DE3236545C2 - Verfahren und Vorrichtung zum kontinuierlichen Elektroplattieren einzelner Werkstücke - Google Patents
Verfahren und Vorrichtung zum kontinuierlichen Elektroplattieren einzelner WerkstückeInfo
- Publication number
- DE3236545C2 DE3236545C2 DE3236545A DE3236545A DE3236545C2 DE 3236545 C2 DE3236545 C2 DE 3236545C2 DE 3236545 A DE3236545 A DE 3236545A DE 3236545 A DE3236545 A DE 3236545A DE 3236545 C2 DE3236545 C2 DE 3236545C2
- Authority
- DE
- Germany
- Prior art keywords
- workpieces
- bath
- contact wheels
- electrolyte
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000009713 electroplating Methods 0.000 title claims abstract description 7
- 239000003792 electrolyte Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 7
- 239000008151 electrolyte solution Substances 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000004070 electrodeposition Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011449 brick Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/309,180 US4385967A (en) | 1981-10-07 | 1981-10-07 | Electroplating apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3236545A1 DE3236545A1 (de) | 1983-05-05 |
DE3236545C2 true DE3236545C2 (de) | 1991-12-12 |
Family
ID=23197043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3236545A Expired DE3236545C2 (de) | 1981-10-07 | 1982-10-02 | Verfahren und Vorrichtung zum kontinuierlichen Elektroplattieren einzelner Werkstücke |
Country Status (13)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0329807B1 (de) * | 1988-02-25 | 1993-03-31 | Gebr. Schmid GmbH & Co. | Vorrichtung zur Behandlung von elektrischen Leiterplatten |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4459183A (en) * | 1981-10-07 | 1984-07-10 | Chemcut Corporation | Electroplating apparatus and method |
GB2129444B (en) * | 1982-11-01 | 1986-08-28 | Omi Int Corp | Anode structure for a plating cell |
US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
US4696729A (en) * | 1986-02-28 | 1987-09-29 | International Business Machines | Electroplating cell |
DE3645319C3 (de) * | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
JPH07116636B2 (ja) * | 1986-09-26 | 1995-12-13 | 川崎製鉄株式会社 | ラジアル型めつきセル |
DE3638630A1 (de) * | 1986-11-11 | 1988-05-26 | Schering Ag | Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten |
DE3864526D1 (de) * | 1987-01-26 | 1991-10-10 | Siemens Ag | Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
ATE89614T1 (de) * | 1988-09-01 | 1993-06-15 | Siemens Nixdorf Inf Syst | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
EP0362512B1 (de) * | 1988-09-01 | 1993-05-19 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
EP0365767B1 (de) * | 1988-09-01 | 1993-05-19 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
US4871435A (en) * | 1988-10-14 | 1989-10-03 | Charles Denofrio | Electroplating apparatus |
JPH0527894Y2 (US20100056889A1-20100304-C00004.png) * | 1988-11-09 | 1993-07-16 | ||
US4859298A (en) * | 1988-12-07 | 1989-08-22 | Chemcut Corporation | Process and apparatus for electrolytically removing protective layers from sheet metal substrate |
US4999079A (en) * | 1989-06-02 | 1991-03-12 | Chemcut Corporation | Process and apparatus for treating articles and preventing their wrap around a roller |
DE3939681A1 (de) * | 1989-12-01 | 1991-06-06 | Schering Ag | Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung |
DE4123985C2 (de) * | 1991-07-19 | 1994-01-27 | Hoellmueller Maschbau H | Vorrichtung zur elektrolytischen Behandlung von Leiterplatten, insbesondere zur elektrolytischen Beschichtung mit Kupfer |
US5211826A (en) * | 1991-09-26 | 1993-05-18 | Siemens Aktiengesellschaft | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass |
DE4212567A1 (de) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten |
DE4225961C5 (de) * | 1992-08-06 | 2011-01-27 | Atotech Deutschland Gmbh | Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände |
DE4229403C2 (de) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien |
