DE2705503C3 - Halbleiterspeicheranordnung - Google Patents
HalbleiterspeicheranordnungInfo
- Publication number
- DE2705503C3 DE2705503C3 DE2705503A DE2705503A DE2705503C3 DE 2705503 C3 DE2705503 C3 DE 2705503C3 DE 2705503 A DE2705503 A DE 2705503A DE 2705503 A DE2705503 A DE 2705503A DE 2705503 C3 DE2705503 C3 DE 2705503C3
- Authority
- DE
- Germany
- Prior art keywords
- layer
- electrode
- capacitors
- transistor
- semiconductor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
- H10D84/813—Combinations of field-effect devices and capacitor only
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE7601416,A NL173572C (nl) | 1976-02-12 | 1976-02-12 | Halfgeleiderinrichting. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2705503A1 DE2705503A1 (de) | 1977-08-18 |
| DE2705503B2 DE2705503B2 (de) | 1980-05-22 |
| DE2705503C3 true DE2705503C3 (de) | 1981-01-29 |
Family
ID=19825610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2705503A Expired DE2705503C3 (de) | 1976-02-12 | 1977-02-10 | Halbleiterspeicheranordnung |
Country Status (11)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004038528A1 (de) * | 2004-08-07 | 2006-03-16 | Atmel Germany Gmbh | Halbleiterstruktur |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2720533A1 (de) * | 1977-05-06 | 1978-11-09 | Siemens Ag | Monolithisch integrierte schaltungsanordnung mit ein-transistor- speicherelementen |
| US4475118A (en) * | 1978-12-21 | 1984-10-02 | National Semiconductor Corporation | Dynamic MOS RAM with storage cells having a mainly insulated first plate |
| US5109258A (en) * | 1980-05-07 | 1992-04-28 | Texas Instruments Incorporated | Memory cell made by selective oxidation of polysilicon |
| US5357131A (en) * | 1982-03-10 | 1994-10-18 | Hitachi, Ltd. | Semiconductor memory with trench capacitor |
| US4649406A (en) * | 1982-12-20 | 1987-03-10 | Fujitsu Limited | Semiconductor memory device having stacked capacitor-type memory cells |
| JPH073862B2 (ja) * | 1983-07-27 | 1995-01-18 | 株式会社日立製作所 | 半導体記憶装置 |
| JPH0682783B2 (ja) * | 1985-03-29 | 1994-10-19 | 三菱電機株式会社 | 容量およびその製造方法 |
| CN1034533C (zh) * | 1985-05-01 | 1997-04-09 | 得克萨斯仪器公司 | 超大规模集成电路静态随机存储器 |
| US4685197A (en) * | 1986-01-07 | 1987-08-11 | Texas Instruments Incorporated | Fabricating a stacked capacitor |
| JPS63146461A (ja) * | 1986-12-10 | 1988-06-18 | Mitsubishi Electric Corp | 半導体記憶装置 |
| JPS63198323A (ja) * | 1987-02-13 | 1988-08-17 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JPH0294471A (ja) * | 1988-09-30 | 1990-04-05 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
| US4864464A (en) * | 1989-01-09 | 1989-09-05 | Micron Technology, Inc. | Low-profile, folded-plate dram-cell capacitor fabricated with two mask steps |
| US5194752A (en) * | 1989-05-23 | 1993-03-16 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| DE69126925T2 (de) * | 1990-05-31 | 1997-11-20 | Canon Kk | Verfahren zur Herstellung einer Halbleiterspeicheranordnung mit Kondensator |
| US5036020A (en) * | 1990-08-31 | 1991-07-30 | Texas Instrument Incorporated | Method of fabricating microelectronic device incorporating capacitor having lowered topographical profile |
| JPH05136363A (ja) * | 1991-11-15 | 1993-06-01 | Sharp Corp | 半導体記憶装置 |
| JPH0745717A (ja) * | 1993-07-29 | 1995-02-14 | Oki Electric Ind Co Ltd | 半導体メモリ装置及びその製造方法 |
| US5712813A (en) * | 1996-10-17 | 1998-01-27 | Zhang; Guobiao | Multi-level storage capacitor structure with improved memory density |
| EP0893831A1 (en) * | 1997-07-23 | 1999-01-27 | STMicroelectronics S.r.l. | High voltage capacitor |
| US6420746B1 (en) * | 1998-10-29 | 2002-07-16 | International Business Machines Corporation | Three device DRAM cell with integrated capacitor and local interconnect |
| US8188786B2 (en) * | 2009-09-24 | 2012-05-29 | International Business Machines Corporation | Modularized three-dimensional capacitor array |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3893146A (en) * | 1973-12-26 | 1975-07-01 | Teletype Corp | Semiconductor capacitor structure and memory cell, and method of making |
| JPS5812457Y2 (ja) * | 1975-12-31 | 1983-03-09 | 富士通株式会社 | ハンドウタイキオクソウチ |
| JPS5853512B2 (ja) * | 1976-02-13 | 1983-11-29 | 株式会社東芝 | 半導体記憶装置の製造方法 |
| DE2720533A1 (de) * | 1977-05-06 | 1978-11-09 | Siemens Ag | Monolithisch integrierte schaltungsanordnung mit ein-transistor- speicherelementen |
-
1976
- 1976-02-12 NL NLAANVRAGE7601416,A patent/NL173572C/xx not_active IP Right Cessation
-
1977
- 1977-01-17 AU AU21370/77A patent/AU504719B2/en not_active Expired
- 1977-02-02 CA CA270,915A patent/CA1096499A/en not_active Expired
- 1977-02-09 JP JP52012566A patent/JPS5810865B2/ja not_active Expired
- 1977-02-09 SE SE7701434A patent/SE409380B/xx not_active IP Right Cessation
- 1977-02-09 CH CH159077A patent/CH612783A5/xx not_active IP Right Cessation
- 1977-02-09 SE SE7701434D patent/SE7701434L/xx not_active Application Discontinuation
- 1977-02-09 GB GB5296/77A patent/GB1535615A/en not_active Expired
- 1977-02-09 IT IT20122/77A patent/IT1077625B/it active
- 1977-02-10 DE DE2705503A patent/DE2705503C3/de not_active Expired
- 1977-02-11 FR FR7703840A patent/FR2341177A1/fr active Granted
-
1980
- 1980-06-12 US US06/158,958 patent/US4460911A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004038528A1 (de) * | 2004-08-07 | 2006-03-16 | Atmel Germany Gmbh | Halbleiterstruktur |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2705503B2 (de) | 1980-05-22 |
| JPS5298483A (en) | 1977-08-18 |
| AU2137077A (en) | 1978-07-27 |
| NL173572C (nl) | 1984-02-01 |
| CH612783A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-08-15 |
| US4460911A (en) | 1984-07-17 |
| SE409380B (sv) | 1979-08-13 |
| DE2705503A1 (de) | 1977-08-18 |
| AU504719B2 (en) | 1979-10-25 |
| FR2341177B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-03-26 |
| NL173572B (nl) | 1983-09-01 |
| FR2341177A1 (fr) | 1977-09-09 |
| CA1096499A (en) | 1981-02-24 |
| IT1077625B (it) | 1985-05-04 |
| NL7601416A (nl) | 1977-08-16 |
| JPS5810865B2 (ja) | 1983-02-28 |
| SE7701434L (sv) | 1977-08-13 |
| GB1535615A (en) | 1978-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |