DE1949174B2 - Halbleiterbauelement - Google Patents
HalbleiterbauelementInfo
- Publication number
- DE1949174B2 DE1949174B2 DE19691949174 DE1949174A DE1949174B2 DE 1949174 B2 DE1949174 B2 DE 1949174B2 DE 19691949174 DE19691949174 DE 19691949174 DE 1949174 A DE1949174 A DE 1949174A DE 1949174 B2 DE1949174 B2 DE 1949174B2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor component
- semiconductor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7111168 | 1968-10-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1949174A1 DE1949174A1 (de) | 1970-05-14 |
DE1949174B2 true DE1949174B2 (de) | 1971-09-23 |
Family
ID=13451099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19691949174 Pending DE1949174B2 (de) | 1968-10-02 | 1969-09-29 | Halbleiterbauelement |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1949174B2 (de) |
FR (1) | FR2019679B1 (de) |
GB (1) | GB1255347A (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3860461A (en) * | 1973-05-29 | 1975-01-14 | Texas Instruments Inc | Method for fabricating semiconductor devices utilizing composite masking |
DE2658304C2 (de) * | 1975-12-24 | 1984-12-20 | Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa | Halbleitervorrichtung |
DE2713647C2 (de) * | 1977-03-28 | 1984-11-29 | Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa | Halbleitervorrichtung, bestehend aus einem Halbleitersubstrat und aus einem Oberflächenschutzfilm |
GB2071411B (en) * | 1980-03-07 | 1983-12-21 | Philips Electronic Associated | Passivating p-n junction devices |
FI64878C (fi) * | 1982-05-10 | 1984-01-10 | Lohja Ab Oy | Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer |
JPH03198327A (ja) * | 1989-12-26 | 1991-08-29 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1969
- 1969-09-29 GB GB4774369A patent/GB1255347A/en not_active Expired
- 1969-09-29 DE DE19691949174 patent/DE1949174B2/de active Pending
- 1969-10-01 FR FR6933490A patent/FR2019679B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2019679B1 (de) | 1974-05-24 |
DE1949174A1 (de) | 1970-05-14 |
GB1255347A (en) | 1971-12-01 |
FR2019679A1 (de) | 1970-07-03 |
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