DE4301742C2 (de) * | 1993-01-23 | 1999-07-08 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren plattenförmiger Gegenstände, insbesondere von elektronischen Leiterplatten |
US6168691B1 (en) * | 1996-08-09 | 2001-01-02 | Atotech Deutschland Gmbh | Device for electrochemical treatment of elongate articles |
DE19633797B4 (de) * | 1996-08-22 | 2005-08-04 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen |
DE19633796B4 (de) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten |
DE19736352C1 (de) | 1997-08-21 | 1998-12-10 | Atotech Deutschland Gmbh | Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen |
EP0959153A3 (en) | 1998-05-20 | 2000-09-13 | Process Automation International Limited | An electroplating machine |
US6261425B1 (en) | 1998-08-28 | 2001-07-17 | Process Automation International, Ltd. | Electroplating machine |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
SG85700A1 (en) * | 2000-03-15 | 2002-01-15 | Wus Printed Circuit Co Ltd | Multiple flat substrate electroplating apparatus |
CA2419595A1 (en) * | 2000-10-19 | 2002-04-25 | Atotech Deutschland Gmbh | Copper bath and method of depositing a matt copper coating |
US6676820B2 (en) * | 2001-03-02 | 2004-01-13 | Ppg Industries Ohio, Inc. | Process for electrocoating metal blanks and coiled metal substrates |
DE10153171B4 (de) | 2001-10-27 | 2004-09-16 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen |
DE10206660C1 (de) * | 2002-02-12 | 2003-07-24 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen |
DE10207941A1 (de) * | 2002-02-17 | 2003-09-04 | Egon Huebel | Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen |
DE10210538B4 (de) * | 2002-03-05 | 2004-11-18 | Atotech Deutschland Gmbh | Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut |
DE10215463C1 (de) | 2002-03-28 | 2003-07-24 | Atotech Deutschland Gmbh | Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück |
US6851200B2 (en) * | 2003-03-14 | 2005-02-08 | Hopkins Manufacturing Corporation | Reflecting lighted level |
DE10352708A1 (de) * | 2003-11-07 | 2005-06-09 | Würth Elektronik Pforzheim GmbH & Co. KG | Verfahren und Vorrichtung zum Galvanisieren |
DE10361880B3 (de) * | 2003-12-19 | 2005-05-04 | Atotech Deutschland Gmbh | Behandlungseinheit zur nasschemischen oder elektrolytischen Behandlung von flachem Behandlungsgut und Verwendung der Behandlungseinheit |
US20060219562A1 (en) * | 2005-03-30 | 2006-10-05 | Gramarossa Daniel J | System and method of transporting and providing a cathode contact to articles in an electroplating system |
ATE506468T1 (de) | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
US8309259B2 (en) * | 2008-05-19 | 2012-11-13 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Electrochemical cell, and particularly a cell with electrodeposited fuel |
CA2772935C (en) * | 2009-09-18 | 2016-11-01 | Fluidic, Inc. | Rechargeable electrochemical cell system with a charging electrode charge/discharge mode switching in the cells |
EP2486622B1 (en) * | 2009-10-08 | 2014-07-23 | Fluidic, Inc. | Rechargeable metal-air cell with flow management system |
DE102009047669A1 (de) * | 2009-12-08 | 2011-06-09 | GEMÜ Gebr. Müller Apparatebau GmbH & Co. KG | Ventilkörper mit Inliner und Verfahren zur Herstellung eines Ventilkörpers mit Inliner |
ES2620238T3 (es) | 2010-06-24 | 2017-06-28 | Fluidic, Inc. | Celda electroquímica con ánodo de combustible de andamio escalonado |
CN105206789B (zh) | 2010-09-16 | 2018-09-07 | 流体公司 | 具有渐进析氧电极/燃料电极的电化学电池系统 |
NL2005480C2 (nl) | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
DK2966722T3 (en) | 2010-10-20 | 2018-10-08 | Fluidic Inc | BATTERY RETURN PROCEDURE FOR SCAFFOLD FUEL ELECTRODE |
JP5908251B2 (ja) | 2010-11-17 | 2016-04-26 | フルイディック,インク.Fluidic,Inc. | 階層型アノードのマルチモード充電 |
CN102121126B (zh) * | 2011-01-19 | 2014-12-31 | 俊杰机械(深圳)有限公司 | 一种带导轮架的pcb电镀装置 |
EP2518187A1 (en) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
