DE3145039A1 - Integrierte halbleiterschaltung - Google Patents
Integrierte halbleiterschaltungInfo
- Publication number
- DE3145039A1 DE3145039A1 DE19813145039 DE3145039A DE3145039A1 DE 3145039 A1 DE3145039 A1 DE 3145039A1 DE 19813145039 DE19813145039 DE 19813145039 DE 3145039 A DE3145039 A DE 3145039A DE 3145039 A1 DE3145039 A1 DE 3145039A1
- Authority
- DE
- Germany
- Prior art keywords
- signal line
- signal
- signal lines
- semiconductor circuit
- integrated semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 claims description 22
- 230000000694 effects Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 241001676573 Minium Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/02—Details
- H04B3/32—Reducing cross-talk, e.g. by compensating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55159480A JPS5784149A (en) | 1980-11-14 | 1980-11-14 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3145039A1 true DE3145039A1 (de) | 1982-09-16 |
Family
ID=15694687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19813145039 Withdrawn DE3145039A1 (de) | 1980-11-14 | 1981-11-12 | Integrierte halbleiterschaltung |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5784149A (it) |
DE (1) | DE3145039A1 (it) |
FR (1) | FR2498852A1 (it) |
GB (1) | GB2089122A (it) |
IT (1) | IT1140065B (it) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0433023A2 (en) * | 1989-12-12 | 1991-06-19 | AT&T Corp. | Improved interference suppression in optical communication systems |
EP0525703A1 (de) * | 1991-08-01 | 1993-02-03 | Siemens Aktiengesellschaft | Steckverbindung für Computernetze im Hausbereich |
EP0583111A1 (en) * | 1992-08-06 | 1994-02-16 | AT&T Corp. | Patch plug for cross-connect equipment |
WO1994005092A1 (en) * | 1992-08-24 | 1994-03-03 | British Telecommunications Public Limited Company | Apparatus and method for crosstalk cancellation in data correctors |
WO1994006216A1 (en) * | 1992-09-04 | 1994-03-17 | Pressac Limited | Method and apparatus for crosstalk cancellation in data connectors |
DE19809570A1 (de) * | 1998-03-05 | 1999-09-23 | Siemens Ag | Signalverbindung |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4514749A (en) * | 1983-01-18 | 1985-04-30 | At&T Bell Laboratories | VLSI Chip with ground shielding |
JPS59231852A (ja) * | 1983-06-15 | 1984-12-26 | Hitachi Ltd | 半導体装置 |
JPS60175470A (ja) * | 1984-02-21 | 1985-09-09 | Agency Of Ind Science & Technol | ジヨセフソン集積回路 |
JPS60254635A (ja) * | 1984-05-30 | 1985-12-16 | Fujitsu Ltd | 集積回路装置 |
JPS60254489A (ja) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | 半導体記憶装置 |
JPS62174943A (ja) * | 1986-01-29 | 1987-07-31 | Hitachi Ltd | 回路装置 |
JPH0625015Y2 (ja) * | 1986-06-13 | 1994-06-29 | シャープ株式会社 | 半導体装置 |
JPS63141A (ja) * | 1986-06-19 | 1988-01-05 | Fujitsu Ltd | 半導体記憶装置 |
JPS6366792A (ja) * | 1986-06-27 | 1988-03-25 | テキサス インスツルメンツ インコ−ポレイテツド | 半導体メモリ−用の交差接続した相補的ビット・ライン |
JPS63234657A (ja) * | 1987-03-24 | 1988-09-29 | Toshiba Corp | 信号伝送方式 |
US5014110A (en) * | 1988-06-03 | 1991-05-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring structures for semiconductor memory device |
US5432484A (en) * | 1992-08-20 | 1995-07-11 | Hubbell Incorporated | Connector for communication systems with cancelled crosstalk |
US5414393A (en) * | 1992-08-20 | 1995-05-09 | Hubbell Incorporated | Telecommunication connector with feedback |
US5295869A (en) | 1992-12-18 | 1994-03-22 | The Siemon Company | Electrically balanced connector assembly |
JP3283984B2 (ja) * | 1993-12-28 | 2002-05-20 | 株式会社東芝 | 半導体集積回路装置 |
US5618185A (en) * | 1995-03-15 | 1997-04-08 | Hubbell Incorporated | Crosstalk noise reduction connector for telecommunication system |
JPH09326610A (ja) * | 1996-06-06 | 1997-12-16 | Mitsubishi Electric Corp | マイクロ波集積回路 |
US5994946A (en) * | 1996-10-31 | 1999-11-30 | Metaflow Technologies, Inc. | Alternating inverters for capacitive coupling reduction in transmission lines |
US5931703A (en) * | 1997-02-04 | 1999-08-03 | Hubbell Incorporated | Low crosstalk noise connector for telecommunication systems |
US5944535A (en) * | 1997-02-04 | 1999-08-31 | Hubbell Incorporated | Interface panel system for networks |
ES2147495B1 (es) * | 1997-07-30 | 2001-04-01 | Mecanismos Aux Es Ind S L | Metodo para la mejora de las caracteristicas de compatibilidad electromagnetica en sistemas de comunicacion diferencial. |
US7515074B2 (en) * | 2002-09-13 | 2009-04-07 | Nxp B.V. | Coding information in integrated circuits |
JP4817354B2 (ja) * | 2004-11-05 | 2011-11-16 | ローム株式会社 | 半導体チップ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5539073B2 (it) * | 1974-12-25 | 1980-10-08 |
