DE1949174B2 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE1949174B2
DE1949174B2 DE19691949174 DE1949174A DE1949174B2 DE 1949174 B2 DE1949174 B2 DE 1949174B2 DE 19691949174 DE19691949174 DE 19691949174 DE 1949174 A DE1949174 A DE 1949174A DE 1949174 B2 DE1949174 B2 DE 1949174B2
Authority
DE
Germany
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691949174
Other languages
English (en)
Other versions
DE1949174A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1949174A1 publication Critical patent/DE1949174A1/de
Publication of DE1949174B2 publication Critical patent/DE1949174B2/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Formation Of Insulating Films (AREA)
DE19691949174 1968-10-02 1969-09-29 Halbleiterbauelement Pending DE1949174B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7111168 1968-10-02

Publications (2)

Publication Number Publication Date
DE1949174A1 DE1949174A1 (de) 1970-05-14
DE1949174B2 true DE1949174B2 (de) 1971-09-23

Family

ID=13451099

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691949174 Pending DE1949174B2 (de) 1968-10-02 1969-09-29 Halbleiterbauelement

Country Status (3)

Country Link
DE (1) DE1949174B2 (de)
FR (1) FR2019679B1 (de)
GB (1) GB1255347A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3860461A (en) * 1973-05-29 1975-01-14 Texas Instruments Inc Method for fabricating semiconductor devices utilizing composite masking
DE2658304C2 (de) * 1975-12-24 1984-12-20 Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa Halbleitervorrichtung
DE2713647C2 (de) * 1977-03-28 1984-11-29 Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa Halbleitervorrichtung, bestehend aus einem Halbleitersubstrat und aus einem Oberflächenschutzfilm
GB2071411B (en) * 1980-03-07 1983-12-21 Philips Electronic Associated Passivating p-n junction devices
FI64878C (fi) * 1982-05-10 1984-01-10 Lohja Ab Oy Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer
JPH03198327A (ja) * 1989-12-26 1991-08-29 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
FR2019679B1 (de) 1974-05-24
DE1949174A1 (de) 1970-05-14
GB1255347A (en) 1971-12-01
FR2019679A1 (de) 1970-07-03

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