DE3044514C2 - - Google Patents

Info

Publication number
DE3044514C2
DE3044514C2 DE19803044514 DE3044514A DE3044514C2 DE 3044514 C2 DE3044514 C2 DE 3044514C2 DE 19803044514 DE19803044514 DE 19803044514 DE 3044514 A DE3044514 A DE 3044514A DE 3044514 C2 DE3044514 C2 DE 3044514C2
Authority
DE
Germany
Prior art keywords
layer
solder
semiconductor substrate
aluminum
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19803044514
Other languages
German (de)
English (en)
Other versions
DE3044514A1 (de
Inventor
Jin Onuki
Ko Soeno
Keiichi Morita
Hisakithi Hitachi Jp Onodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3044514A1 publication Critical patent/DE3044514A1/de
Application granted granted Critical
Publication of DE3044514C2 publication Critical patent/DE3044514C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
DE19803044514 1979-11-30 1980-11-26 Halbleiteranordnung Granted DE3044514A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15445079A JPS5678130A (en) 1979-11-30 1979-11-30 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
DE3044514A1 DE3044514A1 (de) 1981-09-03
DE3044514C2 true DE3044514C2 (en, 2012) 1989-06-22

Family

ID=15584474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803044514 Granted DE3044514A1 (de) 1979-11-30 1980-11-26 Halbleiteranordnung

Country Status (3)

Country Link
US (1) US4500904A (en, 2012)
JP (1) JPS5678130A (en, 2012)
DE (1) DE3044514A1 (en, 2012)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
WO1987005746A1 (en) * 1986-03-19 1987-09-24 Analog Devices, Incorporated Aluminum-backed wafer and chip
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
US4921158A (en) 1989-02-24 1990-05-01 General Instrument Corporation Brazing material
US5686676A (en) * 1996-05-07 1997-11-11 Brush Wellman Inc. Process for making improved copper/tungsten composites
US6897567B2 (en) 2000-07-31 2005-05-24 Romh Co., Ltd. Method of making wireless semiconductor device, and leadframe used therefor
US7181919B2 (en) * 2004-03-31 2007-02-27 Denso Corporation System utilizing waste heat of internal combustion engine
DE102005046710B4 (de) * 2005-09-29 2012-12-06 Infineon Technologies Ag Verfahren zur Herstellung einer Bauelementanordnung mit einem Träger und einem darauf montierten Halbleiterchip
JP2009182209A (ja) * 2008-01-31 2009-08-13 Nissan Motor Co Ltd 半導体装置
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JPS5678130A (en) 1981-06-26
DE3044514A1 (de) 1981-09-03
JPS6141135B2 (en, 2012) 1986-09-12
US4500904A (en) 1985-02-19

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