CH492302A - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
CH492302A
CH492302A CH496569A CH496569A CH492302A CH 492302 A CH492302 A CH 492302A CH 496569 A CH496569 A CH 496569A CH 496569 A CH496569 A CH 496569A CH 492302 A CH492302 A CH 492302A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH496569A
Other languages
English (en)
Inventor
Springer Crafts Harold
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of CH492302A publication Critical patent/CH492302A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/07Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
    • H01L27/0744Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
    • H01L27/075Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
    • H01L27/0755Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • H01L27/0772Vertical bipolar transistor in combination with resistors only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/117Oxidation, selective

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
CH496569A 1968-04-01 1969-04-01 Halbleiterbauelement CH492302A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71775768A 1968-04-01 1968-04-01

Publications (1)

Publication Number Publication Date
CH492302A true CH492302A (de) 1970-06-15

Family

ID=24883345

Family Applications (1)

Application Number Title Priority Date Filing Date
CH496569A CH492302A (de) 1968-04-01 1969-04-01 Halbleiterbauelement

Country Status (7)

Country Link
US (1) US3488564A (de)
BE (1) BE730105A (de)
CH (1) CH492302A (de)
DE (1) DE1912177A1 (de)
FR (1) FR2005238A1 (de)
GB (1) GB1213104A (de)
NL (1) NL6904941A (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL159817B (nl) * 1966-10-05 1979-03-15 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
NL7010208A (de) * 1966-10-05 1972-01-12 Philips Nv
BE754677A (fr) * 1969-08-11 1971-01-18 Rca Corp Circuits integres fonctionnant sur courant
US3654530A (en) * 1970-06-22 1972-04-04 Ibm Integrated clamping circuit
US3648125A (en) * 1971-02-02 1972-03-07 Fairchild Camera Instr Co Method of fabricating integrated circuits with oxidized isolation and the resulting structure
JPS542064B1 (de) * 1971-07-02 1979-02-01
FR2252638B1 (de) * 1973-11-23 1978-08-04 Commissariat Energie Atomique
US3936789A (en) * 1974-06-03 1976-02-03 Texas Instruments Incorporated Spreading resistance thermistor
JPS5131186A (de) * 1974-09-11 1976-03-17 Hitachi Ltd
FR2358748A1 (fr) * 1976-07-15 1978-02-10 Radiotechnique Compelec Procede d'autoalignement des elements d'un dispositif semi-conducteur et dispositif realise suivant ce procede
US4256514A (en) * 1978-11-03 1981-03-17 International Business Machines Corporation Method for forming a narrow dimensioned region on a body
JPS6097659A (ja) * 1983-11-01 1985-05-31 Matsushita Electronics Corp 半導体集積回路
US4774559A (en) * 1984-12-03 1988-09-27 International Business Machines Corporation Integrated circuit chip structure wiring and circuitry for driving highly capacitive on chip wiring nets
US4982262A (en) * 1985-01-15 1991-01-01 At&T Bell Laboratories Inverted groove isolation technique for merging dielectrically isolated semiconductor devices
US4689651A (en) * 1985-07-29 1987-08-25 Motorola, Inc. Low voltage clamp
US5023194A (en) * 1988-02-11 1991-06-11 Exar Corporation Method of making a multicollector vertical pnp transistor
US5316964A (en) * 1991-05-31 1994-05-31 Linear Technology Corporation Method of forming integrated circuits with diffused resistors in isolation regions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL274363A (de) * 1960-05-02
US3363152A (en) * 1964-01-24 1968-01-09 Westinghouse Electric Corp Semiconductor devices with low leakage current across junction
US3325705A (en) * 1964-03-26 1967-06-13 Motorola Inc Unijunction transistor

Also Published As

Publication number Publication date
BE730105A (de) 1969-09-01
FR2005238A1 (de) 1969-12-12
NL6904941A (de) 1969-10-03
DE1912177A1 (de) 1969-10-23
US3488564A (en) 1970-01-06
GB1213104A (en) 1970-11-18

Similar Documents

Publication Publication Date Title
AT318003B (de) Halbleiterbauelement
AT310812B (de) Integriertes Halbleiterbauelement
CH506883A (de) Halbleiterbauelement
CH511511A (de) Halbleiter-Anordnung
CH504099A (de) Halbleiterbauelement
CH492302A (de) Halbleiterbauelement
CH496148A (de) Bauelement
AT320025B (de) Halbleitervorrichtung
AT300961B (de) Halbleiteranordnung
CH487504A (de) Halbleitervorrichtung
CH508983A (de) Halbleiter-Bauelement
CH508279A (de) Halbleiterbauelement
DE1903342B2 (de) Halbleitervorrichtung
DE1949174B2 (de) Halbleiterbauelement
CH484515A (de) Steuerbares Halbleiterbauelement
AT328688B (de) Mehrschaliges bauelement
DE1903082B2 (de) Halbleiterbauelement
CH493942A (de) Halbleitervorrichtung
CH510346A (de) Halbleiteranordnung
AT301689B (de) Halbleiterbauelement
CH518009A (de) Halbleiteranordnung
CH539341A (de) Halbleiterbauelement
AT278907B (de) Halbleiterelement
CH508276A (de) Halbleiterbauelement
CH499876A (de) Halbleiterbauelement

Legal Events

Date Code Title Description
PL Patent ceased