DE3148330A1 - Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen - Google Patents
Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallenInfo
- Publication number
- DE3148330A1 DE3148330A1 DE19813148330 DE3148330A DE3148330A1 DE 3148330 A1 DE3148330 A1 DE 3148330A1 DE 19813148330 DE19813148330 DE 19813148330 DE 3148330 A DE3148330 A DE 3148330A DE 3148330 A1 DE3148330 A1 DE 3148330A1
- Authority
- DE
- Germany
- Prior art keywords
- noble metal
- base
- hydrohalic acid
- coating bath
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813148330 DE3148330A1 (de) | 1981-12-07 | 1981-12-07 | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen |
| EP82111045A EP0081183B1 (de) | 1981-12-07 | 1982-11-30 | Verfahren zur stromlosen Abscheidung von Edelmetallschichten auf Oberflächen von unedlen Metallen |
| DE8282111045T DE3276334D1 (en) | 1981-12-07 | 1982-11-30 | Process for the electroless depositing of noble metal layers on the surfaces of non-noble metals |
| AT82111045T ATE27187T1 (de) | 1981-12-07 | 1982-11-30 | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen. |
| CA000417092A CA1236843A (en) | 1981-12-07 | 1982-12-06 | Process for the currentless deposition of electropositive metal layers on the surfaces of less electropositive metals |
| JP57213471A JPS58104168A (ja) | 1981-12-07 | 1982-12-07 | 卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴 |
| US07/222,386 US4908241A (en) | 1981-12-07 | 1988-07-21 | Process for the currentless deposition of electropositive metal layers on the surfaces of less electropositive metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813148330 DE3148330A1 (de) | 1981-12-07 | 1981-12-07 | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3148330A1 true DE3148330A1 (de) | 1983-06-09 |
Family
ID=6148063
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813148330 Withdrawn DE3148330A1 (de) | 1981-12-07 | 1981-12-07 | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen |
| DE8282111045T Expired DE3276334D1 (en) | 1981-12-07 | 1982-11-30 | Process for the electroless depositing of noble metal layers on the surfaces of non-noble metals |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8282111045T Expired DE3276334D1 (en) | 1981-12-07 | 1982-11-30 | Process for the electroless depositing of noble metal layers on the surfaces of non-noble metals |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4908241A (enExample) |
| EP (1) | EP0081183B1 (enExample) |
| JP (1) | JPS58104168A (enExample) |
| AT (1) | ATE27187T1 (enExample) |
| CA (1) | CA1236843A (enExample) |
| DE (2) | DE3148330A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
| DE10050862A1 (de) * | 2000-10-06 | 2002-04-25 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| DE102005038392A1 (de) * | 2005-08-09 | 2007-03-15 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von ein Muster bildenden Metallstrukturen auf einem Trägersubstrat |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6311676A (ja) * | 1986-07-01 | 1988-01-19 | Nippon Denso Co Ltd | 化学銅めつき浴 |
| JPH043780U (enExample) * | 1990-04-24 | 1992-01-14 | ||
| GB9425030D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
| GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| US6319543B1 (en) * | 1999-03-31 | 2001-11-20 | Alpha Metals, Inc. | Process for silver plating in printed circuit board manufacture |
| US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
| US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
| US5976614A (en) * | 1998-10-13 | 1999-11-02 | Midwest Research Institute | Preparation of cuxinygazsen precursor films and powders by electroless deposition |
| USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
| US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
| US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| US7686875B2 (en) * | 2006-05-11 | 2010-03-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| US8298325B2 (en) * | 2006-05-11 | 2012-10-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| US7883738B2 (en) * | 2007-04-18 | 2011-02-08 | Enthone Inc. | Metallic surface enhancement |
| US10017863B2 (en) * | 2007-06-21 | 2018-07-10 | Joseph A. Abys | Corrosion protection of bronzes |
| TWI453301B (zh) * | 2007-11-08 | 2014-09-21 | Enthone | 浸鍍銀塗層上的自組分子 |
| US7972655B2 (en) * | 2007-11-21 | 2011-07-05 | Enthone Inc. | Anti-tarnish coatings |
| JP6031319B2 (ja) * | 2012-10-04 | 2016-11-24 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| US9663667B2 (en) * | 2013-01-22 | 2017-05-30 | Andre Reiss | Electroless silvering ink |
| US20190029122A1 (en) * | 2017-07-19 | 2019-01-24 | Anaren, Inc. | Encapsulation of circuit trace |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2836515A (en) * | 1953-04-30 | 1958-05-27 | Westinghouse Electric Corp | Gold immersion solution for treating silver and method of applying same |
| US3294528A (en) * | 1962-05-21 | 1966-12-27 | Jones & Laughlin Steel Corp | Nickel-copper-titanium steel |
| US3515571A (en) * | 1963-07-02 | 1970-06-02 | Lockheed Aircraft Corp | Deposition of gold films |
| US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
| US3250784A (en) * | 1963-12-23 | 1966-05-10 | Gen Aniline & Film Corp | Pyrrolidonyl-gamma-butyramide and process of preparing |
| GB1411971A (en) * | 1972-04-07 | 1975-10-29 | Ici Ltd | Process for the immersion plating of copper on iron or steel |
| JPS6070183A (ja) * | 1983-09-28 | 1985-04-20 | C Uyemura & Co Ltd | 化学銅めっき方法 |
-
1981
- 1981-12-07 DE DE19813148330 patent/DE3148330A1/de not_active Withdrawn
-
1982
- 1982-11-30 AT AT82111045T patent/ATE27187T1/de not_active IP Right Cessation
- 1982-11-30 DE DE8282111045T patent/DE3276334D1/de not_active Expired
- 1982-11-30 EP EP82111045A patent/EP0081183B1/de not_active Expired
- 1982-12-06 CA CA000417092A patent/CA1236843A/en not_active Expired
- 1982-12-07 JP JP57213471A patent/JPS58104168A/ja active Granted
-
1988
- 1988-07-21 US US07/222,386 patent/US4908241A/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
| DE10050862A1 (de) * | 2000-10-06 | 2002-04-25 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| DE10050862C2 (de) * | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| US6869637B2 (en) | 2000-10-06 | 2005-03-22 | Atotech Deutschland Gmbh | Bath and method of electroless plating of silver on metal surfaces |
| DE102005038392A1 (de) * | 2005-08-09 | 2007-03-15 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von ein Muster bildenden Metallstrukturen auf einem Trägersubstrat |
| DE102005038392B4 (de) * | 2005-08-09 | 2008-07-10 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat |
Also Published As
| Publication number | Publication date |
|---|---|
| US4908241A (en) | 1990-03-13 |
| CA1236843A (en) | 1988-05-17 |
| JPH0230389B2 (enExample) | 1990-07-05 |
| DE3276334D1 (en) | 1987-06-19 |
| ATE27187T1 (de) | 1987-05-15 |
| EP0081183A1 (de) | 1983-06-15 |
| JPS58104168A (ja) | 1983-06-21 |
| EP0081183B1 (de) | 1987-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |