DE2847356C2 - Verfahren zur Herstellung einer gedruckten Schaltung mit Widerstandselementen - Google Patents
Verfahren zur Herstellung einer gedruckten Schaltung mit WiderstandselementenInfo
- Publication number
- DE2847356C2 DE2847356C2 DE2847356A DE2847356A DE2847356C2 DE 2847356 C2 DE2847356 C2 DE 2847356C2 DE 2847356 A DE2847356 A DE 2847356A DE 2847356 A DE2847356 A DE 2847356A DE 2847356 C2 DE2847356 C2 DE 2847356C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- resistance
- pattern
- highly conductive
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 34
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 239000007769 metal material Substances 0.000 claims description 11
- 230000000873 masking effect Effects 0.000 claims description 8
- 238000011161 development Methods 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims 5
- 241001489106 Laccaria laccata Species 0.000 claims 1
- 241000530268 Lycaena heteronea Species 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 41
- 239000000758 substrate Substances 0.000 description 41
- 239000004020 conductor Substances 0.000 description 33
- 239000011889 copper foil Substances 0.000 description 27
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 241001233037 catfish Species 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241000152447 Hades Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000008451 emotion Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 241000282979 Alces alces Species 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 235000000434 Melocanna baccifera Nutrition 0.000 description 1
- 241001497770 Melocanna baccifera Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- WDHWFGNRFMPTQS-UHFFFAOYSA-N cobalt tin Chemical compound [Co].[Sn] WDHWFGNRFMPTQS-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- -1 lamps Chemical compound 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000009416 shuttering Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 210000002700 urine Anatomy 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13715577A JPS5469768A (en) | 1977-11-14 | 1977-11-14 | Printing circuit substrate with resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2847356A1 DE2847356A1 (de) | 1979-05-17 |
| DE2847356C2 true DE2847356C2 (de) | 1983-02-24 |
Family
ID=15192097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2847356A Expired DE2847356C2 (de) | 1977-11-14 | 1978-10-31 | Verfahren zur Herstellung einer gedruckten Schaltung mit Widerstandselementen |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US4204187A (enrdf_load_stackoverflow) |
| JP (1) | JPS5469768A (enrdf_load_stackoverflow) |
| BE (1) | BE871962A (enrdf_load_stackoverflow) |
| DE (1) | DE2847356C2 (enrdf_load_stackoverflow) |
| FR (1) | FR2408973A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2007917B (enrdf_load_stackoverflow) |
| NL (1) | NL175372C (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3708832A1 (de) * | 1987-03-18 | 1988-09-29 | Siemens Ag | Nasschemische strukturierung von hafniumborid-schichten |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343833A (en) * | 1979-06-26 | 1982-08-10 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing thermal head |
| US4532186A (en) * | 1982-06-16 | 1985-07-30 | Nitto Electric Industrial Co., Ltd. | Circuit substrate with resistance layer and process for producing the same |
| JPS5916084A (ja) * | 1982-07-19 | 1984-01-27 | Nitto Electric Ind Co Ltd | 入力タブレツト |
| JPS59185801U (ja) * | 1983-05-26 | 1984-12-10 | アルプス電気株式会社 | チツプ抵抗 |
| US4495524A (en) * | 1983-06-21 | 1985-01-22 | Nitto Electric Industrial Co., Ltd. | Part for a slide variable resistor |
| US4503418A (en) * | 1983-11-07 | 1985-03-05 | Northern Telecom Limited | Thick film resistor |
| JPS61210601A (ja) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | チツプ抵抗器 |
| US4724040A (en) * | 1986-01-14 | 1988-02-09 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electric circuits on a base boad |
| US4792781A (en) * | 1986-02-21 | 1988-12-20 | Tdk Corporation | Chip-type resistor |
| US4864130A (en) * | 1986-06-04 | 1989-09-05 | Arch Development Corporation | Photo ion spectrometer |
| JPS637693A (ja) * | 1986-06-27 | 1988-01-13 | 新神戸電機株式会社 | 抵抗回路付印刷回路板の製造法 |
| JPH0180974U (enrdf_load_stackoverflow) * | 1987-11-20 | 1989-05-30 | ||
| EP1011111A1 (en) * | 1988-02-26 | 2000-06-21 | Gould Electronics Inc. | Resistive metal layers and method for making same |
| US5039570A (en) * | 1990-04-12 | 1991-08-13 | Planar Circuit Technologies, Inc. | Resistive laminate for printed circuit boards, method and apparatus for forming the same |
| TW208110B (enrdf_load_stackoverflow) * | 1990-06-08 | 1993-06-21 | Furukawa Circuit Foil Kk | |
| JPH0487815U (enrdf_load_stackoverflow) * | 1990-12-03 | 1992-07-30 | ||
| KR100223504B1 (ko) * | 1992-08-28 | 1999-10-15 | 다카노 야스아키 | 혼성 집적 회로 장치 |
| US6303181B1 (en) | 1993-05-17 | 2001-10-16 | Electrochemicals Inc. | Direct metallization process employing a cationic conditioner and a binder |
| US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
| US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
| US5690805A (en) * | 1993-05-17 | 1997-11-25 | Electrochemicals Inc. | Direct metallization process |
| US6171468B1 (en) | 1993-05-17 | 2001-01-09 | Electrochemicals Inc. | Direct metallization process |
| US6710259B2 (en) * | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
| JPH07318872A (ja) * | 1994-05-26 | 1995-12-08 | Aoyagi:Kk | 多機能眼鏡 |
| JP3316853B2 (ja) * | 1995-07-14 | 2002-08-19 | セイコーエプソン株式会社 | 積層型インクジェット記録ヘッド及びその製造方法並びにこの記録ヘッドを備えたプリンタ |
| US6015482A (en) * | 1997-12-18 | 2000-01-18 | Circuit Research Corp. | Printed circuit manufacturing process using tin-nickel plating |
| US6171921B1 (en) * | 1998-06-05 | 2001-01-09 | Motorola, Inc. | Method for forming a thick-film resistor and thick-film resistor formed thereby |
| JP3729308B2 (ja) * | 1998-06-09 | 2005-12-21 | ローム株式会社 | ライン型加熱装置の構造 |
| US6356455B1 (en) * | 1999-09-23 | 2002-03-12 | Morton International, Inc. | Thin integral resistor/capacitor/inductor package, method of manufacture |
| US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
| US6606792B1 (en) | 2000-05-25 | 2003-08-19 | Oak-Mitsui, Inc. | Process to manufacturing tight tolerance embedded elements for printed circuit boards |
| US6402970B1 (en) * | 2000-08-22 | 2002-06-11 | Charles W. C. Lin | Method of making a support circuit for a semiconductor chip assembly |
| US6350386B1 (en) | 2000-09-20 | 2002-02-26 | Charles W. C. Lin | Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly |
| EP2315510A3 (en) * | 2001-06-05 | 2012-05-02 | Dai Nippon Printing Co., Ltd. | Wiring board provided with passive element |
| US20040113127A1 (en) * | 2002-12-17 | 2004-06-17 | Min Gary Yonggang | Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto |
| US20050176209A1 (en) * | 2003-02-14 | 2005-08-11 | Rf Micro Devices, Inc. | Embedded passive components |
| EP1641329A4 (en) * | 2003-06-30 | 2010-01-20 | Ibiden Co Ltd | CIRCUIT BOARD |
| JP4342232B2 (ja) * | 2003-07-11 | 2009-10-14 | 三菱電機株式会社 | 半導体パワーモジュールおよび該モジュールの主回路電流値を計測する主回路電流計測システム |
| US8493173B2 (en) * | 2011-04-08 | 2013-07-23 | Endicott Interconnect Technologies, Inc. | Method of cavity forming on a buried resistor layer using a fusion bonding process |
| US9633768B2 (en) | 2013-06-13 | 2017-04-25 | Rohm Co., Ltd. | Chip resistor and mounting structure thereof |
| US9508474B2 (en) * | 2015-01-15 | 2016-11-29 | Shih-Long Wei | Method for manufacturing anticorrosive thin film resistor and structure thereof |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| CN107466157A (zh) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | 一种埋阻板及使用该埋阻板制作印制线路板的方法 |
| CN107333393A (zh) * | 2017-07-19 | 2017-11-07 | 深圳崇达多层线路板有限公司 | 一种埋阻板材的制作方法 |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| CN109819582A (zh) * | 2017-11-22 | 2019-05-28 | 奇酷互联网络科技（深圳）有限公司 | 电路板、电量监测电路、电路板制作方法及电子设备 |
