DE2621952C2 - Vorrichtung zum Entplattieren und Reinigen von Plättchen oder Substraten - Google Patents

Vorrichtung zum Entplattieren und Reinigen von Plättchen oder Substraten

Info

Publication number
DE2621952C2
DE2621952C2 DE2621952A DE2621952A DE2621952C2 DE 2621952 C2 DE2621952 C2 DE 2621952C2 DE 2621952 A DE2621952 A DE 2621952A DE 2621952 A DE2621952 A DE 2621952A DE 2621952 C2 DE2621952 C2 DE 2621952C2
Authority
DE
Germany
Prior art keywords
spray
tank
turntable
water
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2621952A
Other languages
German (de)
English (en)
Other versions
DE2621952A1 (de
Inventor
Robert Stephen Chanhassen Minn. Blackwood
Joel Adelbert Minneapolis Minn. Elftmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluoroware Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of DE2621952A1 publication Critical patent/DE2621952A1/de
Application granted granted Critical
Publication of DE2621952C2 publication Critical patent/DE2621952C2/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE2621952A 1975-05-19 1976-05-18 Vorrichtung zum Entplattieren und Reinigen von Plättchen oder Substraten Expired DE2621952C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/578,735 US3990462A (en) 1975-05-19 1975-05-19 Substrate stripping and cleaning apparatus

Publications (2)

Publication Number Publication Date
DE2621952A1 DE2621952A1 (de) 1976-12-09
DE2621952C2 true DE2621952C2 (de) 1982-05-19

Family

ID=24314084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2621952A Expired DE2621952C2 (de) 1975-05-19 1976-05-18 Vorrichtung zum Entplattieren und Reinigen von Plättchen oder Substraten

Country Status (3)

Country Link
US (1) US3990462A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS51141365A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2621952C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3600716A1 (de) * 1985-05-20 1986-11-20 Machine Technology, Inc., Parsippany, N.J. Reinigungsverfahren und -vorrichtung zur durchfuehrung desselben
DE4020174A1 (de) * 1989-07-14 1991-01-24 Yamaha Motor Co Ltd Verfahren und einrichtung zur chemischen oberflaechenbehandlung

Families Citing this family (71)

