CH511511A - Halbleiter-Anordnung - Google Patents

Halbleiter-Anordnung

Info

Publication number
CH511511A
CH511511A CH1091369A CH1091369A CH511511A CH 511511 A CH511511 A CH 511511A CH 1091369 A CH1091369 A CH 1091369A CH 1091369 A CH1091369 A CH 1091369A CH 511511 A CH511511 A CH 511511A
Authority
CH
Switzerland
Prior art keywords
semiconductor arrangement
semiconductor
arrangement
Prior art date
Application number
CH1091369A
Other languages
English (en)
Inventor
Liboslav Dipl Chem Vladik
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH511511A publication Critical patent/CH511511A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CH1091369A 1968-12-20 1969-07-16 Halbleiter-Anordnung CH511511A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681815989 DE1815989A1 (de) 1968-12-20 1968-12-20 Halbleiter-Anordnung

Publications (1)

Publication Number Publication Date
CH511511A true CH511511A (de) 1971-08-15

Family

ID=5716894

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1091369A CH511511A (de) 1968-12-20 1969-07-16 Halbleiter-Anordnung

Country Status (7)

Country Link
US (1) US3783347A (de)
JP (1) JPS4926267B1 (de)
CH (1) CH511511A (de)
DE (1) DE1815989A1 (de)
ES (1) ES371189A1 (de)
FR (1) FR2026610A1 (de)
GB (1) GB1279699A (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4011575A (en) * 1974-07-26 1977-03-08 Litton Systems, Inc. Light emitting diode array having a plurality of conductive paths for each light emitting diode
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS5273457A (en) * 1975-12-16 1977-06-20 Ishikawajima Harima Heavy Ind Co Ltd Crane for pipe transport
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
US5032898A (en) * 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
DE3505086A1 (de) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
JPH0331020Y2 (de) * 1985-06-17 1991-07-01
KR920005350B1 (ko) * 1988-03-05 1992-07-02 도이취 아이티티 인더스트리스 게젤샤프트 미트 베쉬랭크터 하프퉁 반도체장치와 그 제조방법 및 그 방법을 실행하는 장치
SG52332A1 (en) * 1990-09-24 1998-09-28 Texas Instruments Inc Insulated lead frame for integrated circuits and method of manufacture thereof
US5309320A (en) * 1991-02-06 1994-05-03 Hughes Aircraft Company Circuit card assembly conduction converter
US5402006A (en) * 1992-11-10 1995-03-28 Texas Instruments Incorporated Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
US6949822B2 (en) * 2000-03-17 2005-09-27 International Rectifier Corporation Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
US7593229B2 (en) 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US7440280B2 (en) 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
US20070230185A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
DE102007033103B4 (de) * 2007-07-13 2010-05-06 Auto-Kabel Management Gmbh Verpolschutzeinrichtung für Bordnetze von Kraftfahrzeugen
US10267567B1 (en) * 2014-01-13 2019-04-23 Nutech Ventures Monolithic heat-transfer device
DE112014005694B4 (de) * 2014-01-27 2020-07-30 Hitachi, Ltd. Halbleitermodul
US10114183B2 (en) * 2015-07-31 2018-10-30 Finisar Corporation Screwless heat sink attachment
EP3659177B1 (de) 2017-08-25 2023-10-25 Huawei Technologies Co., Ltd. Halbleitermodul und verfahren zur herstellung davon

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056898A (en) * 1959-07-09 1962-10-02 Westinghouse Electric Corp Lighting unit and method of manufacture
GB1083288A (en) * 1963-12-21 1967-09-13 Ckd Praha Improvements in or relating to vacuum-tight casings for semiconductor elements
US3463970A (en) * 1966-10-26 1969-08-26 Gen Electric Integrated semiconductor rectifier assembly
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3539875A (en) * 1968-09-25 1970-11-10 Philips Corp Hardware envelope with semiconductor mounting arrangements
US3548927A (en) * 1968-11-29 1970-12-22 Intern Electronic Research Co Heat dissipating retainer for electronic component
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices

Also Published As

Publication number Publication date
GB1279699A (en) 1972-06-28
ES371189A1 (es) 1972-01-16
JPS4926267B1 (de) 1974-07-08
FR2026610A1 (de) 1970-09-18
US3783347A (en) 1974-01-01
DE1815989A1 (de) 1970-07-02

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Legal Events

Date Code Title Description
PL Patent ceased