| JP6810095B2 (ja) * | 2018-04-27 | 2021-01-06 | ローム株式会社 | チップ抵抗器、チップ抵抗器の実装構造 |
| CN114126187B (zh) * | 2020-08-26 | 2024-05-10 | 宏恒胜电子科技（淮安）有限公司 | 具有内埋散热结构的线路板及其制作方法 |
| JP2021044585A (ja) * | 2020-12-10 | 2021-03-18 | ローム株式会社 | チップ抵抗器 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1002358A (en) * | 1961-07-07 | 1965-08-25 | Philco Corp | Improvements in and relating to the manufacture of electrical components by coating of metal on to an insulating substrate |
| US3256588A (en) * | 1962-10-23 | 1966-06-21 | Philco Corp | Method of fabricating thin film r-c circuits on single substrate |
| US3287191A (en) * | 1963-07-23 | 1966-11-22 | Photo Engravers Res Inc | Etching of printed circuit components |
| US3390992A (en) * | 1964-06-15 | 1968-07-02 | North American Rockwell | Non-etching circuit fabrication |
| US3423260A (en) * | 1966-03-21 | 1969-01-21 | Bunker Ramo | Method of making a thin film circuit having a resistor-conductor pattern |
| FR1537897A (fr) * | 1967-07-19 | 1968-08-30 | Europ Composants Electron | Procédé de fabrication de circuits électriques en couches minces |
| US3458847A (en) * | 1967-09-21 | 1969-07-29 | Fairchild Camera Instr Co | Thin-film resistors |
| FR1554767A (enrdf_load_stackoverflow) * | 1967-11-14 | 1969-01-24 | ||
| DE1817434C3 (de) * | 1967-12-30 | 1980-05-14 | Sony Corp., Tokio | Verfahren zur Herstellung einer elektrischen Leitungsanordnung |
| US3864180A (en) * | 1971-07-23 | 1975-02-04 | Litton Systems Inc | Process for forming thin-film circuit devices |
| US3700445A (en) * | 1971-07-29 | 1972-10-24 | Us Navy | Photoresist processing method for fabricating etched microcircuits |
| JPS5146904B2 (enrdf_load_stackoverflow) * | 1971-09-30 | 1976-12-11 | ||
| US4077854A (en) * | 1972-10-02 | 1978-03-07 | The Bendix Corporation | Method of manufacture of solderable thin film microcircuit with stabilized resistive films |
| US3904461A (en) * | 1972-10-02 | 1975-09-09 | Bendix Corp | Method of manufacturing solderable thin film microcircuit with stabilized resistive films |
| JPS565075B2 (enrdf_load_stackoverflow) * | 1973-02-06 | 1981-02-03 | ||
| JPS49105169A (enrdf_load_stackoverflow) * | 1973-02-13 | 1974-10-04 | ||
| US3955068A (en) * | 1974-09-27 | 1976-05-04 | Rockwell International Corporation | Flexible conductor-resistor composite |
| FR2290762A1 (fr) * | 1974-11-06 | 1976-06-04 | Lignes Telegraph Telephon | Procede de realisation de contacts ohmiques pour circuits en couche mince |
| JPS5181967A (ja) * | 1975-01-15 | 1976-07-17 | Nitto Electric Ind Co | Kairobanzairyo |
-
1977
- 1977-11-14 JP JP13715577A patent/JPS5469768A/ja active Granted
-
1978
- 1978-03-07 US US05/884,298 patent/US4204187A/en not_active Expired - Lifetime
- 1978-10-31 DE DE2847356A patent/DE2847356C2/de not_active Expired
- 1978-11-02 GB GB7843055A patent/GB2007917B/en not_active Expired
- 1978-11-13 FR FR7832002A patent/FR2408973A1/fr active Granted
- 1978-11-13 NL NLAANVRAGE7811195,A patent/NL175372C/xx not_active IP Right Cessation
- 1978-11-13 BE BE191685A patent/BE871962A/xx not_active IP Right Cessation
-
1981
- 1981-11-25 US US06/325,085 patent/US4368252A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3708832A1 (de) * | 1987-03-18 | 1988-09-29 | Siemens Ag | Nasschemische strukturierung von hafniumborid-schichten |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2408973A1 (fr) | 1979-06-08 |
| US4204187A (en) | 1980-05-20 |
| BE871962A (fr) | 1979-03-01 |
| FR2408973B1 (enrdf_load_stackoverflow) | 1981-12-04 |
| NL175372C (nl) | 1984-10-16 |
| GB2007917A (en) | 1979-05-23 |
| DE2847356A1 (de) | 1979-05-17 |
| US4368252A (en) | 1983-01-11 |
| NL175372B (nl) | 1984-05-16 |
| GB2007917B (en) | 1982-04-15 |
| NL7811195A (nl) | 1979-05-16 |
| JPS5640514B2 (enrdf_load_stackoverflow) | 1981-09-21 |
| JPS5469768A (en) | 1979-06-05 |
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