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US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
FR2516408B1 (fr) * 1981-11-19 1985-07-26 Dassault Electronique Machine a laver les circuits electroniques
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
US4458704A (en) * 1982-10-29 1984-07-10 Xertronix, Inc. Apparatus for processing semiconductor wafers
US4735220A (en) * 1983-04-13 1988-04-05 Chandler Don G Turntable having superstructure for holding wafer baskets
US4982753A (en) * 1983-07-26 1991-01-08 National Semiconductor Corporation Wafer etching, cleaning and stripping apparatus
US4801335A (en) * 1984-07-02 1989-01-31 Fsi Corporation Rinsing in acid processing of substrates
US4682615A (en) * 1984-07-02 1987-07-28 Fsi Corporation Rinsing in acid processing of substrates
US4691722A (en) * 1984-08-01 1987-09-08 Fsi Corporation Bowl for liquid spray processing machine
JPS61251135A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 自動現像装置
US4695327A (en) * 1985-06-13 1987-09-22 Purusar Corporation Surface treatment to remove impurities in microrecesses
US4664133A (en) * 1985-07-26 1987-05-12 Fsi Corporation Wafer processing machine
US4682614A (en) * 1985-07-26 1987-07-28 Fsi Corporation Wafer processing machine
US4745422A (en) * 1985-11-18 1988-05-17 Kabushiki Kaisha Toshiba Automatic developing apparatus
US4777732A (en) 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US5022419A (en) * 1987-04-27 1991-06-11 Semitool, Inc. Rinser dryer system
WO1989000895A1 (en) * 1987-07-29 1989-02-09 Purusar Corporation Surface treatment to remove impurities in microrecesses
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5069236A (en) * 1990-03-07 1991-12-03 Pathway Systems, Inc. Method and apparatus for cleaning disks
US5107880A (en) * 1990-03-07 1992-04-28 Pathway Systems, Inc. Disk cleaning apparatus
US5087323A (en) * 1990-07-12 1992-02-11 Idaho Research Foundation, Inc. Fine line pattern formation by aerosol centrifuge etching technique
DE9013668U1 (de) * 1990-09-29 1992-01-30 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung für die Halbleitertechnik
US5089084A (en) * 1990-12-03 1992-02-18 Micron Technology, Inc. Hydrofluoric acid etcher and cascade rinser
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
US5316035A (en) * 1993-02-19 1994-05-31 Fluoroware, Inc. Capacitive proximity monitoring device for corrosive atmosphere environment
JP3415670B2 (ja) * 1994-03-03 2003-06-09 三菱電機株式会社 ウエハ洗浄装置
DE4414560A1 (de) * 1994-04-18 1995-10-19 Peter Semmler & Co Ohg Verfahren und Vorrichtung zum Zerstäuben und flächigen oder partiellen Auftragen von Flüssigkeiten
FR2724333B1 (fr) * 1994-09-14 1996-12-20 Eco Filtration Procede de traitement d'objets par projection d'un agent actif liquide et installation correspondante
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
JPH11510219A (ja) * 1995-12-19 1999-09-07 エフエスアイ インターナショナル インコーポレイテッド スプレー・プロセッサを用いる金属膜の無電解めっき
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
US5861064A (en) * 1997-03-17 1999-01-19 Fsi Int Inc Process for enhanced photoresist removal in conjunction with various methods and chemistries
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6904920B2 (en) * 1998-07-10 2005-06-14 Semitool, Inc. Method and apparatus for cleaning containers
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6548411B2 (en) * 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6340395B1 (en) * 2000-01-18 2002-01-22 Advanced Micro Devices, Inc. Salsa clean process
JP4007766B2 (ja) * 2000-02-29 2007-11-14 東京エレクトロン株式会社 液処理装置および液処理方法
KR100360402B1 (ko) * 2000-03-22 2002-11-13 삼성전자 주식회사 회전성 분사노즐을 구비하는 웨이퍼 건조 장치 및 이를이용한 웨이퍼 건조 방법
US6418945B1 (en) * 2000-07-07 2002-07-16 Semitool, Inc. Dual cassette centrifugal processor
JP3662484B2 (ja) * 2000-08-09 2005-06-22 エム・エフエスアイ株式会社 ウェット処理方法及びウェット処理装置
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6705331B2 (en) * 2000-11-20 2004-03-16 Dainippon Screen Mfg., Co., Ltd. Substrate cleaning apparatus
US20020139400A1 (en) * 2001-03-27 2002-10-03 Semitool, Inc. Vertical process reactor
JP3713447B2 (ja) * 2001-04-05 2005-11-09 東京エレクトロン株式会社 現像処理装置
US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
CN1267210C (zh) * 2001-10-09 2006-08-02 松下电器产业株式会社 薄膜的剥离方法，薄膜的剥离装置以及显示装置面板的制造方法
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
JP4017463B2 (ja) * 2002-07-11 2007-12-05 株式会社荏原製作所 洗浄方法
US7326305B2 (en) * 2004-01-30 2008-02-05 Intersil Americas, Inc. System and method for decapsulating an encapsulated object
JP4493649B2 (ja) * 2004-04-02 2010-06-30 東京エレクトロン株式会社 基板処理装置、基板処理方法、記録媒体およびソフトウエア
US8544483B2 (en) 2005-04-01 2013-10-01 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
KR101191337B1 (ko) 2006-07-07 2012-10-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체로 마이크로일렉트로닉 워크피스를 처리하는데 사용되는 장치용 배리어 구조물 및 노즐장치
WO2009020524A1 (en) * 2007-08-07 2009-02-12 Fsi International, Inc. Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses
KR20110005699A (ko) 2008-05-09 2011-01-18 에프에스아이 인터내쇼날 인크. 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
CN102041526B (zh) * 2010-11-25 2012-10-31 三门三友冶化技术开发有限公司 阴极板的清洗装置
US20130019904A1 (en) * 2011-07-20 2013-01-24 Illinois Tool Works Inc. Batch cleaning apparatus and method for batch cleaning printed circuit boards
WO2013057209A1 (de) * 2011-10-18 2013-04-25 Mkn Maschinenfabrik Kurt Neubauer Gmbh & Co. Gargerät mit einem tiegel und verfahren zur reinigung des tiegels
US10865914B2 (en) 2017-04-28 2020-12-15 Nibco Inc. High temperature leak prevention for piping components and connections
CN109570111B (zh) * 2018-12-11 2021-06-22 廖斓词 一种改进的护理器械清洗消毒装置
US20240071743A1 (en) * 2022-03-28 2024-02-29 Pallidus, Inc. ELECTROCHEMICAL SYSTEMS AND METHODS FOR FINISHING SiC WAFERS
CN116213337B (zh) * 2022-12-26 2024-05-24 北京长源朗弘科技有限公司 一种油缸缸体加工的清洁装置

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US2003003A (en) * 1931-11-11 1935-05-28 Westinghouse Electric & Mfg Co Dishwasher
US2208646A (en) * 1937-10-15 1940-07-23 Chrysler Corp Coating material recovery process
US2562076A (en) * 1946-02-05 1951-07-24 Weisselberg Arnold Dishwashing machine with impeller coaxial with jet actuated rotary basket
US2515702A (en) * 1946-05-31 1950-07-18 Wallace C Douglass Cleaning apparatus for lamp shades having a rotary support, fluid spray, and drier
DE1503744A1 (de) * 1965-09-01 1969-04-10 Bosch Hausgeraete Gmbh Geschirrspuelmaschine
US3413827A (en) * 1967-04-05 1968-12-03 Borg Warner Jet action for liquid treatment of materials
US3769992A (en) * 1971-12-06 1973-11-06 Fluoroware Inc Spray processing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3600716A1 (de) * 1985-05-20 1986-11-20 Machine Technology, Inc., Parsippany, N.J. Reinigungsverfahren und -vorrichtung zur durchfuehrung desselben
DE4020174A1 (de) * 1989-07-14 1991-01-24 Yamaha Motor Co Ltd Verfahren und einrichtung zur chemischen oberflaechenbehandlung

Also Published As

Publication number Publication date
JPS569026B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-02-26
DE2621952A1 (de) 1976-12-09
JPS51141365A (en) 1976-12-06
US3990462A (en) 1976-11-09

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Legal Events

Date Code Title Description
D2 Grant after examination
8339 Ceased/non-payment of the annual fee