FR2408973A1 - Support de circuit imprime avec des resistances - Google Patents

Support de circuit imprime avec des resistances

Info

Publication number
FR2408973A1
FR2408973A1 FR7832002A FR7832002A FR2408973A1 FR 2408973 A1 FR2408973 A1 FR 2408973A1 FR 7832002 A FR7832002 A FR 7832002A FR 7832002 A FR7832002 A FR 7832002A FR 2408973 A1 FR2408973 A1 FR 2408973A1
Authority
FR
France
Prior art keywords
resistors
printed
support
circuit support
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7832002A
Other languages
English (en)
Other versions
FR2408973B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Publication of FR2408973A1 publication Critical patent/FR2408973A1/fr
Application granted granted Critical
Publication of FR2408973B1 publication Critical patent/FR2408973B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

LE SUPPORT DE CIRCUIT IMPRIME SELON L'INVENTION COMPORTE DES RESISTANCES 4 SUR UN SUPPORT ISOLANT 5 ET DES CONDUCTEURS DE CONNEXION 3 SUR UNE COUCHE DE MATIERE HAUTEMENT CONDUCTRICE 1, PAR EXEMPLE EN CUIVRE, DE FACON QUE LES CONDUCTEURS SOIENT CONNECTES AUX DIFFERENTES RESISTANCES 4, CE SUPPORT ETANT OBTENU PAR DES OPERATIONS SUCCESSIVES DE GRAVURE D'UNE FEUILLE DE CUIVRE A TRAVERS DES RESERVES PHOTOGRAPHIQUES IMPRESSIONNEES ET DEVELOPPEES POUR OBTENIR LES CONFIGURATIONS VOULUES DES RESISTANCES ET DES CONDUCTEURS ET EN UTILISANT UN NOMBRE REDUIT D'ETAPES DE TRAITEMENT. UN TEL SUPPORT DE CIRCUIT IMPRIME CONVIENT EN PARTICULIER POUR LA FABRICATION DE PANNEAUX DE CIRCUITS IMPRIMES A RESISTANCES INCORPOREES.
FR7832002A 1977-11-14 1978-11-13 Support de circuit imprime avec des resistances Granted FR2408973A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13715577A JPS5469768A (en) 1977-11-14 1977-11-14 Printing circuit substrate with resistance

Publications (2)

Publication Number Publication Date
FR2408973A1 true FR2408973A1 (fr) 1979-06-08
FR2408973B1 FR2408973B1 (fr) 1981-12-04

Family

ID=15192097

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7832002A Granted FR2408973A1 (fr) 1977-11-14 1978-11-13 Support de circuit imprime avec des resistances

Country Status (7)

Country Link
US (2) US4204187A (fr)
JP (1) JPS5469768A (fr)
BE (1) BE871962A (fr)
DE (1) DE2847356C2 (fr)
FR (1) FR2408973A1 (fr)
GB (1) GB2007917B (fr)
NL (1) NL175372C (fr)

Families Citing this family (50)

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US4343833A (en) * 1979-06-26 1982-08-10 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing thermal head
DE3321900C2 (de) * 1982-06-16 1986-01-16 Nitto Electric Industrial Co., Ltd., Ibaraki, Osaka Substrat für eine Schaltung mit einer Widerstandsschicht und Verfahren zu dessen Herstellung
JPS5916084A (ja) * 1982-07-19 1984-01-27 Nitto Electric Ind Co Ltd 入力タブレツト
JPS59185801U (ja) * 1983-05-26 1984-12-10 アルプス電気株式会社 チツプ抵抗
US4495524A (en) * 1983-06-21 1985-01-22 Nitto Electric Industrial Co., Ltd. Part for a slide variable resistor
US4503418A (en) * 1983-11-07 1985-03-05 Northern Telecom Limited Thick film resistor
JPS61210601A (ja) * 1985-03-14 1986-09-18 進工業株式会社 チツプ抵抗器
US4724040A (en) * 1986-01-14 1988-02-09 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electric circuits on a base boad
US4792781A (en) * 1986-02-21 1988-12-20 Tdk Corporation Chip-type resistor
US4864130A (en) * 1986-06-04 1989-09-05 Arch Development Corporation Photo ion spectrometer
JPS637693A (ja) * 1986-06-27 1988-01-13 新神戸電機株式会社 抵抗回路付印刷回路板の製造法
DE3708832A1 (de) * 1987-03-18 1988-09-29 Siemens Ag Nasschemische strukturierung von hafniumborid-schichten
JPH0180974U (fr) * 1987-11-20 1989-05-30
EP0330210A3 (fr) * 1988-02-26 1990-11-07 Gould Electronics Inc. Couches métalliques résistantes et leur procédé de fabrication
US5039570A (en) * 1990-04-12 1991-08-13 Planar Circuit Technologies, Inc. Resistive laminate for printed circuit boards, method and apparatus for forming the same
TW208110B (fr) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
JPH0487815U (fr) * 1990-12-03 1992-07-30
KR100223504B1 (ko) * 1992-08-28 1999-10-15 다카노 야스아키 혼성 집적 회로 장치
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
US5690805A (en) * 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US6303181B1 (en) 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
US6710259B2 (en) 1993-05-17 2004-03-23 Electrochemicals, Inc. Printed wiring boards and methods for making them
US6171468B1 (en) 1993-05-17 2001-01-09 Electrochemicals Inc. Direct metallization process
JPH07318872A (ja) * 1994-05-26 1995-12-08 Aoyagi:Kk 多機能眼鏡
JP3316853B2 (ja) * 1995-07-14 2002-08-19 セイコーエプソン株式会社 積層型インクジェット記録ヘッド及びその製造方法並びにこの記録ヘッドを備えたプリンタ
US6015482A (en) * 1997-12-18 2000-01-18 Circuit Research Corp. Printed circuit manufacturing process using tin-nickel plating
US6171921B1 (en) * 1998-06-05 2001-01-09 Motorola, Inc. Method for forming a thick-film resistor and thick-film resistor formed thereby
JP3729308B2 (ja) * 1998-06-09 2005-12-21 ローム株式会社 ライン型加熱装置の構造
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
US6606792B1 (en) 2000-05-25 2003-08-19 Oak-Mitsui, Inc. Process to manufacturing tight tolerance embedded elements for printed circuit boards
US6402970B1 (en) * 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6350386B1 (en) * 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
EP2315510A3 (fr) 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Panneau à circuit muni d'éléments passifs
US20040113127A1 (en) * 2002-12-17 2004-06-17 Min Gary Yonggang Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
US20050176209A1 (en) * 2003-02-14 2005-08-11 Rf Micro Devices, Inc. Embedded passive components
KR100736665B1 (ko) * 2003-06-30 2007-07-06 이비덴 가부시키가이샤 프린트 배선판
JP4342232B2 (ja) * 2003-07-11 2009-10-14 三菱電機株式会社 半導体パワーモジュールおよび該モジュールの主回路電流値を計測する主回路電流計測システム
US8493173B2 (en) * 2011-04-08 2013-07-23 Endicott Interconnect Technologies, Inc. Method of cavity forming on a buried resistor layer using a fusion bonding process
US9633768B2 (en) 2013-06-13 2017-04-25 Rohm Co., Ltd. Chip resistor and mounting structure thereof
US9508474B2 (en) * 2015-01-15 2016-11-29 Shih-Long Wei Method for manufacturing anticorrosive thin film resistor and structure thereof
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
CN107466157A (zh) * 2017-06-20 2017-12-12 深圳崇达多层线路板有限公司 一种埋阻板及使用该埋阻板制作印制线路板的方法
CN107333393A (zh) * 2017-07-19 2017-11-07 深圳崇达多层线路板有限公司 一种埋阻板材的制作方法
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
CN109819582A (zh) * 2017-11-22 2019-05-28 奇酷互联网络科技（深圳）有限公司 电路板、电量监测电路、电路板制作方法及电子设备
JP6810095B2 (ja) * 2018-04-27 2021-01-06 ローム株式会社 チップ抵抗器、チップ抵抗器の実装構造
CN114126187B (zh) * 2020-08-26 2024-05-10 宏恒胜电子科技（淮安）有限公司 具有内埋散热结构的线路板及其制作方法
JP2021044585A (ja) * 2020-12-10 2021-03-18 ローム株式会社 チップ抵抗器

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Publication number Priority date Publication date Assignee Title
GB1002358A (en) * 1961-07-07 1965-08-25 Philco Corp Improvements in and relating to the manufacture of electrical components by coating of metal on to an insulating substrate
US3955068A (en) * 1974-09-27 1976-05-04 Rockwell International Corporation Flexible conductor-resistor composite

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US3256588A (en) * 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
US3287191A (en) * 1963-07-23 1966-11-22 Photo Engravers Res Inc Etching of printed circuit components
US3390992A (en) * 1964-06-15 1968-07-02 North American Rockwell Non-etching circuit fabrication
US3423260A (en) * 1966-03-21 1969-01-21 Bunker Ramo Method of making a thin film circuit having a resistor-conductor pattern
FR1537897A (fr) * 1967-07-19 1968-08-30 Europ Composants Electron Procédé de fabrication de circuits électriques en couches minces
US3458847A (en) * 1967-09-21 1969-07-29 Fairchild Camera Instr Co Thin-film resistors
FR1554767A (fr) * 1967-11-14 1969-01-24
DE1817434C3 (de) * 1967-12-30 1980-05-14 Sony Corp., Tokio Verfahren zur Herstellung einer elektrischen Leitungsanordnung
US3864180A (en) * 1971-07-23 1975-02-04 Litton Systems Inc Process for forming thin-film circuit devices
US3700445A (en) * 1971-07-29 1972-10-24 Us Navy Photoresist processing method for fabricating etched microcircuits
JPS5146904B2 (fr) * 1971-09-30 1976-12-11
US3904461A (en) * 1972-10-02 1975-09-09 Bendix Corp Method of manufacturing solderable thin film microcircuit with stabilized resistive films
US4077854A (en) * 1972-10-02 1978-03-07 The Bendix Corporation Method of manufacture of solderable thin film microcircuit with stabilized resistive films
JPS565075B2 (fr) * 1973-02-06 1981-02-03
JPS49105169A (fr) * 1973-02-13 1974-10-04
FR2290762A1 (fr) * 1974-11-06 1976-06-04 Lignes Telegraph Telephon Procede de realisation de contacts ohmiques pour circuits en couche mince
JPS5181967A (ja) * 1975-01-15 1976-07-17 Nitto Electric Ind Co Kairobanzairyo

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
GB1002358A (en) * 1961-07-07 1965-08-25 Philco Corp Improvements in and relating to the manufacture of electrical components by coating of metal on to an insulating substrate
US3955068A (en) * 1974-09-27 1976-05-04 Rockwell International Corporation Flexible conductor-resistor composite

Also Published As

Publication number Publication date
GB2007917A (en) 1979-05-23
JPS5469768A (en) 1979-06-05
US4204187A (en) 1980-05-20
NL7811195A (nl) 1979-05-16
NL175372B (nl) 1984-05-16
BE871962A (fr) 1979-03-01
GB2007917B (en) 1982-04-15
US4368252A (en) 1983-01-11
DE2847356C2 (de) 1983-02-24
FR2408973B1 (fr) 1981-12-04
DE2847356A1 (de) 1979-05-17
NL175372C (nl) 1984-10-16
JPS5640514B2 (fr) 1981-09-21

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