DE102012221012B4 (de) | 2012-11-16 | 2023-01-19 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut |
CN103266334B (zh) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | 隔液传送装置 |
CN104862760A (zh) * | 2015-06-11 | 2015-08-26 | 重庆德凯覆铜板有限公司 | 铝板表面阳极氧化生产线 |
US11018387B2 (en) | 2016-07-22 | 2021-05-25 | Form Energy, Inc. | Moisture and carbon dioxide management system in electrochemical cells |
CN109790638B (zh) | 2016-08-15 | 2021-06-18 | 德国艾托特克公司 | 用于电解镀铜的酸性水性组合物 |
EP3470552B1 (en) | 2017-10-13 | 2020-12-30 | ATOTECH Deutschland GmbH | An acidic aqueous composition for electrolytically depositing a copper deposit |
US11251476B2 (en) | 2019-05-10 | 2022-02-15 | Form Energy, Inc. | Nested annular metal-air cell and systems containing same |
EP3901331A1 (en) | 2020-04-23 | 2021-10-27 | ATOTECH Deutschland GmbH | Acidic aqueous composition for electrolytically depositing a copper deposit |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB445719A (en) * | 1934-11-01 | 1936-04-17 | Albert Richard Norman Heath | Improvements in or relating to electro-plating |
DE886086C (de) * | 1950-06-09 | 1953-08-10 | Steel Prot Ltd | Einrichtung zum Elektroplattieren von Blechen |
BE517552A (US20100056889A1-20100304-C00004.png) * | 1951-05-17 | |||
GB1188206A (en) * | 1967-08-22 | 1970-04-15 | Kirkby Process & Equipment Ltd | Improvements in or relating to Selective Plating Machines |
US3575829A (en) * | 1968-08-14 | 1971-04-20 | Allegheny Ludlum Steel | System for cleaning contact rolls in a plating tank |
US3616423A (en) * | 1969-02-03 | 1971-10-26 | M & F Chemicals Inc | Continuous plating system |
US3933615A (en) * | 1969-06-09 | 1976-01-20 | The United States Of America As Represented By The Secretary Of The Air Force | Fluid flow stripping and plating system |
US3649507A (en) * | 1970-07-13 | 1972-03-14 | Omark Industries Inc | Apparatus for continuous electroplating |
US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
US3723283A (en) * | 1970-12-23 | 1973-03-27 | Select Au Matic | Selective plating system |
US3799861A (en) * | 1971-07-22 | 1974-03-26 | Raptes Res Applic And Trade Es | Electrical contact for equipment used in the electrolytical production of metals,particularly copper |
GB1378237A (en) * | 1971-11-15 | 1974-12-27 | Chemcut Corp | Module for modular apparatus |
SE357580B (US20100056889A1-20100304-C00004.png) * | 1972-08-22 | 1973-07-02 | Loennstroem Oy | |
US3898151A (en) * | 1973-06-18 | 1975-08-05 | Diamond Shamrock Corp | Apparatus for electrocoating conductive articles including magnet means to convey the articles |
US4132617A (en) * | 1973-10-04 | 1979-01-02 | Galentan, A.G. | Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape |
US3996127A (en) * | 1973-10-17 | 1976-12-07 | Outokumpu Oy | Device for detaching an electrolytically precipitated metal sheet from a cathode |
US4064019A (en) * | 1974-09-03 | 1977-12-20 | Dixie Plating, Inc. | Continuous contact plater method |
US3966581A (en) * | 1974-10-16 | 1976-06-29 | Auric Corporation | Selective plating apparatus |
DE2460634C3 (de) * | 1974-12-20 | 1980-02-21 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Galvanisiereinrichtung zum partiellen Metallisieren kontinuierlich durchlaufender Waren |
US3951761A (en) * | 1975-01-31 | 1976-04-20 | Bunker Ramo Corporation | Method and apparatus for electro-plating strip contacts |
US3982321A (en) * | 1975-03-24 | 1976-09-28 | Inter-Lakes Engineering Co. | Machine and process for assembling cathodes |
US3970540A (en) * | 1975-03-26 | 1976-07-20 | The Mitchell-Bate Company | Clamping device for use in electroplating |
CH610937A5 (US20100056889A1-20100304-C00004.png) * | 1975-06-10 | 1979-05-15 | Zbinden & Co | |
US4003805A (en) * | 1975-10-20 | 1977-01-18 | Uop Inc. | System for electroplating a sequence of moving plate members |
US4078982A (en) * | 1976-03-15 | 1978-03-14 | Dixie Plating, Inc. | Apparatus for continuous contact plating |
