BE782119A - Procede de fabrication de circuits en couche mince - Google Patents

Procede de fabrication de circuits en couche mince

Info

Publication number
BE782119A
BE782119A BE782119A BE782119A BE782119A BE 782119 A BE782119 A BE 782119A BE 782119 A BE782119 A BE 782119A BE 782119 A BE782119 A BE 782119A BE 782119 A BE782119 A BE 782119A
Authority
BE
Belgium
Prior art keywords
manufacturing process
thin layer
layer circuits
circuits manufacturing
thin
Prior art date
Application number
BE782119A
Other languages
English (en)
Inventor
R C Sundahl
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE782119A publication Critical patent/BE782119A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
BE782119A 1971-04-16 1972-04-14 Procede de fabrication de circuits en couche mince BE782119A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13466571A 1971-04-16 1971-04-16

Publications (1)

Publication Number Publication Date
BE782119A true BE782119A (fr) 1972-07-31

Family

ID=22464389

Family Applications (1)

Application Number Title Priority Date Filing Date
BE782119A BE782119A (fr) 1971-04-16 1972-04-14 Procede de fabrication de circuits en couche mince

Country Status (11)

Country Link
US (1) US3791861A (fr)
JP (1) JPS5143570B1 (fr)
BE (1) BE782119A (fr)
CA (1) CA929280A (fr)
CH (1) CH584960A5 (fr)
DE (1) DE2217573C3 (fr)
FR (1) FR2133777B1 (fr)
GB (1) GB1389326A (fr)
IT (1) IT954427B (fr)
NL (1) NL7205052A (fr)
SE (1) SE378972B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727364A1 (de) * 1977-06-16 1979-01-04 Siemens Ag Verfahren zur herstellung von keramiksubstraten
US5011568A (en) * 1990-06-11 1991-04-30 Iowa State University Research Foundation, Inc. Use of sol-gel derived tantalum oxide as a protective coating for etching silicon
US5425909A (en) * 1992-07-20 1995-06-20 Industrial Technology Research Institute Heat treatment for particle reinforced alumina ceramic composite
US5856235A (en) * 1995-04-12 1999-01-05 Northrop Grumman Corporation Process of vacuum annealing a thin film metallization on high purity alumina
US5691004A (en) * 1996-07-11 1997-11-25 Ford Global Technologies, Inc. Method of treating light metal cylinder bore walls to receive thermal sprayed metal coatings
JPH10167859A (ja) * 1996-12-05 1998-06-23 Ngk Insulators Ltd セラミックス部品およびその製造方法
US6641939B1 (en) 1998-07-01 2003-11-04 The Morgan Crucible Company Plc Transition metal oxide doped alumina and methods of making and using
KR102105639B1 (ko) * 2019-03-28 2020-04-28 주식회사 엘지화학 면역 검사 장치 및 면역 검사 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2885310A (en) * 1954-09-13 1959-05-05 Ohmite Mfg Company Method and apparatus for making film resistors
US2901381A (en) * 1956-10-12 1959-08-25 Bell Telephone Labor Inc Method of making electrical resistors
US3032397A (en) * 1957-01-25 1962-05-01 Du Pont Preparation of metal nitride pigment flakes
US3212918A (en) * 1962-05-28 1965-10-19 Ibm Electroless plating process
GB1247007A (en) * 1968-04-04 1971-09-22 Atomic Energy Authority Uk Improvements in or relating to electroless plating processes
JPS502607B1 (fr) * 1968-08-10 1975-01-28

Also Published As

Publication number Publication date
FR2133777B1 (fr) 1974-12-20
US3791861A (en) 1974-02-12
DE2217573B2 (de) 1974-02-14
NL7205052A (fr) 1972-10-18
GB1389326A (en) 1975-04-03
JPS4743969A (fr) 1972-12-20
JPS5143570B1 (fr) 1976-11-22
DE2217573A1 (de) 1972-11-02
CH584960A5 (fr) 1977-02-15
CA929280A (en) 1973-06-26
FR2133777A1 (fr) 1972-12-01
SE378972B (fr) 1975-09-15
DE2217573C3 (de) 1978-03-09
IT954427B (it) 1973-08-30

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