DE1903082B2 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1903082B2
DE1903082B2 DE19691903082 DE1903082A DE1903082B2 DE 1903082 B2 DE1903082 B2 DE 1903082B2 DE 19691903082 DE19691903082 DE 19691903082 DE 1903082 A DE1903082 A DE 1903082A DE 1903082 B2 DE1903082 B2 DE 1903082B2
Authority
DE
Germany
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19691903082
Other languages
English (en)
Other versions
DE1903082A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1903082A1 publication Critical patent/DE1903082A1/de
Publication of DE1903082B2 publication Critical patent/DE1903082B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
DE19691903082 1968-01-23 1969-01-22 Halbleiterbauelement Ceased DE1903082B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP386668 1968-01-23

Publications (2)

Publication Number Publication Date
DE1903082A1 DE1903082A1 (de) 1969-07-31
DE1903082B2 true DE1903082B2 (de) 1971-09-30

Family

ID=11569101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691903082 Ceased DE1903082B2 (de) 1968-01-23 1969-01-22 Halbleiterbauelement

Country Status (5)

Country Link
CH (1) CH485323A (de)
DE (1) DE1903082B2 (de)
FR (1) FR2000604A1 (de)
GB (1) GB1246858A (de)
SE (1) SE354379B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2559837C2 (de) * 1974-07-13 1985-01-17 Olympus Optical Co., Ltd., Tokio/Tokyo Gleichstrommotor
FR2328286A1 (fr) * 1975-10-14 1977-05-13 Thomson Csf Procede de fabrication de dispositifs a semiconducteurs, presentant une tres faible resistance thermique, et dispositifs obtenus par ledit procede
JPS5678130A (en) * 1979-11-30 1981-06-26 Hitachi Ltd Semiconductor device and its manufacture
EP1286393A3 (de) * 2001-06-28 2004-03-03 F & K Delvotec Bondtechnik GmbH Schaltkreisgehäuse

Also Published As

Publication number Publication date
CH485323A (de) 1970-01-31
GB1246858A (en) 1971-09-22
SE354379B (de) 1973-03-05
DE1903082A1 (de) 1969-07-31
FR2000604A1 (de) 1969-09-12

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