FR2050576A6 - Depositing gold on substrates for microcir- - cuit connection elements - Google Patents

Depositing gold on substrates for microcir- - cuit connection elements

Info

Publication number
FR2050576A6
FR2050576A6 FR6920260A FR6920260A FR2050576A6 FR 2050576 A6 FR2050576 A6 FR 2050576A6 FR 6920260 A FR6920260 A FR 6920260A FR 6920260 A FR6920260 A FR 6920260A FR 2050576 A6 FR2050576 A6 FR 2050576A6
Authority
FR
France
Prior art keywords
connection elements
microcir
substrates
depositing gold
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6920260A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR176748A external-priority patent/FR95328E/en
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR6920260A priority Critical patent/FR2050576A6/en
Priority to FR7018477A priority patent/FR2093010A6/en
Application granted granted Critical
Publication of FR2050576A6 publication Critical patent/FR2050576A6/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Contacts (AREA)

Abstract

Au connection elements for microcircuits in which the gold ribbon of which they are made consists of two superimposed layers. The first which firmly adheres to the substrate consists of an alloy containing a high proportion of Au and a small proportion of another metal which is produced by an electronic discharge between two electrodes in a rarified inert gas atmosphere containing a small proportion of oxygen. The second layer of pure Au is obtained by electrolysis of an Au salt. The layers are selectively deposited on the substrate to obtain the desired connections.
FR6920260A 1968-07-04 1969-06-18 Depositing gold on substrates for microcir- - cuit connection elements Expired FR2050576A6 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR6920260A FR2050576A6 (en) 1968-07-04 1969-06-18 Depositing gold on substrates for microcir- - cuit connection elements
FR7018477A FR2093010A6 (en) 1968-07-04 1970-05-21 Miniature capacitors of sputtered gold on mica - with nickel or cobal oxide to improve adherence

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR157807 1968-07-04
FR176748A FR95328E (en) 1968-07-04 1968-12-05 Method of depositing a thin layer of gold on a substrate.
FR6920260A FR2050576A6 (en) 1968-07-04 1969-06-18 Depositing gold on substrates for microcir- - cuit connection elements

Publications (1)

Publication Number Publication Date
FR2050576A6 true FR2050576A6 (en) 1971-04-02

Family

ID=34222001

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6920260A Expired FR2050576A6 (en) 1968-07-04 1969-06-18 Depositing gold on substrates for microcir- - cuit connection elements

Country Status (1)

Country Link
FR (1) FR2050576A6 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2290762A1 (en) * 1974-11-06 1976-06-04 Lignes Telegraph Telephon OHMIC CONTACTS PROCESS FOR THIN LAYER CIRCUITS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2290762A1 (en) * 1974-11-06 1976-06-04 Lignes Telegraph Telephon OHMIC CONTACTS PROCESS FOR THIN LAYER CIRCUITS

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