JPS58104168A - 卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴 - Google Patents

卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴

Info

Publication number
JPS58104168A
JPS58104168A JP57213471A JP21347182A JPS58104168A JP S58104168 A JPS58104168 A JP S58104168A JP 57213471 A JP57213471 A JP 57213471A JP 21347182 A JP21347182 A JP 21347182A JP S58104168 A JPS58104168 A JP S58104168A
Authority
JP
Japan
Prior art keywords
noble metal
acid
base
complex
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57213471A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230389B2 (enExample
Inventor
ヘルム−ト・クヴアスト
ヨハネス・ラ−バ−
ヴアルタ−・オツト
ハンス−ゲオルク・フオン・シユネリング
カ−ル・ペ−タ−ス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Original Assignee
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max Planck Gesellschaft zur Foerderung der Wissenschaften eV filed Critical Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Publication of JPS58104168A publication Critical patent/JPS58104168A/ja
Publication of JPH0230389B2 publication Critical patent/JPH0230389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP57213471A 1981-12-07 1982-12-07 卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴 Granted JPS58104168A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3148330.5 1981-12-07
DE19813148330 DE3148330A1 (de) 1981-12-07 1981-12-07 Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen

Publications (2)

Publication Number Publication Date
JPS58104168A true JPS58104168A (ja) 1983-06-21
JPH0230389B2 JPH0230389B2 (enExample) 1990-07-05

Family

ID=6148063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57213471A Granted JPS58104168A (ja) 1981-12-07 1982-12-07 卑金属の表面に貴金属を無電流で析出させる方法及びその被覆浴

Country Status (6)

Country Link
US (1) US4908241A (enExample)
EP (1) EP0081183B1 (enExample)
JP (1) JPS58104168A (enExample)
AT (1) ATE27187T1 (enExample)
CA (1) CA1236843A (enExample)
DE (2) DE3148330A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311676A (ja) * 1986-07-01 1988-01-19 Nippon Denso Co Ltd 化学銅めつき浴

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
JPH043780U (enExample) * 1990-04-24 1992-01-14
GB9425030D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6319543B1 (en) * 1999-03-31 2001-11-20 Alpha Metals, Inc. Process for silver plating in printed circuit board manufacture
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US5976614A (en) * 1998-10-13 1999-11-02 Midwest Research Institute Preparation of cuxinygazsen precursor films and powders by electroless deposition
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
DE10050862C2 (de) 2000-10-06 2002-08-01 Atotech Deutschland Gmbh Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
DE102005038392B4 (de) * 2005-08-09 2008-07-10 Atotech Deutschland Gmbh Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat
US7686875B2 (en) * 2006-05-11 2010-03-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
TWI453301B (zh) * 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US7972655B2 (en) * 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
JP6031319B2 (ja) * 2012-10-04 2016-11-24 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
US9663667B2 (en) * 2013-01-22 2017-05-30 Andre Reiss Electroless silvering ink
US20190029122A1 (en) * 2017-07-19 2019-01-24 Anaren, Inc. Encapsulation of circuit trace

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2836515A (en) * 1953-04-30 1958-05-27 Westinghouse Electric Corp Gold immersion solution for treating silver and method of applying same
US3294528A (en) * 1962-05-21 1966-12-27 Jones & Laughlin Steel Corp Nickel-copper-titanium steel
US3515571A (en) * 1963-07-02 1970-06-02 Lockheed Aircraft Corp Deposition of gold films
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
US3250784A (en) * 1963-12-23 1966-05-10 Gen Aniline & Film Corp Pyrrolidonyl-gamma-butyramide and process of preparing
GB1411971A (en) * 1972-04-07 1975-10-29 Ici Ltd Process for the immersion plating of copper on iron or steel
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311676A (ja) * 1986-07-01 1988-01-19 Nippon Denso Co Ltd 化学銅めつき浴

Also Published As

Publication number Publication date
DE3148330A1 (de) 1983-06-09
US4908241A (en) 1990-03-13
CA1236843A (en) 1988-05-17
JPH0230389B2 (enExample) 1990-07-05
DE3276334D1 (en) 1987-06-19
ATE27187T1 (de) 1987-05-15
EP0081183A1 (de) 1983-06-15
EP0081183B1 (de) 1987-05-13

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