US4029564A (en) * | 1976-03-26 | 1977-06-14 | Electroplating Engineers Of Japan, Limited | High speed plating device for rectangular sheets |
SU642382A1 (ru) * | 1976-07-28 | 1979-01-15 | Предприятие П/Я А-7501 | Установка дл локального гальванопокрыти |
US4124454A (en) * | 1976-10-04 | 1978-11-07 | Shang Wai K | Electrolytic treatment of metal sheet |
US4162952A (en) * | 1977-02-24 | 1979-07-31 | Societe Anonyme dite: F.M.C. | Apparatus for electrolysis by projection |
FR2390517A1 (fr) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques |
US4145267A (en) * | 1977-09-06 | 1979-03-20 | National Steel Corporation | Nonplating cathode and method for producing same |
US4155815A (en) * | 1978-04-03 | 1979-05-22 | Francis William L | Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals |
US4186062A (en) * | 1978-07-13 | 1980-01-29 | Micro-Plate, Inc. | Continuous tab plater and method |
US4162955A (en) * | 1978-10-10 | 1979-07-31 | Midland-Ross Corporation | Electrodeposition coating apparatus |
DE2856460C3 (de) * | 1978-12-28 | 1982-02-11 | Gebr. Schmid GmbH & Co, 7290 Freudenstadt | Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte |
US4236990A (en) * | 1979-05-29 | 1980-12-02 | King Arthur S | Treater with self-cleaning electrodes |
US4217919A (en) * | 1979-08-16 | 1980-08-19 | Faunce And Associates, Inc. | Ratchet conveyor and electrical energy cleaning system |
US4244833A (en) * | 1979-11-15 | 1981-01-13 | Oxy Metal Industries Corporation | Composition and process for chemically stripping metallic deposits |
DE3001726C2 (de) * | 1980-01-18 | 1984-08-09 | Gebr. Schmid GmbH & Co, 7290 Freudenstadt | Vorrichtung zum Behandeln einer Leiterplatte |
-
1981
- 1981-10-07 US US06/309,180 patent/US4385967A/en not_active Expired - Lifetime
-
1982
- 1982-10-01 IE IE2387/82A patent/IE54263B1/en not_active IP Right Cessation
- 1982-10-02 DE DE3236545A patent/DE3236545C2/de not_active Expired
- 1982-10-04 NL NL8203845A patent/NL8203845A/nl active Search and Examination
- 1982-10-04 CH CH5819/82A patent/CH652758A5/it not_active IP Right Cessation
- 1982-10-05 AT AT0367882A patent/AT378009B/de not_active IP Right Cessation
- 1982-10-06 IT IT68174/82A patent/IT1196672B/it active
- 1982-10-06 CA CA000412984A patent/CA1190888A/en not_active Expired
- 1982-10-06 ES ES516287A patent/ES8402370A1/es not_active Expired
- 1982-10-06 GB GB08228485A patent/GB2107357B/en not_active Expired
- 1982-10-06 SE SE8205713A patent/SE8205713L/ unknown
- 1982-10-07 FR FR8216812A patent/FR2514037B1/fr not_active Expired
- 1982-10-07 JP JP57176939A patent/JPS58136797A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0329807B1 (de) * | 1988-02-25 | 1993-03-31 | Gebr. Schmid GmbH & Co. | Vorrichtung zur Behandlung von elektrischen Leiterplatten |
Also Published As
Publication number | Publication date |
---|---|
SE8205713D0 (sv) | 1982-10-06 |
CA1190888A (en) | 1985-07-23 |
ES516287A0 (es) | 1984-01-16 |
CH652758A5 (it) | 1985-11-29 |
IE54263B1 (en) | 1989-08-02 |
GB2107357A (en) | 1983-04-27 |
ES8402370A1 (es) | 1984-01-16 |
ATA367882A (de) | 1984-10-15 |
GB2107357B (en) | 1984-12-12 |
US4385967A (en) | 1983-05-31 |
JPS58136797A (ja) | 1983-08-13 |
IT8268174A0 (it) | 1982-10-06 |
SE8205713L (sv) | 1983-04-08 |
FR2514037A1 (fr) | 1983-04-08 |
FR2514037B1 (fr) | 1986-12-26 |
DE3236545A1 (de) | 1983-05-05 |
NL8203845A (nl) | 1983-05-02 |
IE822387L (en) | 1983-04-07 |
AT378009B (de) | 1985-06-10 |
IT1196672B (it) | 1988-11-25 |
JPH0222159B2 (US20100056889A1-20100304-C00004.png) | 1990-05-17 |
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OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings | ||
8305 | Restricted maintenance of patent after opposition | ||
D4 | Patent maintained restricted | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SCHERING AG, 1000 BERLIN, DE |
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8327 | Change in the person/name/address of the patent owner |
Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE |