19843411020 patent/DE3411020A1/de active Granted
- 1984-04-02 JP JP59063452A patent/JPS59215767A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3411020A1 (de) | 1984-10-11 |
| JPS59215767A (ja) | 1984-12-05 |
| US4743952A (en) | 1988-05-10 |
| JPS6137796B2 (en, 2012) | 1986-08-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |