DE2631810C3 - Planares Halbleiterbauelement - Google Patents

Planares Halbleiterbauelement

Info

Publication number
DE2631810C3
DE2631810C3 DE2631810A DE2631810A DE2631810C3 DE 2631810 C3 DE2631810 C3 DE 2631810C3 DE 2631810 A DE2631810 A DE 2631810A DE 2631810 A DE2631810 A DE 2631810A DE 2631810 C3 DE2631810 C3 DE 2631810C3
Authority
DE
Germany
Prior art keywords
contact
contacting
planar
thermocompression
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2631810A
Other languages
German (de)
English (en)
Other versions
DE2631810B2 (de
DE2631810A1 (de
Inventor
Bernd 7844 Neuenburg Kelpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
Deutsche ITT Industries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH filed Critical Deutsche ITT Industries GmbH
Priority to DE2631810A priority Critical patent/DE2631810C3/de
Priority to JP52068051A priority patent/JPS6043664B2/ja
Priority to GB28068/77A priority patent/GB1535656A/en
Priority to NLAANVRAGE7707719,A priority patent/NL183000C/xx
Priority to ES460687A priority patent/ES460687A1/es
Priority to FR7721929A priority patent/FR2358749A1/fr
Publication of DE2631810A1 publication Critical patent/DE2631810A1/de
Publication of DE2631810B2 publication Critical patent/DE2631810B2/de
Application granted granted Critical
Publication of DE2631810C3 publication Critical patent/DE2631810C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
DE2631810A 1976-07-15 1976-07-15 Planares Halbleiterbauelement Expired DE2631810C3 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE2631810A DE2631810C3 (de) 1976-07-15 1976-07-15 Planares Halbleiterbauelement
JP52068051A JPS6043664B2 (ja) 1976-07-15 1977-06-10 半導体装置
GB28068/77A GB1535656A (en) 1976-07-15 1977-07-05 Planar semiconductor device
NLAANVRAGE7707719,A NL183000C (nl) 1976-07-15 1977-07-12 Planaire halfgeleiderinrichting voorzien van een in deelcontactvlakken verdeeld contactvlak voor een nagelkopverbinding met een draadvormige geleider.
ES460687A ES460687A1 (es) 1976-07-15 1977-07-13 Un semiconductor planar perfeccionado.
FR7721929A FR2358749A1 (fr) 1976-07-15 1977-07-18 Dispositif semi-conducteur planaire a surfaces de contact discontinues

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2631810A DE2631810C3 (de) 1976-07-15 1976-07-15 Planares Halbleiterbauelement

Publications (3)

Publication Number Publication Date
DE2631810A1 DE2631810A1 (de) 1978-01-19
DE2631810B2 DE2631810B2 (de) 1978-07-06
DE2631810C3 true DE2631810C3 (de) 1979-03-15

Family

ID=5983078

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2631810A Expired DE2631810C3 (de) 1976-07-15 1976-07-15 Planares Halbleiterbauelement

Country Status (6)

Country Link
JP (1) JPS6043664B2 (oth)
DE (1) DE2631810C3 (oth)
ES (1) ES460687A1 (oth)
FR (1) FR2358749A1 (oth)
GB (1) GB1535656A (oth)
NL (1) NL183000C (oth)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649557A (en) * 1979-09-28 1981-05-06 Toshiba Corp Integrated circuit for high-frequency oscillation circuit
DE2945670C2 (de) * 1979-11-12 1982-02-11 Siemens AG, 1000 Berlin und 8000 München Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlußpunkten
DE3115856A1 (de) * 1980-04-22 1982-01-21 Ferranti Ltd., Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
JPS57181135A (en) * 1981-04-30 1982-11-08 Nec Home Electronics Ltd Semiconductor device
JPS59144936U (ja) * 1983-03-17 1984-09-27 オムロン株式会社 近接スイツチ
JPS6138935U (ja) * 1984-08-08 1986-03-11 日本電気株式会社 集積回路装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450965A (en) * 1966-05-28 1969-06-17 Sony Corp Semiconductor having reinforced lead structure
GB1277333A (en) * 1969-07-31 1972-06-14 Gen Motors Corp Semiconductor devices
DE2534477C3 (de) * 1975-08-01 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kapazitätsarmer Kontaktierungsfleck

Also Published As

Publication number Publication date
NL183000C (nl) 1988-06-16
FR2358749A1 (fr) 1978-02-10
DE2631810B2 (de) 1978-07-06
JPS6043664B2 (ja) 1985-09-30
ES460687A1 (es) 1978-06-16
JPS5310267A (en) 1978-01-30
GB1535656A (en) 1978-12-13
NL7707719A (nl) 1978-01-17
NL183000B (nl) 1988-01-18
DE2631810A1 (de) 1978-01-19
FR2358749B1 (oth) 1984-01-27

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee