FR2358749A1 - Dispositif semi-conducteur planaire a surfaces de contact discontinues - Google Patents

Dispositif semi-conducteur planaire a surfaces de contact discontinues

Info

Publication number
FR2358749A1
FR2358749A1 FR7721929A FR7721929A FR2358749A1 FR 2358749 A1 FR2358749 A1 FR 2358749A1 FR 7721929 A FR7721929 A FR 7721929A FR 7721929 A FR7721929 A FR 7721929A FR 2358749 A1 FR2358749 A1 FR 2358749A1
Authority
FR
France
Prior art keywords
contact surfaces
points
semiconductor device
contact
planar semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7721929A
Other languages
English (en)
French (fr)
Other versions
FR2358749B1 (oth
Inventor
Bernd Kelpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2358749A1 publication Critical patent/FR2358749A1/fr
Application granted granted Critical
Publication of FR2358749B1 publication Critical patent/FR2358749B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
FR7721929A 1976-07-15 1977-07-18 Dispositif semi-conducteur planaire a surfaces de contact discontinues Granted FR2358749A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2631810A DE2631810C3 (de) 1976-07-15 1976-07-15 Planares Halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2358749A1 true FR2358749A1 (fr) 1978-02-10
FR2358749B1 FR2358749B1 (oth) 1984-01-27

Family

ID=5983078

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7721929A Granted FR2358749A1 (fr) 1976-07-15 1977-07-18 Dispositif semi-conducteur planaire a surfaces de contact discontinues

Country Status (6)

Country Link
JP (1) JPS6043664B2 (oth)
DE (1) DE2631810C3 (oth)
ES (1) ES460687A1 (oth)
FR (1) FR2358749A1 (oth)
GB (1) GB1535656A (oth)
NL (1) NL183000C (oth)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028823A1 (de) * 1979-11-12 1981-05-20 Siemens Aktiengesellschaft Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlusspunkten
FR2481006A1 (fr) * 1980-04-22 1981-10-23 Ferranti Ltd Ensemble de circuit electrique a couche mince

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649557A (en) * 1979-09-28 1981-05-06 Toshiba Corp Integrated circuit for high-frequency oscillation circuit
JPS57181135A (en) * 1981-04-30 1982-11-08 Nec Home Electronics Ltd Semiconductor device
JPS59144936U (ja) * 1983-03-17 1984-09-27 オムロン株式会社 近接スイツチ
JPS6138935U (ja) * 1984-08-08 1986-03-11 日本電気株式会社 集積回路装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2038283A1 (de) * 1969-07-31 1971-03-04 Gen Motors Corp Halbleiter-Bauelement
GB1231042A (oth) * 1966-05-28 1971-05-05
FR2319975A1 (fr) * 1975-08-01 1977-02-25 Siemens Ag Plage de contact a faible capacite, notamment pour un composant a semi-conducteurs

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1231042A (oth) * 1966-05-28 1971-05-05
DE2038283A1 (de) * 1969-07-31 1971-03-04 Gen Motors Corp Halbleiter-Bauelement
FR2319975A1 (fr) * 1975-08-01 1977-02-25 Siemens Ag Plage de contact a faible capacite, notamment pour un composant a semi-conducteurs

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0028823A1 (de) * 1979-11-12 1981-05-20 Siemens Aktiengesellschaft Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlusspunkten
FR2481006A1 (fr) * 1980-04-22 1981-10-23 Ferranti Ltd Ensemble de circuit electrique a couche mince

Also Published As

Publication number Publication date
NL183000C (nl) 1988-06-16
DE2631810B2 (de) 1978-07-06
DE2631810C3 (de) 1979-03-15
JPS6043664B2 (ja) 1985-09-30
ES460687A1 (es) 1978-06-16
JPS5310267A (en) 1978-01-30
GB1535656A (en) 1978-12-13
NL7707719A (nl) 1978-01-17
NL183000B (nl) 1988-01-18
DE2631810A1 (de) 1978-01-19
FR2358749B1 (oth) 1984-01-27

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Legal Events

Date Code Title Description
ST Notification of lapse