FR2290762A1 - Procede de realisation de contacts ohmiques pour circuits en couche mince - Google Patents

Procede de realisation de contacts ohmiques pour circuits en couche mince

Info

Publication number
FR2290762A1
FR2290762A1 FR7436805A FR7436805A FR2290762A1 FR 2290762 A1 FR2290762 A1 FR 2290762A1 FR 7436805 A FR7436805 A FR 7436805A FR 7436805 A FR7436805 A FR 7436805A FR 2290762 A1 FR2290762 A1 FR 2290762A1
Authority
FR
France
Prior art keywords
thin layer
ohmic contacts
layer circuits
contacts process
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7436805A
Other languages
English (en)
Other versions
FR2290762B1 (fr
Inventor
Jean Joly
Joly Et Jean Bernard Ranger Jean
Jean Bernard Ranger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR7436805A priority Critical patent/FR2290762A1/fr
Priority to US05/628,846 priority patent/US4025404A/en
Priority to HU75LI282A priority patent/HU173352B/hu
Priority to IT69731/75A priority patent/IT1055658B/it
Priority to DE2549861A priority patent/DE2549861C3/de
Publication of FR2290762A1 publication Critical patent/FR2290762A1/fr
Application granted granted Critical
Publication of FR2290762B1 publication Critical patent/FR2290762B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Contacts (AREA)
  • Physical Vapour Deposition (AREA)
FR7436805A 1974-11-06 1974-11-06 Procede de realisation de contacts ohmiques pour circuits en couche mince Granted FR2290762A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7436805A FR2290762A1 (fr) 1974-11-06 1974-11-06 Procede de realisation de contacts ohmiques pour circuits en couche mince
US05/628,846 US4025404A (en) 1974-11-06 1975-11-04 Ohmic contacts to thin film circuits
HU75LI282A HU173352B (hu) 1974-11-06 1975-11-05 Sposob poluchenija omicheskikh kontaktorov tonkopljonochnykh ehlektroskhem
IT69731/75A IT1055658B (it) 1974-11-06 1975-11-05 Procedimento per la formazione di contatti ohmici su circuiti a strto sottile
DE2549861A DE2549861C3 (de) 1974-11-06 1975-11-06 Verfahren zur Anbringung von lokalisierten Kontakten auf einer Dünnschichtschaltung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7436805A FR2290762A1 (fr) 1974-11-06 1974-11-06 Procede de realisation de contacts ohmiques pour circuits en couche mince

Publications (2)

Publication Number Publication Date
FR2290762A1 true FR2290762A1 (fr) 1976-06-04
FR2290762B1 FR2290762B1 (fr) 1977-03-18

Family

ID=9144715

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7436805A Granted FR2290762A1 (fr) 1974-11-06 1974-11-06 Procede de realisation de contacts ohmiques pour circuits en couche mince

Country Status (5)

Country Link
US (1) US4025404A (fr)
DE (1) DE2549861C3 (fr)
FR (1) FR2290762A1 (fr)
HU (1) HU173352B (fr)
IT (1) IT1055658B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2376592A1 (fr) * 1976-12-28 1978-07-28 Selenia Ind Elettroniche Procede pour obtenir des elements conducteurs et des elements resistifs dans les microcircuits pour hyperfrequences
FR2472272A1 (fr) * 1979-12-21 1981-06-26 Lignes Telegraph Telephon Composant hybride de protection et circuit l'incorporant
EP0075706A2 (fr) * 1981-09-26 1983-04-06 VDO Adolf Schindling AG Cellule d'affichage électro-optique et procédé de fabrication de cellules d'affichage électro-optiques

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4104607A (en) * 1977-03-14 1978-08-01 The United States Of America As Represented By The Secretary Of The Navy Zero temperature coefficient of resistance bi-film resistor
US4082568A (en) * 1977-05-10 1978-04-04 Joseph Lindmayer Solar cell with multiple-metal contacts
JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
DE3029277C2 (de) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Aufbau von Metallschichten
US4403397A (en) * 1981-07-13 1983-09-13 The United States Of America As Represented By The Secretary Of The Navy Method of making avalanche photodiodes
DE3605425A1 (de) * 1986-02-20 1987-08-27 Standard Elektrik Lorenz Ag Duennschichtschaltung und ein verfahren zu ihrer herstellung
US4866505A (en) * 1986-03-19 1989-09-12 Analog Devices, Inc. Aluminum-backed wafer and chip
CH675323A5 (fr) * 1987-12-24 1990-09-14 Contraves Ag
US4905371A (en) * 1988-08-26 1990-03-06 Control Data Corporation Method for cleaning process control
TW202125541A (zh) * 2019-12-18 2021-07-01 光頡科技股份有限公司 薄膜電阻元件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460241A (en) * 1967-06-21 1969-08-12 Bendix Corp Method of counting semiconductor devices on thick film circuits
FR2050576A6 (en) * 1968-07-04 1971-04-02 Radiotechnique Compelec Depositing gold on substrates for microcir- - cuit connection elements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370262A (en) * 1963-05-27 1968-02-20 Sprague Electric Co Electrical resistor
US3616406A (en) * 1969-11-03 1971-10-26 Bell Telephone Labor Inc Preparation of glue layer for bonding gold to a substrate
FR2112667A5 (fr) * 1970-11-05 1972-06-23 Lignes Telegraph Telephon
US3864180A (en) * 1971-07-23 1975-02-04 Litton Systems Inc Process for forming thin-film circuit devices
US3907620A (en) * 1973-06-27 1975-09-23 Hewlett Packard Co A process of forming metallization structures on semiconductor devices
US3921200A (en) * 1974-04-15 1975-11-18 Motorola Inc Composite beam lead metallization

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460241A (en) * 1967-06-21 1969-08-12 Bendix Corp Method of counting semiconductor devices on thick film circuits
FR2050576A6 (en) * 1968-07-04 1971-04-02 Radiotechnique Compelec Depositing gold on substrates for microcir- - cuit connection elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2376592A1 (fr) * 1976-12-28 1978-07-28 Selenia Ind Elettroniche Procede pour obtenir des elements conducteurs et des elements resistifs dans les microcircuits pour hyperfrequences
FR2472272A1 (fr) * 1979-12-21 1981-06-26 Lignes Telegraph Telephon Composant hybride de protection et circuit l'incorporant
EP0075706A2 (fr) * 1981-09-26 1983-04-06 VDO Adolf Schindling AG Cellule d'affichage électro-optique et procédé de fabrication de cellules d'affichage électro-optiques
EP0075706A3 (en) * 1981-09-26 1984-10-03 Vdo Adolf Schindling Ag Electro-optical display element and method of manufacturing electro-optical display elements

Also Published As

Publication number Publication date
DE2549861C3 (de) 1979-04-05
HU173352B (hu) 1979-04-28
DE2549861A1 (de) 1976-05-13
US4025404A (en) 1977-05-24
DE2549861B2 (de) 1977-10-20
IT1055658B (it) 1982-01-11
FR2290762B1 (fr) 1977-03-18

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Legal Events

Date Code Title Description
ST Notification of lapse