-
1980
- 1980-11-14 JP JP55159480A patent/JPS5784149A/ja active Pending
-
1981
- 1981-10-15 GB GB813171A patent/GB2089122A/en not_active Withdrawn
- 1981-10-23 FR FR8119920A patent/FR2498852A1/fr not_active Withdrawn
- 1981-11-10 IT IT24940/81A patent/IT1140065B/it active
- 1981-11-12 DE DE19813145039 patent/DE3145039A1/de not_active Withdrawn
Non-Patent Citations (3)
Title |
---|
DE-Z: Der Elektroniker, 1968, Heft 4, S. 153-163 * |
DE-Z: Der Elektroniker, 1979, Heft 10, EL1-EL9 * |
DE-Z: Der Elektroniker, 1979, Heft 11, EL22-EL28 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0433023A2 (en) * | 1989-12-12 | 1991-06-19 | AT&T Corp. | Improved interference suppression in optical communication systems |
EP0433023A3 (en) * | 1989-12-12 | 1992-05-13 | American Telephone And Telegraph Company | Improved interference suppression in optical communication systems |
EP0525703A1 (de) * | 1991-08-01 | 1993-02-03 | Siemens Aktiengesellschaft | Steckverbindung für Computernetze im Hausbereich |
EP0583111A1 (en) * | 1992-08-06 | 1994-02-16 | AT&T Corp. | Patch plug for cross-connect equipment |
WO1994005092A1 (en) * | 1992-08-24 | 1994-03-03 | British Telecommunications Public Limited Company | Apparatus and method for crosstalk cancellation in data correctors |
GB2284511A (en) * | 1992-08-24 | 1995-06-07 | British Telecomm | Apparatus and method for crosstalk cancellation in data correctors |
GB2284511B (en) * | 1992-08-24 | 1996-12-04 | British Telecomm | Apparatus for crosstalk cancellation in data connectors |
WO1994006216A1 (en) * | 1992-09-04 | 1994-03-17 | Pressac Limited | Method and apparatus for crosstalk cancellation in data connectors |
US5679027A (en) * | 1992-09-04 | 1997-10-21 | Pressac Ltd. | Apparatus for crosstalk cancellation in data connectors |
DE19809570A1 (de) * | 1998-03-05 | 1999-09-23 | Siemens Ag | Signalverbindung |
DE19809570C2 (de) * | 1998-03-05 | 2000-02-17 | Siemens Ag | Signalverbindung |
US6265655B1 (en) | 1998-03-05 | 2001-07-24 | Siemens Aktiengesellschaft | Signal-transmitting connection with protection against magnetic field interference |
Also Published As
Publication number | Publication date |
---|---|
GB2089122A (en) | 1982-06-16 |
IT8124940A0 (it) | 1981-11-10 |
IT1140065B (it) | 1986-09-24 |
JPS5784149A (en) | 1982-05-26 |
FR2498852A1 (fr) | 1982-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3145039A1 (de) | Integrierte halbleiterschaltung | |
DE69002986T2 (de) | Leiterplattenanordnung zur Reduzierung von Signalstörungen. | |
DE60012107T2 (de) | Kapazitive Übersprechkompensation für einen Nachrichtensteckverbinder | |
DE19781846B4 (de) | Schaltungsgehäuse, insbesondere Flip-Chip- oder C4-Gehäuse mit Stromversorgungs- und Masseebenen | |
EP1110277B1 (de) | Leiterplattenanordnung mit mehrpoligem steckverbinder | |
DE3446614A1 (de) | Integrierte halbleiterschaltung | |
WO2009138168A1 (de) | Leiterplatte für elektrischen verbinder und elektrischer verbinder | |
DE2752438A1 (de) | Anordnung fuer das packen von monolithisch integrierten halbleiterschaltungen | |
DE19810617B4 (de) | Hybrid-Übertrager für HF-Mischer in gedruckter Schaltung | |
DE102004029977A1 (de) | Schaltungsplatine und Verfahren, bei dem die Impedanz eines Übertragungswegs durch ein Verändern zumindest einer Öffnung in einer naheliegenden leitfähigen Ebene ausgewählt wird | |
DE4336727A1 (de) | Anordnung aus elektrischen Bauteilen | |
WO1998008190A1 (de) | Chipkarte mit einer induktionsspule und verfahren zu ihrer herstellung | |
DE2708261A1 (de) | Mechanisches filter | |
DE3416107A1 (de) | Busleitungsanordnung mit hoher kapazitaet in schichtbauweise | |
DE3787137T2 (de) | Halbleiteranordnung. | |
DE69107082T2 (de) | Eine Verbinderanordnung zur lösbaren Verbindung zwischen zwei Leiterstreifen. | |
DE69025973T2 (de) | Halbleiteranordnung mit Mehrschichtleiterstruktur | |
DE2837318C2 (de) | Anordnung zur Herstellung einer elektrischen Verbindung | |
WO1991001618A1 (de) | Verfahren zur störstrahlungsdämpfung an leiterplatten | |
DE3214991C2 (it) | ||
DE2808833C2 (de) | Gedruckte Schaltung, insbesondere Folienverdrahtung | |
DE19809570C2 (de) | Signalverbindung | |
EP1075027A2 (de) | Kontaktierung von Metalleiterbahnen eines integrierten Halbleiterchips | |
DE2627297C2 (de) | Mehrschichtige, gedruckte Schaltungsplatte | |
DE4201633C2 (de) | Thermischer Druckkopf |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8139 | Disposal/non-payment of the annual fee |